Nanomaterial assisted bonding method to produce curved surfaces

US10486405B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10486405-B2
Application numberUS-201815872011-A
CountryUS
Kind codeB2
Filing dateJan 16, 2018
Priority dateJan 16, 2018
Publication dateNov 26, 2019
Grant dateNov 26, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of fabricating a curved surface comprising the steps of: providing a first material, the first material having a first coefficient of thermal expansion, a predetermined area of the first material having a first predetermined temperature; providing a second material, the second material having a second coefficient of thermal expansion, the second coefficient of thermal expansion being smaller than the first coefficient of thermal expansion, a predetermined area of the second material having a second predetermined temperature, the second predetermined temperature being cooler than the first predetermined temperature; providing a bonding material, the bonding material being disposed in between the first and second materials: pressing the first and second materials together, activating the bonding material such that a surface is formed; allowing the surface to cool such that the desired curvature is attained. 2. The method of claim 1 , wherein the step of providing a bonding material further comprising the substeps of: depositing a first layer of tin on a second face of the first material; depositing a layer of titanium on a first face of the second material; depositing a layer of gold on the layer of titanium depositing a second layer of tin on the layer of gold; providing a nanofoil in between the first and second layers of tin. 3. The method of claim 1 , wherein the step of activating the bonding material includes igniting the nanofoil. 4. The method of claim 1 , wherein the first material has a plurality of predetermined areas, each of the plurality of predetermined areas having a first predetermined temperature. 5. The method of claim 1 , further including positioning the first predetermined area of the first material on a heating element until the predetermined area achieves the first predetermined temperature. 6. The method of claim 1 , further including positioning the second material on a cooling element until the predetermined area achieves the second predetermined temperature. 7. The method of claim 1 , wherein the difference between the first predetermined temperature and the second predetermined temperature is 100 degrees Celsius.

Assignees

Inventors

Classifications

  • Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube · CPC title

  • Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc · CPC title

  • Forming laminates or joined articles comprising at least two interlayers directly next to each other · CPC title

  • Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer · CPC title

  • Noble metals, e.g. palladium, platina or silver · CPC title

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What does patent US10486405B2 cover?
A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coeffic…
Who is the assignee on this patent?
Us Dept Energy
What technology area does this patent fall under?
Primary CPC classification B32B38/1866. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).