Acoustic wave detection probe and photoacoustic measurement apparatus provided with the same
US-9791417-B2 · Oct 17, 2017 · US
US10478859B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10478859-B2 |
| Application number | US-201615345479-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 7, 2016 |
| Priority date | Mar 2, 2006 |
| Publication date | Nov 19, 2019 |
| Grant date | Nov 19, 2019 |
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In one aspect, matching layers for an ultrasonic transducer stack having a matching layer comprising a matrix material loaded with a plurality of micron-sized and nano-sized particles. In another aspect, the matrix material is loaded with a plurality of heavy and light particles. In another aspect, an ultrasound transducer stack comprises a piezoelectric layer and at least one matching layer. In one aspect, the matching layer comprises a composite material comprising a matrix material loaded with a plurality of micron-sized and nano-sized particles. In a further aspect, the composite material can also comprise a matrix material loaded with a plurality of heavy and light particles. In a further aspect, a matching layer can also comprise cyanoacrylate.
Opening claim text (preview).
The invention claimed is: 1. An ultrasonic transducer stack, comprising: a plurality of layers comprising: a piezoelectric layer; at least one matching layer that comprises a first matching layer, which comprises cyanoacrylate; and a lens layer comprising TPX, wherein each layer of the plurality of layers has a top surface and an opposed bottom surface, wherein the first matching layer is connected to and underlies the bottom surface of the lens layer, and wherein the piezoelectric layer underlies the bottom surface of the matching layer. 2. The ultrasonic transducer stack of claim 1 , wherein the first matching layer is about a ¼ acoustic wavelength matching layer. 3. The ultrasonic transducer stack of claim 2 , wherein the acoustic impedance of the first matching layer is between about 2.0 MegaRayles (MR) to about 3.5 MegaRayles (MR). 4. The ultrasonic transducer stack of claim 2 , wherein the acoustic impedance of the first matching layer is between about 2.5 MegaRayles (MR) to about 2.8 MegaRayles (MR). 5. The ultrasonic transducer stack of claim 2 , wherein the acoustic impedance of the lens layer is about 1.8 MegaRayles (MR). 6. The ultrasonic transducer stack of claim 1 , wherein the acoustic impedance of the lens is substantially the same as the acoustic impedance of water. 7. The ultrasonic transducer stack of claim 1 , wherein the piezoelectric layer can generate ultrasound at a frequency of at least about 20 megahertz (MHz). 8. The ultrasonic transducer stack of claim 7 , wherein the piezoelectric layer can generate ultrasound at a frequency of about 20 MHz, 25 MHz, 30 MHz, 35 MHz, 40 MHz, 45 MHz, 50 MHz, 55 MHz, 60 MHz, or higher for transmission through the first matching layer and then through the lens layer. 9. The ultrasonic transducer stack of claim 1 , further comprising a second matching layer located between the top surface of the piezoelectric layer and the bottom surface of the first matching layer. 10. The ultrasonic transducer stack of claim 9 , wherein the top surface of the second matching layer is bonded to the bottom surface of the first matching layer using a bonding material. 11. The ultrasonic transducer stack of claim 10 , wherein the bonding material forms a bondline layer between the first matching layer and the second matching layer. 12. The ultrasonic transducer stack of claim 11 , wherein the bondline layer has an elevational thickness of less than about 5 microns. 13. The ultrasonic transducer stack of claim 11 , wherein the bondline layer has an elevational thickness of between about 1 micron to about 5 microns. 14. The ultrasonic transducer stack of claim 11 , wherein the bondline layer has an elevational thickness of between about 1 micron to about 3 microns.
Of addition polymer from unsaturated monomers · CPC title
Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators · CPC title
using refraction, e.g. acoustic lenses · CPC title
using interposed adhesives or interposed materials with bonding properties · CPC title
by using holders, e.g. positioning frames · CPC title
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