Display apparatus and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10483098-B2
Application number	US-201715585357-A
Country	US
Kind code	B2
Filing date	May 3, 2017
Priority date	May 3, 2016
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A method of manufacturing a display apparatus is provided as follows. A substrate having a display portion on an upper surface of the substrate is prepared. A protection film having an opening is attached to a lower surface of the substrate so that the protection film overlaps the display portion. A support film is attached to the lower surface so that the support film is disposed within the opening of the protection film. A driving circuit chip is attached to the upper surface so that the driving chip is spaced apart from the display portion and the opening. At least a part of the support film is removed. The substrate is bent along a longitudinal direction of the opening.

First claim

What is claimed is:

1. A method of manufacturing a display apparatus, the method comprising:
preparing a substrate having a display portion on an upper surface of the substrate;
attaching a protection film having an opening to a lower surface of the substrate so that the protection film overlaps the display portion;
attaching a support film to the lower surface so that the support film is disposed within the opening of the protection film, wherein the support film is spaced apart from the protection film before the support film is attached to the lower surface;
attaching a driving circuit chip to the upper surface so that the driving circuit chip is spaced apart from the display portion and the opening;
removing at least a part of the support film; and
bending the substrate along a longitudinal direction of the opening.

2. The method of claim 1 ,
wherein the removing of the at least a part of the support film is performed after the attaching of the driving circuit chip is performed.

3. The method of claim 1 ,
wherein the support film comprises a support film base and an adhesive layer,
wherein the adhesive layer is interposed between the substrate and the support film base, and
wherein the removing of the at least a part of the support film comprises:
removing the support film base so that the adhesive layer remains attached to the lower surface of the substrate.

4. The method of claim 1 , further comprising:
forming a preparatory protection film on a lower film;
cutting the preparatory protection film into the protection film and the support film,
wherein the cutting of the preparatory protection film is performed before the attaching of protection film and attaching of the support film.

5. The method of claim 1 ,
wherein the support film comprises a different material from a material of the protection film.

6. The method of claim 1 ,
wherein a surface of the support film attached to the substrate is concave toward the substrate.

7. The method of claim 1 , further comprising:
forming a bending protection layer on the upper surface of the substrate so that the bending protection layer overlaps the opening.

8. The method of claim 1 , further comprising:
applying a liquid phase filler in the opening after the removing of the support film; and
hardening the liquid phase filler after the bending of the substrate.

9. The method of claim 1 , further comprising:
filling at least partially a filler in the opening before the bending of the substrate.

10. The method of claim 1 ,
wherein an area of the support film is smaller than an area of the opening.

11. The method of claim 1 ,
wherein the protection film comprises a protection film base and a first adhesive layer,
wherein the support film comprises a support film base and a second adhesive layer, and
wherein the protection film base and the support film base are respectively attached to the lower surface of the substrate via the first adhesive layer and the second adhesive layer.

12. The method of claim 1 , further comprising:
forming a cushion layer on the protection film after the bending of the substrate, wherein an upper surface of the cushion layer is in contact with a first portion of the protection film and a lower surface of the cushion layer is in contact with a second portion of the protection film, and
wherein the bending of the substrate is performed to the extent that the first and second portions face each other.

13. The method of claim 1 ,
wherein the attaching of the protection film and the attaching of the support film are performed at substantially the same time.

14. A method of manufacturing a display apparatus, the method comprising:
preparing a substrate having a display portion on an upper surface of the substrate;
attaching a protection film having an opening to a lower surface of the substrate so that the protection film overlaps the display portion, wherein the protection film comprises a protection film base and a first adhesive layer;
attaching a support film to the lower surface so that the support film is disposed within the opening of the protection film, wherein the support film comprises a support film base and a second adhesive layer;
attaching a driving circuit chip to the upper surface of the substrate so that the driving circuit chip is spaced apart from the display portion and the opening;
removing the support film to expose the second adhesive layer so that the second adhesive layer is exposed through the opening of the protection film;
bending the substrate along a longitudinal direction of the opening so that the substrate has a curved surface overlapping the opening of the protection film; and
performing a first hardening process on the exposed second adhesive layer.

15. The method of claim 14 ,
wherein the first hardening process is performed so that the second adhesive layer has a hardness to the extent that the second adhesive layer after the first hardening process is performed prevents the substrate from losing the curved surface.

16. The method of claim 14 ,
wherein the substrate further comprises an inorganic insulating layer, a first conductive layer and an organic material layer stacked on each other to form a stacked structure, and
wherein before the removing of the support film is performed, the stacked structure overlaps the support film disposed within the opening of the protection film.

17. The method of claim 14 ,
wherein the first hardening process includes irradiation of a laser, irradiation of an UV ray or a heat treatment process.

18. The method of claim 16 , further comprising:
forming a groove in the inorganic insulating layer,
wherein the organic material layer fills the groove of the inorganic insulating layer.

19. The method of claim 14 , further comprising:
forming a filler on the curved surface of the substrate,
wherein the filler is in contact with the second adhesive layer, and
wherein the filler is hardened by a second hardening process.

20. A method of manufacturing a display apparatus, the method comprising:
preparing a substrate having a display portion on an upper surface of the substrate;
attaching a protection film having an opening to a lower surface of the substrate so that the protection film overlaps the display portion;
attaching a driving circuit chip to the upper surface so that the driving circuit chip is spaced apart from the display portion and the opening;
applying a liquid phase filler in the opening, wherein the liquid phase filler extends across the opening in a first direction; and
bending the substrate along a longitudinal direction of the opening substantially perpendicular to the first direction.

21. The method of claim 20 , further comprising:
hardening the liquid phase filler after the bending of the substrate.

Assignees

• Samsung Display Co Ltd

Inventors

• Um Dongbin
• Hwang Jihong
• Choi Hayoung

Classifications

• G02F2201/50

  Protective arrangements · CPC title

• G02F1/13454

  Drivers integrated on the active matrix substrate (G02F1/136277 takes precedence) · CPC title

• H01L27/1214

  Electricity · mapped topic

• H01L21/02107 Primary

  Electricity · mapped topic

• G02F1/133305 Primary

  Flexible substrates, e.g. plastics, organic film · CPC title