Peeling method of cover member and manufacturing method of liquid ejecting head

Patent metadata

Field	Value
Publication number	US-10479083-B2
Application number	US-201715830384-A
Country	US
Kind code	B2
Filing date	Dec 4, 2017
Priority date	Dec 13, 2016
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

Disclosed is a peeling method of a cover member including forming a recessed portion that opens one side surface of a substrate, on a region different from a region in which a pattern is formed and forming an opening region including the opening of the recessed portion; attaching the cover member so as to cover the one side surface; adjusting a pressure for increasing a pressure within a space formed by the recessed portion and the cover member by attaching the cover member to the substrate to be higher than a pressure on a side opposite to the space with the cover member interposed therebetween; and peeling off the cover member from the substrate, in a state where the pressure within the space is increased by the adjusting of the pressure.

First claim

What is claimed is:

1. A method for peeling a cover member off of a substrate, the method comprising:
forming a recessed portion that opens to one side surface of a substrate, wherein the recessed portion does not completely penetrate the substrate and is formed in a region of the substrate different from a region in which a pattern is formed in the substrate, and forming an opening region including the opening of the recessed portion, on the one side surface of the substrate;
attaching the cover member so as to cover the one side surface of the substrate including the opening region and the pattern;
adjusting a pressure for increasing a pressure within a space formed by the recessed portion and the attached cover member to be higher than a pressure on a side opposite to the space with the cover member interposed therebetween; and
peeling off the cover member from the substrate, in a state where the pressure within the space is increased by the adjusting of the pressure.

2. The method according to claim 1 ,
wherein in the peeling off of the cover member, a region, which is a surface of the cover member on a side opposite to the substrate, and includes at least a part of a region that overlaps with the opening region of the substrate, is pulled in a direction away from the substrate when viewed in a plan view from a stacking direction of the cover member and the substrate.

3. The method according to claim 2 ,
wherein the region for pulling the cover member includes a portion adjacent to the opening region in a region closer to an outer periphery side of the substrate than the opening region when viewed in a plan view from the stacking direction of the cover member and the substrate.

4. The method according to claim 1 ,
wherein in the adjusting of the pressure, the pressure within the space is increased by heating the substrate.

5. The method according to claim 4 ,
wherein a temperature of the substrate in the adjusting of the pressure is higher than a temperature of the substrate in the attaching of the cover member.

6. The method according to claim 1 ,
wherein a temperature of the substrate after the attaching of the cover member before the adjusting of the pressure is lower than a temperature of the substrate of the attaching of the cover member.

7. The method according to claim 1 ,
wherein in the forming of the opening region, a plurality of the groove-shaped recessed portions are juxtaposed in a direction intersecting an extension direction of the recessed portions.

8. The method according to claim 1 ,
wherein in the forming of the opening region, a plurality of columns in which the plurality of the recessed portions are juxtaposed are arranged in a direction intersecting a juxtaposing direction in which the recessed portions are juxtaposed.

9. The method according to claim 1 ,
wherein the peeling off of the cover member includes
moving gas within the space to an outer periphery of an interface between the substrate and the cover member, and
pinching and peeling off an end portion of the cover member which is peeled off from the substrate, by the gas moved in the moving of the gas.

10. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 1 .

11. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 2 .

12. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 3 .

13. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 4 .

14. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 5 .

15. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 6 .

16. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 7 .

17. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 8 .

18. A manufacturing method of a liquid ejecting head comprising:
the method according to claim 9 .

Assignees

• Seiko Epson Corp

Inventors

• Hotta Tatsuro

Classifications

• B41J2/1632

  machining · CPC title

• B32B2307/202

  Conductive · CPC title

• B32B9/043

  of natural rubber or synthetic rubber · CPC title

• B32B9/041

  of metal · CPC title

• B32B9/045

  of synthetic resin · CPC title