Light emitting devices and light emitting bulbs including the same

Patent metadata

Field	Value
Publication number	US-10487996-B2
Application number	US-201916260657-A
Country	US
Kind code	B2
Filing date	Jan 29, 2019
Priority date	Apr 19, 2016
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

A filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices includes a non-conductive substrate; a first light emitting diode chip, a second light emitting diode chip and nth, where n≥1, light emitting diode chip mounted on the upper surface of the non-conductive substrate and each comprising input and output ends; two connection means including a first connection mean adjacent to the first light emitting diode chip connected an input terminal and a second connection mean adjacent to the nth light emitting diode chip connected an output terminal; two extending terminals connected the first connection mean and the second connection mean respectively; and a light transmitting encapsulant covered the non-conductive substrate, the two connection means and partially covered the two extending terminals, wherein the nth light emitting diode chip formed a first electrode pad and a second electrode pad and connected on the non-conductive substrate through a first bump and a second bump respectively.

First claim

What is claimed is:

1. A filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices comprising;
a non-conductive substrate;
a first light emitting diode chip, a second light emitting diode chip and n th , where n≥1, light emitting diode chip mounted on the upper surface of the non-conductive substrate and each comprising input and output ends;
two connection means including a first connection mean adjacent to the first light emitting diode chip connected an input terminal and a second connection mean adjacent to the n th light emitting diode chip connected an output terminal;
two extending terminals connected the first connection mean and the second connection mean respectively; and
a light transmitting encapsulant covered the non-conductive substrate, the two connection means and partially covered the two extending terminals;
wherein the n th light emitting diode chip formed a first electrode pad and a second electrode pad and connected on the non-conductive substrate through a first bump and a second bump respectively.

2. The light emitting device according to claim 1 , wherein the input end and the output end of the n th light emitting diode chip filled with an insulating transparent material.

3. The light emitting device according to claim 2 , wherein the insulating transparent material including a wavelength conversion material.

4. The light emitting device according to claim 1 , wherein the n th light emitting diode chip connected in series above the upper surface non-conductive substrate between the input terminal and the output terminal.

5. A filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices comprising;
a non-conductive substrate;
a first light emitting diode chip, a second light emitting diode chip and n th , where n≥1, light emitting diode chip mounted on the upper surface of the non-conductive substrate and each comprising input and output ends;
two connection means including a first connection mean adjacent to the first light emitting diode chip connected an input terminal and a second connection mean adjacent to the n th light emitting diode chip connected an output terminal;
two extending terminals connected the first connection mean and the second connection mean respectively; and
a light transmitting encapsulant covered the non-conductive substrate, the two connection means and partially covered the two extending terminals;
wherein the input terminal and the output terminal connected to the two extending terminals respectively and the two extending terminals connected to the pair of leads respectively.

6. The light emitting device according to claim 5 , wherein one of the leads connected to power input side of the first light emitting device and another of the leads connected to power output side of the n th light emitting device.

7. The light emitting device according to claim 5 , wherein the input terminal included a metal based material having at least one of Ag, Au, Cu and Al and a reflective material film coated on the metal based material.

8. The light emitting device according to claim 5 , wherein the input end and the output end of the n th light emitting diode chip filled with an insulating transparent material.

9. The light emitting device according to claim 8 , wherein the insulating transparent material including a wavelength conversion material.

10. The light emitting device according to claim 5 , wherein the n th light emitting diode chip connected in series above the upper surface non-conductive substrate between the input terminal and the output terminal.

11. A filament type light emitting bulb comprising a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting groups including a first light emitting group and a second light emitting group, said the first and second light emitting group comprising;
a first non-conductive substrate of the first light emitting group and a second non-conductive substrate of the second light emitting group;
a first light emitting diode chip, a second light emitting diode chip and n th , where n≥1, light emitting diode chip mounted in series on the upper surface of the first non-conductive substrate and the second non-conductive substrate respectively and each comprising input end and output end;
two connection means including a first connection mean adjacent to the first light emitting diode chip connected an input terminal and a second connection mean adjacent to the n th light emitting diode chip connected an output terminal of the first non-conductive substrate and the second non-conductive substrate respectively;
two extending terminals connected the first connection mean and the second connection mean respectively; and
a light transmitting encapsulant respectively covered the first non-conductive substrate, the second non-conductive substrate, the two connection means and partially covered the two extending terminals;
wherein the first light emitting group and the second light emitting group connected in parallel.

12. The light emitting device according to claim 11 , wherein the input terminal of the first light emitting group connected to the input terminal of the second light emitting group and the output terminal of the first light emitting group connected to the output terminal of the second light emitting group.

13. The light emitting device according to claim 11 , wherein a first width of a portion of the first connection mean corresponding to the input terminal is larger than a second width of a portion of the first connection mean corresponding to the input end.

14. The light emitting device according to claim 11 , further comprising a plurality of light transmitting regions wherein the light transmitting regions are provided in the vicinity of the input and the output ends between the non-conductive substrate and the n th light emitting diode chip.

15. The light emitting device according to claim 11 , wherein the input terminal included a metal based material having at least one of Ag, Au, Cu and Al and a reflective material film coated on the metal based material.

16. The light emitting device according to claim 11 , wherein the input end and the output end of the n th light emitting diode chip filled with an insulating transparent material.

17. A filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices comprising;
an elongated non-conductive substrate;
a first light emitting diode chip, a second light emitting diode chip and n th (n≥1) light emitting diode chip mounted on a upper surface of the non-conductive substrate;
two connection means including a first connection mean adjacent to the first light emitting diode chip connected a input terminal and a second connection mean adjacent to the n th light emitting diode chip connected a output terminal;
two extending terminals connected the first connection mean and the second connection mean respectively; and
a light transmitting encapsulation covered the non-conductive substrate, the two connection means and partially covered the two extending terminals;
wherein the input te

Assignees

• Lumens Co Ltd

Inventors

• Kim Dae Won
• Cho Yong Wook
• Kim Min Pyo
• Park Jung Hye
• Son Won Kook

Classifications

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title