Connection body, method for manufacturing connection body, and method for inspecting same
US-2018168044-A1 · Jun 14, 2018 · US
US10488720B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10488720-B2 |
| Application number | US-201715440329-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 23, 2017 |
| Priority date | Mar 7, 2016 |
| Publication date | Nov 26, 2019 |
| Grant date | Nov 26, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A display apparatus includes a display panel, a driving integrated circuit (IC), and an anisotropic conductive film. The display panel includes a non-display area adjacent to a display area and an upper substrate and a lower substrate. The driving IC overlaps the non-display area. The anisotropic conductive film attaches the driving IC to the lower substrate and includes conductive balls with diameters that gradually increase toward the display area.
Opening claim text (preview).
What is claimed is: 1. A display apparatus, comprising: a display panel including a non-display area adjacent to a display area, the display panel including a display substrate; a driving integrated circuit (IC) overlapping the non-display area on a plane and on the display substrate; and an anisotropic conductive film between the display substrate and the driving IC, the anisotropic conductive film attaching the driving IC to the display substrate, wherein: the anisotropic conductive film includes a first conductive ball group and a second conductive ball group, the second conductive ball group being farther away from the display area than the first conductive ball group, the first conductive ball group includes at least a first row and a second row of conductive balls, the second row being closer to the display area than the first row, the conductive balls of the second row having diameters that are larger than diameters of the conductive balls of the first row, the second conductive ball group includes at least a third row and a fourth row of conductive balls, the conductive balls of the third row having diameters that are equal to the diameters of the conductive balls of the fourth row, and the driving IC includes input bumps contacting conductive balls of the third and fourth rows of the second conductive ball group, and output bumps contacting conductive balls of the first and second rows of the first conductive ball group, wherein the conductive balls of the first conductive ball group are regularly arranged having volumes that gradually increase toward the display area. 2. The display apparatus as claimed in claim 1 , wherein the driving IC further includes: a driving chip to drive the display panel. 3. The display apparatus as claimed in claim 1 , wherein a number of output bumps is greater than a number of input bumps. 4. The display apparatus as claimed in claim 1 , wherein the display panel includes: output pads facing the output bumps with the first conductive ball group therebetween; and input pads facing the input bumps with the second conductive ball group therebetween. 5. The display apparatus as claimed in claim 1 , wherein distances between centers of adjacent conductive balls of the second conductive ball group are equal. 6. The display apparatus as claimed in claim 1 , wherein distances between centers of adjacent conductive balls of the first conductive ball group are equal. 7. The display apparatus as claimed in claim 1 , wherein the conductive balls of the first conductive ball group include at least some conductive balls having a diameter of 3.0 μm to 3.2 μm. 8. An electronic device, comprising: a base substrate including a non-display area adjacent to a display area; a driving integrated circuit (IC) on the base substrate; and an anisotropic conductive film between the base substrate and the driving IC and attaching the driving IC to the base substrate, wherein: the driving IC includes an input to receive an external signal and an output to apply a signal to the base substrate, the anisotropic conductive film includes a first conductive ball group between the output and the base substrate, and includes a second conductive ball group, the first conductive ball group includes at least a first row and a second row of conductive balls, the conductive balls of the second row having diameters that are larger than diameters of the conductive balls of the first row, the second conductive ball group includes at least a third row and a fourth row of conductive balls, the conductive balls of the third row having diameters that are equal to the diameters of the conductive balls of the fourth row, and the input of the driving IC includes input bumps contacting conductive balls of the third and fourth rows of the second conductive ball group, and the output of the driving IC includes output bumps contacting conductive balls of the first and second rows of the first conductive ball group, wherein the conductive balls of the first conductive ball group are regularly arranged having volumes that gradually increase toward the display area. 9. A display apparatus, comprising: a display substrate including a non-display area adjacent to a display area; a driving integrated circuit (IC); and an anisotropic conductive film between the display substrate and the driving IC, the anisotropic conductive film attaching the driving IC to the display substrate, wherein: the anisotropic conductive film includes a first conductive ball group and a second conductive ball group, the first conductive ball group includes at least a first row and a second row of conductive balls, the conductive balls of the second row having volumes that are larger than volumes of the conductive balls of the first row, the second conductive ball group includes at least a third row and a fourth row of conductive balls, the conductive balls of the third row having volumes that are equal to the volumes of the conductive balls of the fourth row, and the driving IC includes first bumps contacting conductive balls of the third and fourth rows of the second conductive ball group, and second bumps contacting conductive balls of the first and second rows of the first conductive ball group, wherein the conductive balls of the first conductive ball group are regularly arranged having volumes that gradually increase toward the display area.
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
of die-attach connectors · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between stacked chips · CPC title
on active surfaces of flip-chip devices, e.g. underfills · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.