Method and apparatus for forming and adhering panel and bracket structures

Patent metadata

Field	Value
Publication number	US-10486406-B2
Application number	US-201816199652-A
Country	US
Kind code	B2
Filing date	Nov 26, 2018
Priority date	Oct 4, 2013
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

The present invention includes a method for the attachment of a bracket to a panel structure comprising providing an adhesive for attaching the bracket to the panel structure; placing the bracket in a desired location on the panel structure; heating the adhesive; and hardening the adhesive so the bracket is adhered to the panel structure.

First claim

What is claimed is:

1. A device for adhering a panel structure comprising:
a bracket structure;
a dry to the touch film material located onto a first surface of the bracket, the film material comprising a reformable epoxy resin adhesive comprising a reaction product of bisphenol A diglycidyl ether and monoethanolamine;
a metallic component present in the bracket structure and/or the film material.

2. The device according to claim 1 , wherein the film material is applied to the bracket and activatable upon exposure to heat.

3. The device according to claim 1 , including a means for connecting the bracket to a secondary component.

4. The device according to claim 1 , wherein the metallic component includes metal wires on the bracket.

5. The device according to claim 1 , wherein the metallic component includes metal within the film material.

6. The device according to claim 1 , wherein the film material is an overmolded film material.

7. The device according to claim 1 , wherein the film material is free of any thermoset adhesive.

8. The device according to claim 6 , wherein the film material is applied to the bracket and activatable upon exposure to heat.

9. The device according to claim 7 , wherein the film material is applied to the bracket and activatable upon exposure to heat.

10. The device according to claim 6 , including a means for connecting the bracket to a secondary component.

11. The device according to claim 7 , including a means for connecting the bracket to a secondary component.

12. The device according to claim 3 , wherein the metallic component includes metal wires on the bracket or metal within the film material.

13. The device according to claim 6 , wherein the metallic component includes metal wires on the bracket or metal within the film material.

14. The device according to claim 7 , wherein the metallic component includes metal wires on the bracket or metal within the film material.

15. The device according to claim 1 , wherein the metallic component includes metal within the film material in the form of a metallic filler.

16. The device according to claim 6 , wherein the metallic component includes metal within the film material in the form of a metallic filler.

17. The device according to claim 8 , wherein the metallic component includes metal within the film material in the form of a metallic filler.

18. The device according to claim 1 , wherein the bracket is adapted to be attached to a honeycomb panel.

19. The device according to claim 3 , wherein the device is adapted for exposure to heat.

20. The device according to claim 18 , wherein the honeycomb panel is adapted for installation in an aerospace vehicle.

Assignees

• Zephyros Inc

Inventors

• Siboni Patrick
• Blancaneaux John

Classifications

• C09J5/06

  involving heating of the applied adhesive · CPC title

• B32B37/1284 Primary

  Application of adhesive · CPC title

• F16B11/006 Primary

  by gluing (gluing of plastics material B29C65/48) · CPC title

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• B32B2037/1215

  Hot-melt adhesive · CPC title