Reconfigurable sensor unit for electronic device

Patent metadata

Field	Value
Publication number	US-10480941-B2
Application number	US-201916284448-A
Country	US
Kind code	B2
Filing date	Feb 25, 2019
Priority date	Feb 26, 2015
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A sensor chip is mounted on a PCB and electrically connected to a SOC mounted on the PCB via at least one conductive trace. The sensor chip includes configuration registers storing and outputting configuration data, and a PLD receiving digital data. The PLD performs an extraction of features of the digital data in accordance with the configuration data, and the configuration data includes changeable parameters of the extraction. A classification unit processes the extracted features of the digital data so as to generate a context of an electronic device into which the sensor chip is incorporated relative to its surroundings, the processing being performed in using a processing technique operating in accordance with the configuration data. The configuration data also includes changeable parameters of the processing technique. The classification unit outputs the context to data registers for storage.

First claim

The invention claimed is:

1. A sensor chip mounted on a printed circuit board (PCB) and electrically coupled to a system on chip (SoC) mounted on the PCB via at least one conductive trace, the sensor chip comprising:
configuration registers configured to store and output configuration data;
a programmable logic device (PLD) configured to receive digital data, the PLD further configured to perform an extraction of features of the digital data in accordance with the configuration data, the configuration data comprising changeable parameters of the extraction;
a classification circuit configured to process the extracted features of the digital data so as to generate a context of an electronic device into which the sensor chip is incorporated relative to its surroundings, the processing being performed using a processing technique operating in accordance with the configuration data, wherein the configuration data further comprises changeable parameters of the processing technique; and
data registers, wherein the classification unit is configured to output the context to the data registers for storage.

2. The sensor chip of claim 1 , further comprising computed feature registers storing the extracted features of the digital data.

3. The sensor chip of claim 1 , wherein the changeable parameters of the extraction comprise which features of the digital data are selected to extract.

4. The sensor chip of claim 3 , wherein the features of the digital data selected to extract include at least one of mean acceleration, radian acceleration, number of acceleration peaks, number of zero crosses, peak acceleration values, linear acceleration values, energy in bands, mean of roll, pitch, and yaw, variance of roll, pitch, and yaw, mean of linear acceleration, variance of linear acceleration.

5. The sensor chip of claim 3 , wherein the configuration data contains parameters for operating the sensor chip between a low power consumption mode and a high power consumption mode; wherein in the low power consumption mode, the PLD extracts a first subset of features of the digital data; wherein in the high power consumption mode, the PLD extracts at least a second subset of features of the digital data, the second subset containing more features of the digital data than the first subset; and wherein the PLD is configured to selectively switch between the low power consumption mode and the high power consumption mode.

6. The sensor chip of claim 5 , wherein the PLD is configured to operate in the low power consumption mode until at least one of the extracted features exceeds a threshold, and to operate in the high power consumption mode for a period of time thereafter.

7. The sensor chip of claim 1 , further comprising:
a MEMS sensor configured to generate a plurality of analog data outputs;
a selection circuit receiving the plurality of analog data outputs and configured to pass a selected one of the plurality of analog data outputs; and
an analog to digital converter configured to convert the selected one of the plurality of analog data outputs to the digital data.

8. The sensor chip of claim 7 , further comprising a charge pump configured to boost the selected one of the plurality of analog data outputs prior to conversion by the analog to digital converter.

9. The sensor chip of claim 7 , wherein the MEMS sensor contains at least an accelerometer and a gyroscope; and wherein the plurality of analog data outputs includes analog accelerometer data output and analog gyroscope data output.

10. The sensor chip of claim 9 , wherein the plurality of analog data outputs also includes analog output data from an external source.

11. The sensor chip of claim 10 , wherein the analog output data from the external source includes at least one of analog light sensor output data, analog magnetometer output data, analog barometer output data, analog microphone output data, analog proximity sensor output data.

12. The sensor chip of claim 7 , wherein the selection circuit selects different ones of the plurality of analog data outputs to pass in accordance with the configuration data; and wherein the configuration data also includes a selection change rate for the selection circuit.

13. The sensor chip of claim 12 , wherein the plurality of analog data outputs includes analog data outputs from the MEMS sensor in addition to analog data outputs from an external source; and wherein the selection change rate comprises a first selection change rate for the analog data outputs from the MEMS sensing unit and a second selection change rate for the analog data outputs from the external source, with the second selection change rate being lesser than the first selection change rate.

14. The sensor chip of claim 1 , further comprising a digital filter configured to filter the digital data prior to extraction of the features by the PLD in accordance with a digital filtering technique, the filtering being performed in accordance with the configuration data, wherein the configuration data further comprises changeable parameters of the digital filtering technique.

15. The sensor chip of claim 14 , wherein the changeable parameters of the digital filtering technique include which digital filtering technique is performed and/or which coefficients are used by the digital filtering technique.

16. The sensor chip of claim 1 , further comprising a bus interface configured to receive the context from the data registers and to facilitate transmission of the context from the data registers to another device.

17. The sensor chip of claim 16 , wherein the bus interface comprises an Inter-Integrated Circuit (I 2 C) bus interface.

18. The sensor chip of claim 1 , wherein the PLD is configured to ignore digital data falling outside of a given range when extracting the features of the digital data, in accordance with the configuration data; and wherein the configuration data also includes the given range.

19. The sensor chip of claim 1 , wherein the classification circuit comprises an arithmetic logic unit (ALU) circuit.

20. The sensor chip of claim 1 , wherein the PLD comprises an arithmetic logic unit (ALU) circuit.

21. The sensor chip of claim 1 , wherein the context of the electronic device relative to its surroundings comprises at least one of a mode of locomotion of a user carrying the electronic device, a position of the electronic device on the body of the user, and a gesture in which the electronic device has been moved.

22. The sensor chip of claim 21 , wherein the gesture in which the electronic device has been moved comprises at least one of raising the electronic device into position for screen viewing, shaking the electronic device, double tapping the electronic device, rotating the electronic device, and swiping the electronic device in at least one direction.

23. An electronic device, comprising:
a printed circuit board (PCB) having at least one conductive trace thereon;
a system on chip (SoC) mounted on the PCB and electrically coupled to the at least one conductive trace; and
a sensor chip mounted on the PCB in a spaced apart relation with the SoC and electrically coupled to the at least one conductive trace such that the sensor chip and SoC are electrically coupled;
wherein the sensor chip comprises:
configuration registers configured to store and output configuration data;
a MEMS sensor configured to generate a plurality of analog data outputs;
a selection circuit receiving the plurality of analog data ou

Assignees

• St Microelectronics Inc

Inventors

• Chowdhary Mahesh
• Dayal Sankalp

Classifications

• G01P15/18

  in two or more dimensions · CPC title

• G01C21/165

  combined with non-inertial navigation instruments · CPC title

• G01C21/20 Primary

  Instruments for performing navigational calculations (G01C21/24, G01C21/26 take precedence) · CPC title

• G01C19/5776 Primary

  Signal processing not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719 · CPC title

• G01C19/32 Primary

  Indicating or recording means specially adapted for rotary gyroscopes · CPC title