Ultrasound sensor element, ultrasound sensor array assembly, ultrasound transmit sensor element, imaging device, ultrasound transducer, and method of performing an ultrasound scan

US10478154B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10478154-B2
Application numberUS-201414772669-A
CountryUS
Kind codeB2
Filing dateMar 7, 2014
Priority dateMar 7, 2013
Publication dateNov 19, 2019
Grant dateNov 19, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods and apparatus for ultrasound imaging using ultrasound sensor elements comprising thin film transistors. Specifically, ultrasound elements for use in a two dimensional array of ultrasound elements, two dimensional arrays of ultrasound elements, ultrasound sensor element array assemblies, ultrasound imaging devices and methods of performing an ultrasound scan using a two dimensional array of ultrasound elements. A sensor element comprises: an ultrasound transducer, a transmit circuit configured to provide an electrical signal to the transducer for output of an ultrasound signal; and a receive circuit configured to receive an electrical signal from the transducer, based on a received reflected ultrasound signal, wherein the transmit and receive circuits each comprise one or more thin film transistors.

First claim

Opening claim text (preview).

The invention claimed is: 1. An ultrasound sensor array assembly comprising a two dimensional array of ultrasound sensor elements, each sensor element in the two dimensional array of ultrasound sensor elements comprising: an ultrasound transducer, a transmit circuit configured to provide an electrical signal to the transducer for output of an ultrasound signal; and a receive circuit configured to receive an electrical signal from the transducer, based on a received reflected ultrasound signal, wherein the transmit and receive circuits each comprise one or more thin film transistors; the sensor array assembly further comprising: a plurality of transmit delay circuits, wherein each transmit delay circuit is in electrical communication with each sensor element in a row of the array of sensor elements, and wherein the transmit delay circuits are configured to delay a transmit signal to the sensor elements in each row for steering a beam of emitted ultrasound; and a plurality of receive delay circuits, wherein each receive delay circuit is in electrical communication with each sensor element in a column of the array of sensor elements, and wherein the receive delay circuits are configured to delay a receive signal from the sensor elements in each column for steering the beam of received reflected ultrasound; wherein the plurality of transmit delay circuits are incorporated into a first driver circuit, and the plurality of receive delay circuits are incorporated into a second driver circuit, and the first and second driver circuits are located external and adjacent to the two dimensional array of ultrasound sensor elements. 2. The sensor array assembly according to claim 1 , wherein at least one of the transmit circuit or the receive circuit is configured to be selectively enabled. 3. The sensor array assembly according to claim 1 , wherein the transmit circuit comprises a level shifter configured to receive an electrical signal at a first voltage and emit an electrical signal at a second voltage for operating the transducer to emit an ultrasound signal. 4. The sensor array assembly according to claim 1 , wherein the receive circuit comprises a pre-amplifier configured to receive and amplify an electrical signal from the transducer. 5. The sensor array assembly according to claim 1 , wherein the receive circuit comprises an output amplifier configured to generate an output current. 6. The sensor array assembly according to claim 2 , wherein the receive circuit is selectively enabled by a receive enabling circuit configured to connect the receive circuit to one of a plurality of receive lines. 7. The sensor array assembly according to claim 1 , wherein the ultrasound transducer comprises a micro-electro-mechanical transducer. 8. The sensor array assembly according to claim 1 , wherein the transmit delay circuits and the receive delay circuits are configured to undertake one dimensional orthogonal beam steering. 9. The sensor array assembly according to claim 1 , configured to emit an ultrasound signal from one or more sensor elements forming a sub-aperture of the array. 10. An ultrasound imaging device comprising an ultrasound sensor array according to claim 1 . 11. The ultrasound imaging device according to claim 10 , wherein the two dimensional array of ultrasound sensor elements configured to emit ultrasound signals and receive reflected ultrasound signals is conformable, such that it may conform at least partially to the contours of a surface against which it is placed. 12. The sensor array assembly according to claim 1 , further comprising a switch that switches between connecting the transducer to the transmit circuit or to the receive circuit; wherein the switch comprises a first switch transistor that is connected to the transmit circuit for actuating the transmit circuit based on a transmit switch control signal, and a second switch transistor that is connected to the receive circuit for actuating the receive circuit based on a receive switch control signal; and wherein terminals of the first switch transistor and the second switch transistor are electrically connected to the transducer at a common node.

Assignees

Inventors

Classifications

  • Echo-tomography · CPC title

  • characterised by sound-transmitting media or devices for coupling the transducer to the tissue · CPC title

  • H04R19/00Primary

    Electrostatic transducers · CPC title

  • Electrostatic transducer · CPC title

  • Networks or arrays of similar microstructural devices · CPC title

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Frequently asked questions

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What does patent US10478154B2 cover?
Methods and apparatus for ultrasound imaging using ultrasound sensor elements comprising thin film transistors. Specifically, ultrasound elements for use in a two dimensional array of ultrasound elements, two dimensional arrays of ultrasound elements, ultrasound sensor element array assemblies, ultrasound imaging devices and methods of performing an ultrasound scan using a two dimensional array…
Who is the assignee on this patent?
Sharp Kk
What technology area does this patent fall under?
Primary CPC classification H04R19/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).