OLED panel, method for manufacturing the same and display device

Patent metadata

Field	Value
Publication number	US-10483490-B2
Application number	US-201615321477-A
Country	US
Kind code	B2
Filing date	Mar 16, 2016
Priority date	Apr 24, 2015
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

The present disclosure discloses an OLED panel, a method for manufacturing the same and a display device. The OLED panel includes a substrate, a cover plate, an OLED device and an encapsulation structure. The encapsulation structure includes a thin-film encapsulation layer and an encapsulation adhesive, and a hydrochromic material is added in the encapsulation structure.

First claim

What is claimed is:

1. An organic light emitting diode (OLED) panel, comprising:
a substrate;
a cover plate, arranged opposite to the substrate;
an OLED device, arranged on the substrate; and
an encapsulation structure, arranged between the substrate and the cover plate;
wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive; a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer; and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive; and
wherein the hydrochromic material is CuSO 4 whose color changes when it is in contact with water; and
wherein the encapsulation adhesive comprises a first encapsulation adhesive, a second encapsulation adhesive and a third encapsulation adhesive; and
a side of the thin film encapsulation layer, which is away from the substrate, is covered with the first encapsulation adhesive;
the second encapsulation adhesive, in which the hydrochromic material is added, surrounds the first encapsulation adhesive; and
the third encapsulation adhesive surrounds the second encapsulation adhesive and prevent the second encapsulation adhesive from being in contact with water vapor.

2. The OLED panel according to claim 1 , wherein
the first encapsulation adhesive has the hydrochromic material added therein.

3. The OLED panel according to claim 2 , wherein
the second encapsulation adhesive prevents the first encapsulation adhesive from being in contact with water vapor.

4. An organic light emitting diode (OLED) panel, comprising:
a substrate;
a cover plate, arranged opposite to the substrate;
an OLED device, arranged on the substrate; and
an encapsulation structure, arranged between the substrate and the cover plate;
wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive; a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer; and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive;
wherein the hydrochromic material is CuSO 4 whose color changes when it is in contact with water, and
wherein
the thin-film encapsulation layer is formed at the side of the OLED device which is away from the substrate, and comprises a multi-layer structure formed by inorganic encapsulation layers and organic encapsulation layers which are alternately arranged in order in a direction away from the OLED device, the total number of the inorganic encapsulation layers and organic encapsulation layers is at least three, and the hydrochromic material is added in at least one organic encapsulation layer; and
a side of the thin-film encapsulation layer, which is away from the substrate, is covered with the encapsulation adhesive which prevents the thin-film encapsulation layer from being in contact with water vapor.

5. The OLED panel according to claim 4 , wherein the total number of the inorganic and organic encapsulation layers is three.

6. A method for manufacturing an organic light emitting diode (OLED) panel, comprising steps of:
providing a substrate and a cover plate;
forming an OLED device on the substrate;
forming an encapsulation structure on the substrate, wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive, a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer, and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive; and
aligning the cover plate with the substrate provided with the OLED device and the encapsulation structure, attaching the cover plate on the substrate, and curing the encapsulation adhesive with ultraviolet light, to form the OLED panel,
wherein the hydrochromic material is CuSO 4 whose color changes when it is in contact with water, and
wherein the step of forming the encapsulation structure comprises:
forming the thin-film encapsulation layer on the side of the OLED device which is away from the substrate;
forming a first encapsulation adhesive on a side of the thin-film encapsulation layer which is away from the OLED device;
forming a second encapsulation adhesive which surrounds the first encapsulation adhesive, wherein the hydrochromic material is added in the second encapsulation adhesive; and
forming a third encapsulation adhesive which surrounds the second encapsulation adhesive, to prevent the second encapsulation adhesive from being in contact with water vapor.

7. The method for manufacturing the OLED panel according to claim 6 , wherein the step of forming the encapsulation structure comprises:
on the side of the OLED device which is
adding the hydrochromic material in the first encapsulation adhesive.

8. The method for manufacturing the OLED panel according to claim 7 , wherein
the second encapsulation adhesive prevents the first encapsulation adhesive from being in contact with water vapor.

9. The method for manufacturing the OLED panel according to claim 6 , wherein the step of forming the encapsulation structure further comprises:
wherein the thin-film encapsulation layer comprises a multi-layer structure formed by inorganic encapsulation layers and organic encapsulation layer(s) which are alternately arranged in order in a direction away from the OLED device, the total number of the inorganic encapsulation layers and organic encapsulation layer(s) is at least three, and the hydrochromic material is added in at least one organic encapsulation layer; and
forming the encapsulation adhesive on the thin-film encapsulation layer to prevent the thin-film encapsulation layer from being in contact with water vapor.

10. The method for manufacturing the OLED panel according to claim 9 , wherein the total number of the inorganic and organic encapsulation layers is three.

11. A display device, comprising an organic light emitting diode (OLED) panel of claim 1 .

12. The display device according to claim 11 , wherein
the first encapsulation adhesive has the hydrochromic material added therein.

13. The display device according to claim 12 , wherein
the second encapsulation adhesive prevents the first encapsulation adhesive from being in contact with water vapor.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Chunjan
• Shih Huaiting

Classifications

• H10P74/27 Primary

  Structural arrangements therefor · CPC title

• H01L51/524

  Electricity · mapped topic

• H01L22/30

  Electricity · mapped topic

• H01L51/5253 Primary

  Electricity · mapped topic

• H01L51/0031

  Electricity · mapped topic