Integrated USB connector and memory device

Patent metadata

Field	Value
Publication number	US-10485125-B2
Application number	US-201715852525-A
Country	US
Kind code	B2
Filing date	Dec 22, 2017
Priority date	Dec 22, 2017
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A USB device is disclosed including an integrated memory module and USB connector. Integration of the memory module with the USB connector according to the present technology provides a USB device with a compact footprint and efficient heat transfer to a host device in which the USB device is used.

First claim

We claim:

1. A universal serial bus (USB) device, comprising:
a semiconductor device, comprising:
first and second opposed surfaces extending between first and second edges;
one or more semiconductor die affixed to one of the first and second opposed surfaces, and
a first set of contact fingers mounted at a first position on one of the first and second opposed surfaces, and a second set of contact fingers mounted at a second position on one of the first and second opposed surfaces different than the first position, the first and second sets of contact fingers electrically connected to the one or more semiconductor die; and

a USB connector configured to connect with a host device within a USB slot, the USB connector comprising:
a first set of electrical contacts mounted within a first contacts assembly affixed on the first surface of the semiconductor device, the first set of electrical contacts having first ends physically coupled to the first set of contact fingers, and the first set of electrical contacts having second ends, opposite the first ends, terminating at a proximal end of the USB device, and
a second set of electrical contacts mounted within a second contacts assembly affixed on the second surface of the semiconductor device, the second set of electrical contacts having first ends physically coupled to the second set of contact fingers, and the second set of electrical contacts having second ends, opposite the first ends, terminating at the proximal end of the USB device.

2. The USB device of claim 1 , wherein at least one of the first and second sets of electrical contacts are configured to carry heat away from the one or more semiconductor die.

3. The USB device of claim 1 , further comprising a third assembly fitting over the proximal end of the USB device, adjacent the first contacts assembly on the first surface and adjacent the second contacts assembly on the second surface, the third assembly comprising an end covering the second ends of the first and second sets of electrical contacts.

4. The USB device of claim 3 , further comprising a shell encasing the semiconductor device, the first and second contacts assemblies and the third assembly.

5. The USB device of claim 1 , further comprising a latching assembly, the latching assembly comprising:
a base positioned adjacent the one or more semiconductor die; and
a pair of arms extending from the base to the proximal end of the USB device.

6. The USB device of claim 5 , wherein the base is configured to draw heat away from the one or more semiconductor die, and the pair of arms are configured to draw heat away from the base to the proximal end of the USB device.

7. A universal serial bus (USB) device having a proximal end configured to fit within a host device, comprising:
a semiconductor device, comprising:
first and second opposed surfaces extending between first and second edges, the first edge nearest the proximal end of the USB device and the second edge farthest from the proximal end of the USB device;
one or more semiconductor die affixed to one of the first and second opposed surfaces,
a first set of contact fingers on the first surface adjacent the first edge, and
a second set of contact fingers on the first surface adjacent the second edge; and

a USB connector for connection within a USB slot, the USB connector comprising:
a first set of electrical contacts having first ends in physical contact with the first set of contact fingers, and the first set of electrical contacts having second ends, opposite the first ends, terminating at a proximal end of the USB device, and
a second set of electrical contacts having first ends in physical contact with the second set of contact fingers, and the second set of electrical contacts having second ends, opposite the first ends, terminating at the proximal end of the USB device.

8. The USB device of claim 7 , wherein the second set of electrical contacts extend from the proximal end of the USB device, along the second surface and into contact with the second set of contact fingers on the first surface of the semiconductor device.

9. The USB device of claim 8 , wherein the second set of electrical contacts bend around the first edge of the semiconductor device and into contact with the second set of contact fingers on the first surface of the semiconductor device.

10. The USB device of claim 8 , wherein the first set of electrical contacts extend from the proximal end of the USB device, along the first surface and into contact with the first set of contact fingers on the first surface of the semiconductor device.

11. The USB device of claim 8 , wherein the first set of electrical contacts are contained within a first modular assembly, and the second set of electrical contacts are contained within a second modular assembly, the first and second modular assemblies affixing to the first and second surfaces of the semiconductor device.

12. The USB device of claim 11 , further containing a third modular assembly comprising:
a base positioned adjacent the one or more semiconductor die; and
a pair of arms extending from the base to the proximal end of the USB device.

13. The USB device of claim 12 , wherein the base is configured to draw heat away from the one or more semiconductor die, and the pair of arms are configured to draw heat away from the base to the proximal end of the USB device.

14. The USB device of claim 7 , wherein the first and second sets of electrical contacts at the proximal end are physically configured according to the type-C USB standard.

15. A universal serial bus (USB) device, comprising:
a semiconductor device comprising one or more semiconductor die, the semiconductor device including first and second opposed surfaces, and first and second sets of contact fingers connected to the one or more semiconductor die;
a bottom side contacts assembly affixed to the first surface of the semiconductor device, the bottom side contacts assembly comprising a first set of electrical contacts having first ends electrically coupled to the first set of contact fingers and second ends terminating at a proximal end of the USB device;
a top side contacts assembly affixed to the second surface of the semiconductor device, the top side contacts assembly comprising a first set of electrical contacts having first ends electrically coupled to the second set of contact fingers and second ends terminating at the proximal end of the USB device; and
a tip assembly fitting over the proximal end of the USB device and positioned adjacent the bottom and top side contacts assembly.

16. The USB device of claim 15 , wherein the first set of contact fingers are positioned on the first surface of the semiconductor device, and the first set of electrical contacts in the bottom side contacts assembly extend from the proximal end of the USB device, along the second surface and into contact with the first set of contact fingers on the first surface of the semiconductor device.

17. The USB device of claim 16 , wherein the first set of electrical contacts bend around the first edge of the semiconductor device and into contact with the first set of contact fingers on the first surface of the semiconductor device.

18. The USB device of claim 16 , wherein the second set of contact fingers are positioned on the first surface of the semiconductor device, and the second set of electrical contacts in the top side contacts assembly extend from the proximal end of the USB device, along the first surface and into contact with the second set of contact fing

Assignees

• Western Digital Tech Inc

Inventors

• Takiar Hem
• Patterson Michael
• Mohanraj Nandha Kumar

Classifications

• H10W90/752

  between stacked chips · CPC title

• H10W90/00

  Package configurations · CPC title

• G06K19/077 Primary

  Constructional details, e.g. mounting of circuits in the carrier · CPC title

• H01R13/6658 Primary

  on printed circuit board (H01R13/6666 - H01R13/6691 take precedence) · CPC title

• H01R13/665

  with built-in electronic circuit (H01R13/70, H01R13/719 take precedence) · CPC title