Dielectric composites, and multi-layered capacitors and electronic devices comprising thereof

US10475583B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10475583-B2
Application numberUS-201815875386-A
CountryUS
Kind codeB2
Filing dateJan 19, 2018
Priority dateJan 19, 2017
Publication dateNov 12, 2019
Grant dateNov 12, 2019

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  1. Title

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  5. First independent claim

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Abstract

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A dielectric composite including a plurality of crystal grains including a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer includes a two-dimensional layered material covering at least a portion of a surface of at least one of the crystal grains, and a multi-layered capacitor and an electronic device including the same.

First claim

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What is claimed is: 1. A dielectric composite, comprising: a plurality of crystal grains comprising a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer comprises a two-dimensional layered material covering at least a portion of a surface of at least one of the crystal grains. 2. The dielectric composite of claim 1 , wherein the two-dimensional layered material comprises a single layer. 3. The dielectric composite of claim 1 , wherein the two-dimensional layered material comprises two or more laminated layers. 4. The dielectric composite of claim 1 , wherein the two-dimensional layered material directly contacts the surface of at least one of the crystal grains. 5. The dielectric composite of claim 1 , wherein the two-dimensional layered material covers an entirety of the surface of at least one of the crystal grains. 6. The dielectric composite of claim 1 , wherein the two-dimensional layered material has a thickness of less than or equal to about 120 nanometers. 7. The dielectric composite of claim 1 , wherein the two-dimensional layered material has a relative permittivity of greater than or equal to about 50 and less than or equal to about 1000. 8. The dielectric composite of claim 1 , wherein the grain boundary insulation layer further comprises a three-dimensional bulk material combined with the two-dimensional layered material. 9. The dielectric composite of claim 1 , wherein the two-dimensional layered material is present in a range of about 10 volume % to about 100 volume %, based on 100 volume % of the grain boundary insulation layer. 10. The dielectric composite of claim 1 , wherein the two-dimensional layered material is delaminated from a material comprising an aurivillius phase, a material comprising a Ruddlesden-Popper phase, a material comprising a Dion-Jacobson phase, titano-niobate, or a combination thereof. 11. The dielectric composite of claim 1 , wherein the two-dimensional layered material is represented by Chemical Formula 1: X m (A (n-1) B′ n O (3n+1) )  Chemical Formula 1 wherein, in Chemical Formula 1, X comprises H, an alkali metal, a cationic compound, or a combination thereof, A comprises Ca, Na, Ta, Bi, Ba, Sr, or a combination thereof, B comprises W, Mo, Cr, Ta, Nb, V, Zr, Hf, Pb, Sn, La, Ti, or a combination thereof, 0≤m≤2, and n≥1. 12. The dielectric composite of claim 11 , wherein X comprises the cationic compound, and the cationic compound comprises a tetramethylammonium compound, a tetraethylammonium compound, a tetrapropylammonium compound, a tetrabutylammonium compound, a methylamine compound, an ethylamine compound, a propylamine compound, a butylamine compound, a polyethylenimine compound, or a combination thereof. 13. The dielectric composite of claim 11 , wherein the two-dimensional layered material represented by Chemical Formula 1 is electrically neutral. 14. The dielectric composite of claim 1 , wherein the crystal grains comprise barium titanate, strontium titanate, lead titanate, lead zirconate, lead titanate zirconate, or a combination thereof. 15. The dielectric composite of claim 1 , wherein the crystal grains have an average particle diameter in a range of about 50 nanometers to about 2 micrometers. 16. The dielectric composite of claim 1 , wherein the dielectric composite has a relative permittivity of greater than or equal to about 1,000 and less than or equal to about 20,000. 17. A multi-layered capacitor comprising: laminated alternate layers comprising an internal electrode, and a dielectric layer, wherein the dielectric layer comprises the dielectric composite of claim 1 . 18. The multi-layered capacitor of claim 17 , wherein the internal electrode and the dielectric layer comprise three or more laminated layers. 19. The multi-layered capacitor of claim 17 , wherein the dielectric layer has a thickness of less than about 500 nanometers. 20. The multi-layered capacitor of claim 17 , wherein the dielectric layer has a relative permittivity of greater than or equal to about 4,000 and less than or equal to about 40,000. 21. An electronic device comprising the dielectric composite of claim 1 . 22. The electronic device of claim 21 , wherein the electronic device is a varistor, a thermistor, or a capacitor for storing energy. 23. The dielectric composite of claim 1 , where the grain boundary insulation layer surrounds one or more of the crystal grains. 24. A dielectric composite, comprising: a plurality of crystal grains comprising a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer comprises a material represented by Chemical Formula 1: X m (A (n-1) B′ n O (3n+1) )  Chemical Formula 1 wherein, in Chemical Formula 1, X comprises H, an alkali metal, a cationic compound, or a combination thereof, A comprises Ca, Na, Ta, Bi, Ba, Sr, or a combination thereof, B comprises W, Mo, Cr, Ta, Nb, V, Zr, Hf, Pb, Sn, La, Ti, or a combination thereof, 0≤m≤2, and n≥1, and wherein the grain boundary insulation layer has a thickness in a range of about 5 nanometers to about 99 nanometers.

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What does patent US10475583B2 cover?
A dielectric composite including a plurality of crystal grains including a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer includes a two-dimensional layered material covering at least a portion of a surface of at least one of the crystal grains, and a multi-layered capacitor and an electronic de…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).