Copper alloy and its uses

US10480049B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10480049-B2
Application numberUS-201715475781-A
CountryUS
Kind codeB2
Filing dateMar 31, 2017
Priority dateJun 3, 2016
Publication dateNov 19, 2019
Grant dateNov 19, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A copper alloy having the following composition (in % by weight): from 10.6 to 18% of Al, from 10.5 to 14.5% of Ni, optionally up to 2% of Fe, optionally up to 1% of Co, optionally up to 0.5% of Ti, optionally up to 0.5% of Mn, optionally up to 0.15% of B, optionally up to 0.1% of Ca, and optionally up to 0.1% of C, with the balance being copper and unavoidable impurities. Nickel aluminides of the NiAl type are embedded as precipitates in the microstructure of the alloy.

First claim

Opening claim text (preview).

The invention claimed is: 1. A copper alloy consisting of the following composition in % by weight: from 10.6 to 18% of Al, from 10.5 to 14.5% of Ni, optionally up to 2% of Fe, optionally up to 1% of Co, optionally up to 0.5% of Ti, optionally up to 0.5% of Mn, optionally up to 0.15% of B, optionally up to 0.1% of Ca, and optionally up to 0.1% of C, with the balance being copper, characterized in that nickel aluminides of the NiAl type are embedded as precipitates in the microstructure of the alloy. 2. The copper alloy according to claim 1 , characterized in that the proportion of aluminum is at least 12% by weight and not more than 16% by weight. 3. The copper alloy according to claim 1 , characterized in that the proportion of nickel is at least 11% by weight and not more than 13% by weight. 4. The copper alloy according to claim 1 , characterized in that the ratio of the proportion of aluminum in % by weight to proportion of nickel in % by weight is at least 0.95 and not more than 1.28. 5. A sliding element comprising a copper alloy according to claim 1 . 6. A plug connector comprising a copper alloy according to claim 1 . 7. A sealing element comprising a copper alloy according to claim 1 . 8. A tool comprising a copper alloy according to claim 1 . 9. A spring element comprising a copper alloy according to claim 1 . 10. A filter element comprising a copper alloy according to claim 1 .

Assignees

Inventors

Classifications

  • Alloys based on copper · CPC title

  • of copper or alloys based thereon · CPC title

  • C22C9/06Primary

    with nickel or cobalt as the next major constituent · CPC title

  • C22C9/01Primary

    with aluminium as the next major constituent · CPC title

  • Strength or rigidity · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10480049B2 cover?
A copper alloy having the following composition (in % by weight): from 10.6 to 18% of Al, from 10.5 to 14.5% of Ni, optionally up to 2% of Fe, optionally up to 1% of Co, optionally up to 0.5% of Ti, optionally up to 0.5% of Mn, optionally up to 0.15% of B, optionally up to 0.1% of Ca, and optionally up to 0.1% of C, with the balance being copper and unavoidable impurities…
Who is the assignee on this patent?
Wieland Werke Ag
What technology area does this patent fall under?
Primary CPC classification C22C9/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).