Semiconductor device, manufacturing method for semiconductor device, and electrode plate

Patent metadata

Field	Value
Publication number	US-10475727-B2
Application number	US-201815923018-A
Country	US
Kind code	B2
Filing date	Mar 16, 2018
Priority date	Mar 21, 2017
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

A semiconductor device includes an electrode plate, a metallic member, and solder connecting the metallic member with the electrode plate. On a surface of the electrode plate, a first groove and a group of second grooves are provided. The first groove has first to fourth linear parts. The group of second grooves is arranged within a range surrounded by the first groove, and has end portions on an outer periphery side that are connected with the first groove. The group of second grooves includes first to fourth sets. Each of the sets includes a plurality of second grooves connected with the first to fourth linear parts. When the metallic member is seen in a lamination direction of the electrode plate and the metallic member, an outer peripheral edge of a region of the metallic member, the region being connected with the solder, goes across the first to fourth sets.

First claim

What is claimed is:

1. A semiconductor device comprising:
an electrode plate, on a surface of which, a first groove having a rectangular ring shape and a plurality of sets of second grooves are provided,
the first groove having a first linear part, a second linear part, a third linear part, and a fourth linear part extending along respective four sides of the rectangular ring shape,
the plurality of sets of second grooves being arranged within a range surrounded by the fours sides of the first groove and having end portions on an outer periphery side that are connected with the first groove,
each of the plurality of sets of second grooves including a plurality of second grooves, and
the plurality of sets of second grooves including:
a first set of second grooves having a plurality of second grooves connected with the first linear part of the first groove,
a second set of second grooves having a plurality of second grooves connected with the second linear part of the first grooves,
a third set of second grooves having a plurality of second grooves connected with the third linear part of the first groove, and
a fourth set of second grooves having a plurality of second grooves connected with the fourth linear part of the first groove;

a metallic member; and
solder that connects a surface of the electrode plate within the range and a surface of the metallic member, the surface of the metallic member facing the surface of the electrode plate, wherein,
when the metallic member is seen in a lamination direction of the electrode plate and the metallic member, an outer peripheral edge of a region of the metallic member, the region being connected with the solder, is arranged so as to go across the first set of second groove, the second set of second groove, the third set of second groove, and the fourth set of second groove, and
wherein the electrode plate includes a flat surface in a center of the range, the flat surface not having the plurality of sets of second grooves.

2. A semiconductor device comprising:
an electrode plate, on a surface of which, a first groove having a rectangular ring shape and a plurality of sets of second grooves are provided,
the first groove having a first linear part, a second linear part, a third linear part, and a fourth linear part extending along respective four sides of the rectangular ring shape,
the plurality of sets of second grooves being arranged within a range surrounded by the fours sides of the first groove and having end portions on an outer periphery side that are connected with the first groove,
each of the plurality of sets of second grooves including a plurality of second grooves, and
the plurality of sets of second grooves including:
a first set of second grooves having a plurality of second grooves connected with the first linear part of the first groove,
a second set of second grooves having a plurality of second grooves connected with the second linear part of the first grooves,
a third set of second grooves having a plurality of second grooves connected with the third linear part of the first groove, and
a fourth set of second grooves having a plurality of second grooves connected with the fourth linear part of the first groove;

a metallic member; and
solder that connects a surface of the electrode plate within the range and a surface of the metallic member, the surface of the metallic member facing the surface of the electrode plate, wherein,
when the metallic member is seen in a lamination direction of the electrode plate and the metallic member, an outer peripheral edge of a region of the metallic member, the region being connected with the solder, is arranged so as to go across the first set of second groove, the second set of second groove, the third set of second groove, and the fourth set of second groove and, set of second groove, the third set of second groove, and the fourth set of second groove, and, and
wherein the second grooves of the first set are not connected with the second grooves of the second to fourth sets, and the solder is covered by resin.

3. The semiconductor device according to claim 1 wherein each of the second grooves is connected perpendicularly with the first groove.

4. The semiconductor device according to claim 1 wherein a semiconductor chip is connected with a surface of the metallic member on the opposite side of the electrode plate through solder.

5. The semiconductor device according to claim 1 , wherein the metallic member is a surface electrode of a semiconductor chip.

6. An electrode plate for connecting a semiconductor chip comprising:
an electrode plate, on a surface of which, a first groove and a plurality of sets of second grooves are provided,
the first groove having a first linear part, a second linear part, a third linear part, and a fourth linear part extending along respective four sides of a rectangular ring shape,
the plurality of sets of second grooves being arranged within a range surrounded by the respective four sides of the first groove and having end portions on an outer periphery side that are connected with the first groove,
each of the plurality of sets of second grooves including a plurality of second grooves,
the plurality of sets of second grooves including:
a first set of second grooves having a plurality of second grooves connected with the first linear part of the first groove,
a second set of second grooves having a plurality of second grooves connected with the second linear part of the first groove,
a third set of second grooves having a plurality of second grooves connected with the third linear part of the first groove, and
a fourth set of second grooves having the plurality of second grooves connected with the fourth linear part of the first groove, and

the range being for joining a solder,
wherein the electrode plate includes a flat surface in a center of the range, the flat surface not having the plurality of sets of second grooves.

Assignees

• Toyota Motor Co Ltd

Inventors

• Takahagi Satoshi
• Funano Syou
• Kadoguchi Takuya
• Hanaki Yuji
• Iwasaki Shingo
• Kawashima Takanori

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/865

  Die-attach connectors and bond wires · CPC title

• H10W72/07336

  Soldering or alloying · CPC title