Manufacturing method for semiconductor device

Patent metadata

Field	Value
Publication number	US-10490422-B2
Application number	US-201515738836-A
Country	US
Kind code	B2
Filing date	Oct 6, 2015
Priority date	Oct 6, 2015
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

An object is to provide a technology that reduces the number of components and that is capable of suppressing the cost. A structure including semiconductor elements, a plurality of electrode terminals, and a dam bar for connecting the plurality of electrode terminals is prepared, and a part of the structure including a part of the plurality of electrode terminals and the dam bar is arranged in the terminal hole. Further, the part of the structure is clamped by a movable clamp inside the terminal hole, and at least a portion of the movable clamp is fitted into the terminal hole, and then a resin is injected into an internal space of a pair of molds.

First claim

The invention claimed is:

1. A method of manufacturing a semiconductor device, the method comprising the steps of:
(a) preparing a structure comprising a semiconductor element, a plurality of electrode terminals that are electrically coupled to the semiconductor element and are arrayed, and a dam bar for connecting the plurality of electrode terminals;
(b) arranging a part of the structure comprising a part of the plurality of electrode terminals and the dam bar into a terminal hole being formed in a pair of molds and communicating with an internal space that is capable of being enclosed by the pair of molds, and accommodating a remaining part other than the part of the structure in the internal space of the pair of molds;
(c) clamping the part of the structure with a movable clamp inside the terminal hole, and fitting at least a portion of the movable clamp into the terminal hole from a side opposite to the internal space with respect to the terminal hole; and
(d) injecting a resin into the internal space of the pair of molds after the step (c).

2. The method of manufacturing a semiconductor device according to claim 1 , wherein:
the part of the structure further comprises a protruding portion that is formed in an end of an array of the plurality of electrode terminals and protrudes in an arraying direction of the plurality of electrode terminals; and
the part of the structure is arranged into the terminal hole so that an inner surface of the terminal hole and the protruding portion come close to each other in the step (b).

3. The method of manufacturing a semiconductor device according to claim 1 , wherein the plurality of electrode terminals are connected by a plurality of the dam bars in a plurality of rows.

4. The method of manufacturing a semiconductor device according to claim 1 , wherein a flexible portion having flexibility is formed in a portion of the plurality of electrode terminals on a side of the semiconductor element with respect to a portion that is clamped by the movable clamp.

5. The method of manufacturing a semiconductor device according to claim 2 , wherein an extending portion that extends along the inner surface of the terminal hole is formed in a distal end of the protruding portion in the step (b).

6. The method of manufacturing a semiconductor device according to claim 5 , wherein the extending portion extends toward at least one of a direction from the distal end of the protruding portion toward the semiconductor element and a direction opposite to the direction.

7. The method of manufacturing a semiconductor device according to claim 1 , wherein the terminal hole is formed in one of the pair of molds and opens in a vertical direction with respect to a parting surface of the pair of molds.

8. The method of manufacturing a semiconductor device according to claim 1 , wherein:
a shape of the part of the structure comprises a flat-plate-like shape; and
the movable clamp clamps the part of the structure from both sides in a thickness direction thereof in the step (c).

9. The method of manufacturing a semiconductor device according to claim 1 , wherein a force for fitting the movable clamp into the terminal hole in the step (c) is utilized as a force for clamping the part of the structure with the movable clamp in the step (c).

10. The method of manufacturing a semiconductor device according to claim 1 , wherein a force for clamping the part of the structure with the movable clamp is generated in the step (c) from a force of a pressing machine for making the pair of molds come into contact to each other and separated from each other.

11. The method of manufacturing a semiconductor device according to claim 1 , wherein a pressure of clamping the part of the structure with the movable clamp in the step (c) is larger than a pressure of injecting the resin in the step (d).

12. The method of manufacturing a semiconductor device according to claim 1 , wherein:
in a case where the movable clamp is fitted into the terminal hole in the step (c), a recessed portion is formed, which has an inner surface of the terminal hole where the plurality of electrode terminals are arranged as a lateral portion and a distal end portion of the movable clamp as a bottom portion; and
the resin is injected being in contact with the recessed portion in the step (d).

13. The method of manufacturing a semiconductor device according to claim 1 , wherein:
a plurality of the terminal holes in which a plurality of the parts of the structures are to be respectively arranged are formed in the pair of molds so as to communicate with the internal space;
at least one of a recessed portion and a protruding portion is formed in, out of surfaces of the pair of molds, a surface between two adjacent the terminal holes on a side of the internal space; and
the resin is injected being in contact with the at least one of the recessed portion and the protruding portion in the step (d).

14. A method of manufacturing a semiconductor device, the method comprising the steps of:
(a) preparing a structure comprising a semiconductor element, a plurality of electrode terminals that are electrically coupled to the semiconductor element and are arrayed, and a dam bar for connecting the plurality of electrode terminals;
(b) arranging a part of the structure comprising a part of the plurality of electrode terminals and the dam bar into a terminal hole being formed in a pair of molds and communicating with an internal space that is capable of being enclosed by the pair of molds, and accommodating a remaining part other than the part of the structure in the internal space of the pair of molds;
(c) clamping the part of the structure with a movable clamp inside the terminal hole, and fitting at least a portion of the movable clamp into the terminal hole; and
(d) injecting a resin into the internal space of the pair of molds after the step (c), wherein:
the part of the structure further comprises a protruding portion that is formed in an end of an array of the plurality of electrode terminals and protrudes in an arraying direction of the plurality of electrode terminals; and
the part of the structure is arranged into the terminal hole so that an inner surface of the terminal hole and the protruding portion come close to each other in the step (b), such that a position of an edge of the protruding portion of the structure facing the internal space is approximately in alignment in the arraying direction with a position of an edge of the dam bar facing the internal space.

15. A method of manufacturing a semiconductor device, the method comprising the steps of:
(a) preparing a structure comprising a semiconductor element, a plurality of electrode terminals that are electrically coupled to the semiconductor element and are arrayed, and a dam bar for connecting the plurality of electrode terminals;
(b) arranging a part of the structure comprising a part of the plurality of electrode terminals and the dam bar into a terminal hole being formed in a pair of molds and communicating with an internal space that is capable of being enclosed by the pair of molds, and accommodating a remaining part other than the part of the structure in the internal space of the pair of molds;
(c) clamping the part of the structure with a movable clamp inside the terminal hole, and fitting at least a portion of the movable clamp into the terminal hole; and
(d) injecting a resin into the internal space of the pair of molds after the step (c), wherein:
a shape of the part of the structure comprises a flat-plate-like shape; and
the movable clamp clamps the part of the st

Assignees

• Mitsubishi Electric Corp

Inventors

• Ueda Tetsuya
• Yoshida Hiroshi
• Oka Seiji
• Sakamoto Ken

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• B29L2031/3406

  Components, e.g. resistors · CPC title