Method for sensing power consumption and sensing device

Patent metadata

Field	Value
Publication number	US-10481180-B2
Application number	US-201815867802-A
Country	US
Kind code	B2
Filing date	Jan 11, 2018
Priority date	Nov 17, 2017
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A sensing device includes a housing positioned on an outer surface of a wire and a circuit board received in the housing. The circuit board has a sensing area for sensing the wire, such that the measurements obtained by the circuit board are relative values. Therefore, the circuit design of the circuit board can be simplified, and the size of the sensing device can be reduced.

First claim

What is claimed is:

1. A method for sensing power consumption, comprising:
sensing, by a sensing device, a change in a waveform of a current or a voltage on a wire;
performing integration operation and digital processing on the waveform of the current or the voltage;
calculating a root mean square of a value of the current or the voltage, wherein the value of the current or the voltage is a relative value, wherein the relative value is a simple number and free from being a measured value of a physical electricity meter; and
calculating a power factor after calculating the root mean square of the value of the current or the voltage, wherein calculating the power factor includes detecting zero crossings of the current and the voltage to measure a time difference between the zero crossings, and correcting a non-linear load error based on distortion in the waveform of the current to obtain the power factor.

2. The method of claim 1 , wherein the sensing device senses the change in the waveform of the current or the voltage based on an electromagnetic induction principle.

3. The method of claim 1 , further comprising, after performing the integration operation and the digital processing on the waveform of the current or the voltage and prior to calculating the root mean square of the value of the current or the voltage, performing a filtering process.

4. A sensing device, comprising:
a housing configured for being positioned on an outer surface of a wire; and
a circuit board received in the housing and including a sensing area configured for sensing a change in a waveform of a current or a voltage of the wire to allow the sensing device to perform the method for sensing power consumption of claim 1 .

5. The sensing device of claim 4 , wherein the housing includes a positioning portion corresponding to the wire.

6. The sensing device of claim 5 , wherein the positioning portion is a groove configured for receiving the wire.

7. The sensing device of claim 4 , further comprising a fastening part configured for fastening the housing to the wire.

8. The sensing device of claim 7 , wherein the fastening part is a cable tie, and the housing is formed with at least one through hole for the cable tie to pass therethrough.

9. The sensing device of claim 8 , wherein the cable tie is configured to wind around the wire.

10. The sensing device of claim 8 , wherein the housing and the wire abut against each other.

11. The sensing device of claim 4 , wherein the circuit board is defined with an analog measuring board area and a digital board area, with a measuring unit and a signal processing circuit provided in the analog measuring board area and a digital operation circuit and a communication unit provided in the digital board area.

12. The sensing device of claim 11 , further comprising a microprocessor provided in the digital board area, with at least one of a portion of the digital operation circuit and a portion of the communication unit arranged in the microprocessor.

13. The sensing device of claim 11 , wherein the measuring unit includes a layout provided within the sensing area of the circuit board.

14. The sensing device of claim 13 , wherein the measuring unit includes two symmetric coils wound in opposite directions.

15. The sensing device of claim 13 , wherein the measuring unit includes a sensing layer formed on one side of the circuit board and facing the wire.

16. The sensing device of claim 15 , wherein the measuring unit further includes a ground layer formed on the other side of the circuit board.

17. The sensing device of claim 11 , wherein the communication unit is configured to transmit signals to a data storage apparatus via a single transmission line.

18. The sensing device of claim 17 , wherein the single transmission line is configured to connect another sensing device in series.

Assignees

• Ind Tech Res Inst

Inventors

• Chu Bo-Yin
• Chiang Hsu-Cheng
• Jeng Ming-Shan

Classifications

• G01R22/065

  related to mechanical aspects · CPC title

• G01R21/133

  by using digital technique · CPC title

• G01R21/006

  Measuring power factor · CPC title

• G01R11/04

  Housings; Supporting racks; Arrangements of terminals · CPC title

• G01R19/175

  Indicating the instants of passage of current or voltage through a given value, e.g. passage through zero · CPC title