Metal nitride material for thermistor, method for producing same, and film type thermistor sensor
US-2016211059-A1 · Jul 21, 2016 · US
Temperature sensor
US10488272B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10488272-B2 |
| Application number | US-201716070321-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 23, 2017 |
| Priority date | Jan 29, 2016 |
| Publication date | Nov 26, 2019 |
| Grant date | Nov 26, 2019 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A temperature sensor having excellent humidity resistance and responsivity is provided. The temperature sensor according to the present invention includes an insulating substrate 2; a thin film thermistor portion 3 made of a thermistor material formed on either surface of the insulating substrate; and an opposed electrode pair 5 consisting of a pair of opposed electrodes 4 formed so as to be opposed to each other on at least either one of the top and bottom surfaces of the thin film thermistor portion, wherein a plurality of the opposed electrode pairs are provided and connected to one another in series. As a result, a voltage applied to a unit thermistor composed of one opposed electrode pair becomes 1/n fold, which can suppress the electrode corrosion due to humidity load.
First claim
Opening claim text (preview).
What is claimed is: 1. A temperature sensor comprising: an insulating substrate; a film thermistor portion made of a thermistor material formed on either side of the insulating substrate; and an opposed electrode pair consisting of a pair of opposed electrodes formed so as to be opposed to each other on at least either one of the top and bottom surfaces of the film thermistor portion, wherein a plurality of the opposed electrode pairs are provided and connected to one another in series; the opposed electrodes have a plurality of comb portions and joints for connecting the base ends of the plurality of comb portions; and, at least a part of each of the joints is formed on at least either one of the top and bottom surfaces of the film thermistor portion. 2. The temperature sensor according to claim 1 , wherein the insulating substrate is an insulating film, and a plurality of the film thermistor portions are formed so as to be spaced apart from one another and one of the opposed electrode pairs is provided for each of the film thermistor portions. 3. The temperature sensor according to claim 1 , wherein the adjacent opposed electrode pairs are connected through the same one joint shared by the pairs. 4. The temperature sensor according to claim 2 , wherein the adjacent opposed electrode pairs are connected through the same one joint shared by the pairs.
Assignees
Inventors
Classifications
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10488272B2 cover?
- A temperature sensor having excellent humidity resistance and responsivity is provided. The temperature sensor according to the present invention includes an insulating substrate 2; a thin film thermistor portion 3 made of a thermistor material formed on either surface of the insulating substrate; and an opposed electrode pair 5 consisting of a pair of opposed electrodes 4 formed so as to be op…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification G01K7/223. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Nov 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).