Parallel RC circuit equalizers

Patent metadata

Field	Value
Publication number	US-10476465-B2
Application number	US-201815864176-A
Country	US
Kind code	B2
Filing date	Jan 8, 2018
Priority date	Apr 20, 2015
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

Disclosed are apparatus and methodology for increasing the resonance frequency and useful frequency range of surface mount RC equalizer devices. The presently disclosed subject matter provides improved operational characteristics of generally known such RC equalizer devices by implementing a reverse geometry that relocates the internal termination points, as well as external termination points for such devices, along lateral portions of the assembled device. Such reverse geometry achieves improvements by providing a reduction of the equivalent series inductance (ESL) to provide the increased resonance frequency and useful frequency range.

First claim

What is claimed is:

1. A parallel RC circuit equalizer comprising:
a monolithic substrate having a first end, a second end, and a length between the first end and second end in a first direction, the monolithic substrate having a width in a second direction that is perpendicular to the first direction, the width of the monolithic substrate being greater than the length of the monolithic substrate;
a capacitor mounted on the monolithic substrate, the capacitor having a first electrode layer, a second electrode layer, and a dielectric separating the first electrode layer and the second electrode layer;
a resistor mounted on the monolithic substrate, the resistor connected in parallel with the capacitor;
a first terminal disposed at the first end of monolithic substrate and electrically connected to the first electrode layer of the capacitor; and
a second terminal disposed at the second end of monolithic substrate electrically connected to the second electrode layer of the capacitor.

2. The parallel RC circuit equalizer of claim 1 , wherein a resonance point of the parallel RC circuit equalizer is greater than 3,000 MHz.

3. The parallel RC circuit equalizer of claim 1 , wherein:
the monolithic substrate has a top surface; and
the first electrode layer and second electrode layer of the capacitor are mounted on the top surface of the substrate.

4. The parallel RC circuit equalizer of claim 1 , wherein:
the monolithic substrate has a top surface; and
the resistor is supported on the top surface of the substrate.

5. The parallel RC circuit equalizer of claim 1 , wherein the equalizer is surface mountable by direct mounting of the first and second terminations on a supporting surface.

6. The parallel RC circuit equalizer of claim 1 , wherein at least one of the first termination or second termination comprises a flexible polymer material.

7. The parallel RC circuit equalizer of claim 1 , wherein the capacitor comprises at least one of silicon oxynitride (SiON) or tantalum.

8. The parallel RC circuit equalizer of claim 1 , wherein the resistor comprises at least one of tantalum nitride (TaN) or ruthenium oxide.

9. The parallel RC circuit equalizer of claim 1 , wherein the equalizer has an impedance of about 50 Ω.

10. The parallel RC circuit equalizer of claim 1 , further comprising:
a first terminal layer connected to each of the first terminal and the first electrode layer of the capacitor; and
a second terminal layer connected to each of the second terminal and the second electrode layer of the capacitor;
wherein:
the monolithic substrate has a top surface, and the top surface has a pair of opposing lateral edges along the top surface;
the first terminal layer is positioned on the top surface of the substrate and along at least a portion of one of the pair of lateral edges of the top surface; and
the second terminal layer is positioned on the top surface of the substrate and along at least a portion of the other of the pair of lateral edges that is opposite the first terminal layer.

11. The parallel RC circuit equalizer of claim 10 , further comprising a third terminal layer connected to the resistor, the third terminal layer positioned on the top surface of the substrate and along at least a portion of one of the pair of lateral edges of the top surface.

12. A parallel RC circuit equalizer comprising:
a monolithic substrate that is elongated in a longitudinal direction between a pair of longitudinal ends;
an RC structure attached to the substrate, the RC structure comprising a capacitor and a resistor connected in parallel with the capacitor;
a pair of respective waveguide elements attached to the substrate and electrically connected to the RC structure, each of the pair of respective waveguide elements extending from the RC structure to a respective one of the pair of longitudinal ends of the substrate:
at least one ground electrode attached to the substrate and extending in the longitudinal direction.

13. The parallel RC circuit equalizer of claim 12 , wherein the substrate has a top surface and the RC structure is mounted on the top surface of the substrate.

14. The parallel RC circuit equalizer of claim 12 , wherein the pair of respective waveguide elements extend along a centerline of the top surface of the substrate, and wherein the centerline extends in the longitudinal direction.

15. The parallel RC circuit equalizer of claim 12 , wherein the parallel RC circuit equalizer is surface mountable by direct mounting of the terminations on a supporting surface.

16. The parallel RC circuit equalizer of claim 12 , wherein the capacitor of the RC structure comprises silicon oxynitride (SiON).

17. The parallel RC circuit equalizer of claim 12 , wherein the capacitor of the RC structure comprises tantalum.

18. The parallel RC circuit equalizer of claim 12 , wherein the resistor of the RC structure comprises tantalum nitride (TaN).

19. The parallel RC circuit equalizer of claim 12 , wherein the resistor of the RC structure comprises ruthenium oxide.

20. The parallel RC circuit equalizer of claim 12 , wherein the equalizer has an impedance of about 50 Ω.

21. The parallel RC circuit equalizer of claim 12 , further comprising a ground termination electrically connected with the at least one ground electrode.

22. The parallel RC circuit equalizer of claim 21 , wherein:
the monolithic substrate has a top surface and a pair of opposing lateral edges along the top surface that extend between the pair of longitudinal ends of the substrate;
the at least one ground electrode has a side edge that extends along one of the pair of opposing lateral edges of the substrate; and
the at least one ground electrode is electrically connected with the ground termination along at least a portion of the side edge of the at least one ground electrode.

23. The parallel RC circuit equalizer of claim 21 , wherein the ground termination is received at least a portion of the substrate.

24. The parallel RC circuit equalizer of claim 21 , wherein the ground termination is disposed centrally between the pair of longitudinal ends of the substrate.

25. The parallel RC circuit equalizer of claim 12 , further including a pair of end terminations disposed on respective longitudinal ends of the substrate, and each of the pair of end terminations is connected with a respective one of the pair of waveguide elements.

26. The parallel RC circuit equalizer of claim 25 , wherein the pair of end terminations comprise flexible terminations.

27. The parallel RC circuit equalizer of claim 25 , wherein the pair of end terminations comprise a flexible polymer material.

28. A parallel RC circuit equalizer, comprising:
a monolithic substrate that is elongated in a longitudinal direction between a pair of longitudinal ends;
a capacitor supported on the substrate, the capacitor having a first electrode layer, a second electrode layer, and a dielectric layer between the first and second electrode layers;
a resistor supported on the substrate and electrically connected in parallel with the capacitor;
a first terminal disposed along one of the pair of longitudinal ends;
a second terminal disposed along the other of the pair of longitudinal ends;
a first waveguide element attached to the substrate and electrically connected to the first electrode layer of the capacitor, the first wavegu

Assignees

• Avx Corp

Inventors

• Korony Gheorghe

Classifications

• H03H7/06 Primary

  including resistors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence) · CPC title

• H03H1/02

  RC networks, e.g. filters · CPC title

• H04B10/516

  Details of coding or modulation · CPC title

• H04B3/04 Primary

  Control of transmission; Equalising · CPC title

• H04B10/40

  Transceivers · CPC title