Power device cassette with auxiliary emitter contact

Patent metadata

Field	Value
Publication number	US-10483246-B2
Application number	US-201715465561-A
Country	US
Kind code	B2
Filing date	Mar 21, 2017
Priority date	Oct 15, 2013
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A press pack module includes a collector module terminal, an emitter module terminal, a gate module terminal, and an auxiliary module terminal. Each IGBT cassette within the module includes a set of shims, two contact pins, and an IGBT die. The first contact pin provides part of a first electrical connection between the gate module terminal and the IGBT gate pad. The second contact pin provides part of a second electrical connection between the auxiliary module terminal and a shim that in turn contacts the IGBT emitter pad. The electrical connection between the auxiliary emitter terminal and each emitter pad of the many IGBTs is a balanced impedance network. The balanced network is not part of the high current path through the module. By supplying a gate drive signal between the gate and auxiliary emitter terminals, simultaneous IGBT turn off in high speed and high current switching conditions is facilitated.

First claim

What is claimed is:

1. A method comprising:
providing a power semiconductor device die so that the power semiconductor device die is disposed between a pedestal of a disc-shaped bottom plate member and a disc-shaped top plate member, wherein the disc-shaped bottom plate member, the disc-shaped top plate member, and the power semiconductor device die are parts of a press pack semiconductor device module;
providing a first conductive path between a first pad on the power semiconductor device die and a first terminal of the press pack semiconductor device module, wherein the first conductive path extends through a first contact pin that contacts the power semiconductor device die, and wherein the first conductive path extends through neither the disc-shaped top plate member nor the disc-shaped bottom plate member; and
providing a second conductive path between a second pad on the power semiconductor device die and a second terminal of the press pack semiconductor device module, wherein the second conductive path extends through a second contact pin that contacts the power semiconductor device die, and wherein the second conductive path extends through neither the disc-shaped top plate member nor the disc-shaped bottom plate member.

2. The method of claim 1 , further comprising:
providing a four-sided frame so that the four-sided frame is disposed around the pedestal, wherein the four-sided frame has a first channel through which the first contact pin extends, and wherein the four-sided frame has a second channel through which the second contact pin extends.

3. The method of claim 1 , wherein the first terminal of the press pack semiconductor device module is a gate terminal, and wherein the second terminal of the press pack semiconductor device module is an auxiliary emitter terminal.

4. The method of claim 1 , wherein the semiconductor device die is an Insulated Gate Bipolar Transistor (IBGT) device die, wherein the first pad on the IBGT device die is a gate pad, and wherein the second pad on the IBGT device die is an emitter pad.

5. The method of claim 1 , wherein the power semiconductor device module comprises a Printed Circuit Board (PCB), wherein the first conductive path extends through a first metal layer of the PCB, wherein the second conductive path extends through a second metal layer of the PCB, and wherein the first metal layer of the PCB is different from the second metal layer of the PCB.

6. The method of claim 5 , wherein the first conductive path extends through a surface mount resistor.

7. The method of claim 1 , further comprising:
providing a third conductive path between a third pad on the power semiconductor device die and a third terminal of the press pack semiconductor device module; and
providing a fourth conductive path between a fourth pad on the power semiconductor device die and a fourth terminal of the press pack semiconductor device module.

8. The method of claim 7 , wherein the third terminal of the press pack semiconductor device module is a main collector terminal, and wherein the fourth terminal of the press pack semiconductor device module is a main emitter terminal.

9. The method of claim 7 , wherein the third conductive path extends through the disc-shaped top plate member, and wherein the fourth conductive path extends through the disc-shaped bottom plate member.

10. The method of claim 1 , wherein the first contact pin is a first spring-loaded contact pin, and wherein the second contact pin is a second spring-loaded contact pin.

11. The method of claim 1 , wherein the second conductive path between the second pad and the second terminal extends through a branched and balanced impedance network.

12. The method of claim 11 , wherein a main current path through the press pack semiconductor device module does not extend through the branched and balanced impedance network.

13. The method of claim 1 , further comprising:
receiving a control signal between the first terminal of the press pack semiconductor device module and the second terminal of the press pack semiconductor device module.

Assignees

• Littelfuse Inc
• Littlefuse Inc

Inventors

• Golland Ashley
• Wakeman Franklin J
• Neal Howard D

Classifications

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W76/13

  Containers comprising a conductive base serving as an interconnection · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title