Process for treating silica-filled polyamide by impregnation in supercritical CO2

US10487186B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10487186-B2
Application numberUS-201716345346-A
CountryUS
Kind codeB2
Filing dateOct 27, 2017
Priority dateOct 27, 2016
Publication dateNov 26, 2019
Grant dateNov 26, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a process for treating a polyamide-based material comprising silica fibers and/or fillers, by impregnation with at least one hydrophobic additive in supercritical CO 2 . The invention also relates to a polyamide-based material comprising silica fibers and/or fillers and impregnated with at least one hydrophobic additive, obtained via such a process, and to the use thereof as an electrically insulating component in an electrical device, in particular in a circuit breaker.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process for treating a polyamide-based material comprising silica fibers and/or fillers, the process comprising impregnating the polyamide-based material with at least one hydrophobic additive in supercritical CO 2 . 2. The process of claim 1 , comprising reducing water uptake of said material. 3. The process of claim 1 , wherein the material is comprises polyamide 6,6 or on polyphthalamide filled with silica fibers and/or fillers. 4. The process of claim 1 , wherein the material comprises silica fibers and/or fillers, in a mass proportion of greater than or equal to 20% of the total mass of the material. 5. The process of claim 1 , wherein said material forms all or part of an electrically insulating component. 6. The process of claim 1 , wherein the hydrophobic additive is chosen from dielectric silicone oils which are soluble in supercritical CO 2 and hydrophobic fluoro compounds which are soluble in supercritical CO 2 . 7. The process of claim 6 , wherein the dielectric silicone oil is chosen from linear silicone oils of polydimethylsiloxane type and aromatic silicone oils. 8. The process of claim 6 , wherein the hydrophobic fluoro compounds which are soluble in supercritical CO 2 comprise at least one at least partially fluorinated hydrophobic hydrocarbon-based chain, including at least 6 carbon atoms. 9. The process of claim 8 , wherein said hydrophobic fluoro compound comprises, besides at least said hydrophobic hydrocarbon-based chain, at least one group which is capable of interacting via hydrogen bonding or via Van der Waals interaction with the polyamide chains. 10. The process of claim 1 , wherein said hydrophobic additive is used in an amount of between 0.2% and 5% by weight relative to the weight of the polyamide-based material. 11. The process of claim 1 , comprising: placing a polyamide-based material filled with silica fibers and/or fillers and at least one hydrophobic additive in an autoclave; generating supercritical carbon dioxide in the autoclave; keeping the material in the autoclave in the presence of the supercritical CO 2 and of the hydrophobic additive so as to ensure the impregnation of the material with said hydrophobic additive; recovering the impregnated material by depressurization of the autoclave; and optionally, drying the material thus impregnated. 12. The process of claim 1 , wherein the impregnation treatment in supercritical CO 2 is performed at a temperature of between 50° C. and 150° C. 13. The process of claim 1 , wherein the impregnation treatment in supercritical CO 2 is performed at a pressure of between 80 and 450 bar. 14. The process of claim 1 , wherein the duration of the impregnation treatment in supercritical CO 2 is between 30 and 180 minutes. 15. A polyamide-based material comprising silica fibers and/or fillers and impregnated with at least one hydrophobic additive, obtained via a process of claim 1 . 16. The material of claim 15 , said material being impregnated with said hydrophobic additive to a thickness extending from the surface of the material down to a depth of at least 200 μm. 17. The material of claim 15 , comprising a mass content of said hydrophobic additive of between 0.2% and 5%, relative to the total weight of the material. 18. An electrically insulating component totally or partly formed from a polyamide-based material comprising silica fibers and/or fillers and impregnated with at least one hydrophobic additive, obtained via a process of claim 1 . 19. An electrical device comprising at least one electrically insulating component of claim 18 . 20. The electrical device of claim 19 , said device comprising a sealing enclosure in which are found, besides said electrically insulating component, electrical components and a gaseous medium which ensure the electrical insulation and the extinction of electric arcs that are liable to form in this sealing enclosure. 21. The electrical device of claim 19 , said device being a medium-voltage or low-voltage electrical device.

Assignees

Inventors

Classifications

  • with only one layer of a composition containing a polymer binder (with more layers C08J7/042) · CPC title

  • Avoiding the use of SF6 · CPC title

  • Use of solid insulating compounds resistant to the contacting fluid dielectrics and their decomposition products, e.g. to SF6 · CPC title

  • silicones · CPC title

  • from vinylfluorides or other fluoroethylenic compounds · CPC title

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What does patent US10487186B2 cover?
The present invention relates to a process for treating a polyamide-based material comprising silica fibers and/or fillers, by impregnation with at least one hydrophobic additive in supercritical CO 2 . The invention also relates to a polyamide-based material comprising silica fibers and/or fillers and impregnated with at least one hydrophobic additive, obtained via such a process, and to…
Who is the assignee on this patent?
Commissariat Energie Atomique
What technology area does this patent fall under?
Primary CPC classification C08J7/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).