Semiconductor module and conductive member for semiconductor module including cut in bent portion

Patent metadata

Field	Value
Publication number	US-10475667-B2
Application number	US-201415518353-A
Country	US
Kind code	B2
Filing date	Nov 6, 2014
Priority date	Nov 6, 2014
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

A semiconductor module is provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode. The conductive member is made up of a metal sheet, and has a bent portion at the one end and at the other end. The bent portion provided at the one end has a cut in a leading end portion, in the longitudinal direction, and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element. As a result, a semiconductor module can be realized that allows combination of increased current capacity with improved reliability.

First claim

The invention claimed is:

1. A semiconductor module provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode,
wherein the conductive member
is made up of a metal sheet; and
has a straight portion connecting a bent portion at the one end and at the other end in a first direction; and
a leading end portion provided at the one end has a cut, in the longitudinal direction, such that an end joining section at which the cut is not present is joined to the electrode of the semiconductor element without extending beyond an edge of the straight portion in the first direction,
wherein the conductive member is made up of two or more separate members individually joined to the electrode of the semiconductor element without being joined to each other at the leading end portion,
wherein a resist is applied onto a portion, of the conductive member, exposed by the cut at a tip of the cut that is formed in the bent portion at the one end.

2. The semiconductor module of claim 1 ,
wherein the other end of the conductive member is connected to an external conductive member wired from an electronic component that makes up another circuit.

3. The semiconductor module of claim 1 ,
wherein the cut formed in the conductive member is provided over an extent such that the length of the cut in the longitudinal direction does not exceed the length, in the longitudinal direction, of the bent portion provided at the one end.

4. The semiconductor module of claim 1 ,
wherein the conductive member is configured in the form of sheet metal of copper or aluminum.

5. The semiconductor module of claim 1 ,
wherein the conductive member is joined to the electrode of the semiconductor element by any one of solder joining, metal-particle sintering joining, conductive-adhesive joining and ultrasonic joining.

6. The semiconductor module of claim 1 ,
wherein the one end of the conductive member is opposite to the other end of the conductive member.

7. The semiconductor module of claim 1 ,
wherein the end joining section has a rectangular shape, and
wherein the cut is provided in the conductive member in such a manner that the diagonal length of the end joining section having the rectangular shape is 10 mm or less.

8. The semiconductor module of claim 7 ,
wherein the other end of the conductive member is connected to an external conductive member wired from an electronic component that makes up another circuit.

9. The semiconductor module of claim 7 ,
wherein the cut formed in the conductive member is provided over an extent such that the length of the cut in the longitudinal direction does not exceed the length, in the longitudinal direction, of the bent portion provided at the one end.

10. The semiconductor module of claim 7 ,
wherein the conductive member is configured in the form of sheet metal of copper or aluminum.

11. The semiconductor module of claim 7 ,
wherein the conductive member is joined to the electrode of the semiconductor element by any one of solder joining, metal-particle sintering joining, conductive-adhesive joining and ultrasonic joining.

12. A conductive member for a semiconductor module, being a conductive member that is used in a semiconductor module, the conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, inside the semiconductor module, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode, wherein
the conductive member is made up of a metal sheet; and
has a straight portion connecting a bent portion at the one end and at the other end in a first direction; and
a leading end portion provided at the one end has a cut in the longitudinal direction and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element without extending beyond an edge of the straight portion in the first direction,
wherein the conductive member is made up of two or more separate members individually joined to the electrode of the semiconductor element without being joined to each other at the leading end portion,
wherein a resist is applied onto a portion, of the conductive member, exposed by the cut at a tip of the cut that is formed in the bent portion at the one end.

13. The conductive member of claim 12 ,
wherein the one end of the conductive member is opposite to the other end of the conductive member.

Assignees

• Mitsubishi Electric Corp

Inventors

• Tani Masakazu
• Deguchi Yoshiyuki
• Sakata Kazuki

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07654

  changes in dispositions · CPC title

• H10W72/07652

  changes in structures or sizes · CPC title

• H10W72/07637

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title