Package and light emitting device

US10490705B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10490705-B2
Application numberUS-201816053803-A
CountryUS
Kind codeB2
Filing dateAug 3, 2018
Priority dateDec 9, 2015
Publication dateNov 26, 2019
Grant dateNov 26, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A package has a bottomed recess with a bottom portion. The package includes: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess. The first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view. The first part has a thickness different from a thickness of the first outer lead portion. A light emitting has: the package; and a light emitting element mounted on at least one of the first electrode and the second electrode of the package.

First claim

Opening claim text (preview).

What is claimed is: 1. A package having a bottomed recess with a bottom portion, comprising: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess, wherein the first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view, the first part having a thickness different from a thickness of the first outer lead portion. 2. A package according to claim 1 , wherein, in plan view, the bottomed recess has: a first outer side; a second outer side adjacent to the first outer side; a third outer side adjacent to the second outer side and opposite to the first outer side; and a fourth outer side adjacent to the first outer side and the third outer side, wherein the first outer lead portion is located at the first outer side, and wherein the second outer lead portion is located at the third outer side. 3. A package according to claim 1 , wherein the first part of the flange portion has a thickness of 1.2 to 2.0 times the thickness of the first outer lead portion. 4. A package according to claim 1 , wherein the first part of the flange portion has a portion having a thickness of 1.2 to 2.0 times the thickness of the first outer lead portion and a portion having a same thickness as the thickness of the first outer lead portion. 5. A package according to claim 1 , wherein the first part of the flange portion has a thickness of 0.5 to 0.8 times the thickness of the first outer lead portion. 6. A package according to claim 1 , wherein the first part of the flange portion has a portion having a thickness of 0.5 to 0.8 times the thickness of the first outer lead portion and a portion having a same thickness as the thickness of the first outer lead portion. 7. A package according to claim 1 , wherein the first part of the flange portion has an approximately same width as a width of the first outer lead portion. 8. A package according to claim 1 , wherein the flange portion further has a second part located adjacent to at least one of both sides of the second outer lead portion in plan view, the second part having a thickness different from a thickness of the second outer lead portion. 9. A package according to claim 2 , wherein the flange portion further has parts respectively located at the second outer side and the fourth outer side. 10. A package according to claim 9 , wherein the part of the flange portion located at the second outer side and the part of the flange portion located at the fourth outer side have an approximately same width. 11. A package according to claim 2 , wherein the second outer side and the fourth outer side are composed of the first resin only. 12. A package according to claim 2 , wherein the first part of the flange portion and the part of the flange portion located at the second outer side have an approximately same width. 13. A package according to claim 1 , wherein the first outer lead portion has a distal end at which a first notch is formed in plan view. 14. A package according to claim 13 , wherein an upper surface and a lower surface of the first outer lead portion, and a side surface of the first notch are plated with a metal. 15. A package according to claim 1 , wherein the part of the first resin located in between the first electrode and the second electrode has a thickness smaller than the thickness of the first electrode. 16. A package according to claim 1 , wherein the part of the first resin located in between the first electrode and the second electrode is recessed inwardly in bottom view. 17. A package according to claim 1 , wherein the first resin is a thermoplastic resin. 18. A light emitting device comprising: a package according to claim 13 ; and a light emitting element mounted on at least one of the first electrode and the second electrode of the package. 19. A light emitting device according to claim 18 , wherein the light emitting element is encapsulated with a second resin. 20. A light-emitting device according to claim 19 , wherein the second resin is transparent.

Assignees

Inventors

Classifications

  • connected to or mounted on a carrier, e.g. lead frame · CPC title

  • Positioning or centering articles in the mould · CPC title

  • with incorporated means for positioning inserts, e.g. labels {(positioning reinforcements B29C70/541)} · CPC title

  • Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor (with compacting pressure B29C43/00 {; by lay-up of reinforcement of substantial or continuous length B29C70/30}) · CPC title

  • Electricity · mapped topic

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What does patent US10490705B2 cover?
A package has a bottomed recess with a bottom portion. The package includes: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess. The first resin has: a p…
Who is the assignee on this patent?
Nichia Corp
What technology area does this patent fall under?
Primary CPC classification H01L33/486. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).