Microphone package

Patent metadata

Field	Value
Publication number	US-10477323-B2
Application number	US-201816053832-A
Country	US
Kind code	B2
Filing date	Aug 3, 2018
Priority date	Nov 20, 2012
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.

First claim

What is claimed is:

1. A sensor comprising:
a substrate;
a cover, a part of the cover including a magnetic body;
a film provided between the substrate and the cover, a first cavity being provided between the film and the cover; and
an element provided on the film between the substrate and the cover, the element including a first magnetic layer, a second magnetic layer, and a non-magnetic layer provided between the first magnetic layer and the second magnetic layer.

2. The sensor according to claim 1 , wherein a second cavity is provided between the film and the substrate.

3. The sensor according to claim 1 , wherein
the part of the cover overlaps the second magnetic layer in a direction of the magnetization of the second magnetic layer.

4. The sensor according to claim 1 , wherein
an electrical resistance between the first magnetic layer and the second magnetic layer changes depending on a strain of the film body.

5. The sensor according to claim 1 , wherein
the element is provided between the film and the cover.

6. The sensor according to claim 1 , wherein
the part of the cover includes a part of a side portion of the cover.

7. The sensor according to claim 1 , wherein
the part of the cover comprises a magnetic material.

8. A sensor comprising:
a substrate;
a cover, a part of the cover including a magnetic body;
a film provided between the substrate and the cover, a cavity being provided between the film and the substrate; and
an element provided on the film between the substrate and the cover, the element including a first magnetic layer, a second magnetic layer, and a non-magnetic layer provided between the first magnetic layer and the second magnetic layer.

9. The sensor according to claim 8 , wherein
an electrical resistance between the first magnetic layer and the second magnetic layer changes depending on a strain of the film body.

10. A sensor comprising:
a substrate;
a cover, a part of the cover including a magnetic body;
a film provided between the substrate and the cover, the film being deformable; and
an element provided on the film between the substrate and the cover, the element including a first magnetic layer, a second magnetic layer, and a non-magnetic layer provided between the first magnetic layer and the second magnetic layer.

11. The sensor according to claim 10 , wherein
an electrical resistance between the first magnetic layer and the second magnetic layer changes depending on a strain of the film body.

12. An electric circuit comprising:
the sensor according to claim 1 ; and
a power supply connected with the package.

13. An electric circuit comprising:
the sensor according to claim 8 ; and
a power supply connected with the package.

14. An electric circuit comprising:
the sensor according to claim 10 ; and
a power supply connected with the package.

Assignees

• Toshiba Kk

Inventors

• Higashi Yoshihiro
• Fuji Yoshihiko
• Hara Michiko
• Yuzawa Akiko
• Kaji Shiori
• Nagata Tomohiko
• Hori Akio
• Fukuzawa Hideaki

Classifications

• H04R7/10

  comprising superposed layers in contact · CPC title

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title