Method of manufacturing organic light emitting device and organic light emitting device

Patent metadata

Field	Value
Publication number	US-10483479-B2
Application number	US-201616081861-A
Country	US
Kind code	B2
Filing date	Mar 1, 2016
Priority date	Mar 1, 2016
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A first light emitting unit includes a hole injection layer, a first hole transport layer, and a first light emitting layer. A second light emitting unit includes a hole injection layer, a second hole transport layer, a third hole transport layer, a third hole transport layer, and a second light emitting layer. The second hole transport layer is formed on the hole injection layer and includes a first hole transporting material. The third hole transport layer is formed on the second hole transport layer and includes a second hole transporting material. A fourth hole transport layer is formed on the third hole transport layer and includes the same material as the second hole transport layer, that is, the second hole transporting material. The third hole transport layer is formed by using a coating method, and the fourth hole transport layer is formed by a vapor deposition method.

First claim

The invention claimed is:

1. A method of manufacturing a light emitting device, the method comprising:
a first step of coating a first region of a substrate, in which a first light emitting unit is formed, with a first solution comprising a light emitting material;
a second step of coating a second region of a substrate, in which a second light emitting unit is formed, with a second solution comprising a coating material, before or after the first step;
a third step of drying the first solution in the first region and the second solution in the second region after the first step and the second step; and
a fourth step of depositing a light emitting material in the second region after the third step.

2. The method of manufacturing a light emitting device according to claim 1 , further comprising:
a fifth step of coating the first region and the second region with a first hole transporting material before the first step and the second step.

3. The method of manufacturing a light emitting device according to claim 2 ,
wherein the second solution used in the second step is a second hole transporting material.

4. The method of manufacturing a light emitting device according to claim 3 , further comprising:
a sixth step of depositing the second hole transporting material in the second region in a period between the third step and the fourth step.

5. The method of manufacturing a light emitting device according to claim 4 ,
wherein a molecular weight of the first hole transporting material is higher than that of the second hole transporting material.

6. The method of manufacturing a light emitting device according to claim 2 , further comprising:
a seventh step of coating the first region and the second region with a hole injection material before the fifth step.

7. The method of manufacturing a light emitting device according to claim 6 ,
wherein a molecular weight of the hole injection material is higher than that of the second solution used in the second step.

8. The method of manufacturing a light emitting device according to claim 1 ,
wherein a peak wavelength of an emission spectrum of the first light emitting unit is longer than a peak wavelength of an emission spectrum of the second light emitting unit.

9. The method of manufacturing a light emitting device according to claim 1 ,
wherein an ink jet method is used in the first step and the second step.

10. The method of manufacturing a light emitting device according to claim 1 , further comprising:
an eighth step of depositing an electron injection material after the fourth step.

11. A light emitting device comprising:
a first light emitting unit positioned in a first region of a substrate; and
a second light emitting unit positioned in a second region of the substrate,
wherein the first light emitting unit comprises:
a first hole injection layer;
a first hole transport layer positioned on the first hole injection layer; and
a first light emitting layer positioned on the first hole transport layer, and

the second light emitting unit comprises:
a second hole injection layer;
a second hole transport layer which is positioned on the second hole injection layer and comprises a first hole transporting material;
a third hole transport layer which is positioned on the second hole transport layer and comprises a second hole transporting material;
a fourth hole transport layer which is positioned on the third hole transport layer and comprises the second hole transporting material; and
a second light emitting layer positioned on the fourth hole transport layer.

12. The light emitting device according to claim 11 ,
wherein a refractive index of the third hole transport layer is different from a refractive index of the fourth hole transport layer.

13. The light emitting device according to claim 11 ,
wherein the first hole transport layer comprises the first hole transporting material.

14. The light emitting device according to claim 11 , further comprising:
a substrate;
an insulating layer which is positioned on the substrate and comprises a plurality of openings; and
a partition wall positioned on a portion of the insulating layer, the portion of the insulating layer positioned between adjacent openings,
wherein the first light emitting unit is positioned on an inner side of a first opening among the openings,
the second light emitting unit is positioned on an inner side of a second opening among the openings, and
the first hole transport layer, the second hole transport layer, the third hole transport layer, and the first light emitting layer are not positioned on the partition wall, and the fourth hole transport layer and the second light emitting layer are positioned on at least a portion of the partition wall.

15. The light emitting device according to claim 11 ,
wherein a peak wavelength of an emission spectrum of the first light emitting unit is longer than a peak wavelength of an emission spectrum of the second light emitting unit.

16. A light emitting device comprising:
a substrate;
an insulating layer which is positioned on the substrate and comprises a plurality of openings;
a partition wall positioned on a portion of the insulating layer, the portion of the insulating layer positioned between adjacent openings;
a first light emitting unit positioned in a first opening among the openings; and
a second light emitting unit positioned in a second opening among the openings,
wherein the first light emitting unit comprises:
a first hole injection layer;
a first hole transport layer positioned on the first hole injection layer; and
a first light emitting layer positioned on the first hole transport layer,

the second light emitting unit comprises:
a second hole injection layer;
a second hole transport layer which is positioned on the second hole injection layer and is thicker than the first hole transport layer, the second hole transport layer comprising a plurality of layers; and
a second light emitting layer positioned on the second hole transport layer, and
the second hole injection layer and at least one of the plurality of layers of the second hole transport layer are not positioned on the partition wall and at least another one of the plurality of layers of the second hole transport layer and the second light emitting layer are positioned on the partition wall, the partition wall being positioned adjacent to the second light emitting unit.

Assignees

• Pioneer Corp

Inventors

• Tanaka Akihiro

Classifications

• H05B33/10

  Apparatus or processes specially adapted to the manufacture of electroluminescent light sources · CPC title

• H05B33/22

  characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers · CPC title

• H01L51/001

  Electricity · mapped topic

• H01L51/5012

  Electricity · mapped topic

• H01L51/5072

  Electricity · mapped topic