Two-dimensional perovskite material, dielectric material and multi-layered capacitor including the same
US-2018286586-A1 · Oct 4, 2018 · US
US10475583B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10475583-B2 |
| Application number | US-201815875386-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 19, 2018 |
| Priority date | Jan 19, 2017 |
| Publication date | Nov 12, 2019 |
| Grant date | Nov 12, 2019 |
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A dielectric composite including a plurality of crystal grains including a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer includes a two-dimensional layered material covering at least a portion of a surface of at least one of the crystal grains, and a multi-layered capacitor and an electronic device including the same.
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What is claimed is: 1. A dielectric composite, comprising: a plurality of crystal grains comprising a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer comprises a two-dimensional layered material covering at least a portion of a surface of at least one of the crystal grains. 2. The dielectric composite of claim 1 , wherein the two-dimensional layered material comprises a single layer. 3. The dielectric composite of claim 1 , wherein the two-dimensional layered material comprises two or more laminated layers. 4. The dielectric composite of claim 1 , wherein the two-dimensional layered material directly contacts the surface of at least one of the crystal grains. 5. The dielectric composite of claim 1 , wherein the two-dimensional layered material covers an entirety of the surface of at least one of the crystal grains. 6. The dielectric composite of claim 1 , wherein the two-dimensional layered material has a thickness of less than or equal to about 120 nanometers. 7. The dielectric composite of claim 1 , wherein the two-dimensional layered material has a relative permittivity of greater than or equal to about 50 and less than or equal to about 1000. 8. The dielectric composite of claim 1 , wherein the grain boundary insulation layer further comprises a three-dimensional bulk material combined with the two-dimensional layered material. 9. The dielectric composite of claim 1 , wherein the two-dimensional layered material is present in a range of about 10 volume % to about 100 volume %, based on 100 volume % of the grain boundary insulation layer. 10. The dielectric composite of claim 1 , wherein the two-dimensional layered material is delaminated from a material comprising an aurivillius phase, a material comprising a Ruddlesden-Popper phase, a material comprising a Dion-Jacobson phase, titano-niobate, or a combination thereof. 11. The dielectric composite of claim 1 , wherein the two-dimensional layered material is represented by Chemical Formula 1: X m (A (n-1) B′ n O (3n+1) ) Chemical Formula 1 wherein, in Chemical Formula 1, X comprises H, an alkali metal, a cationic compound, or a combination thereof, A comprises Ca, Na, Ta, Bi, Ba, Sr, or a combination thereof, B comprises W, Mo, Cr, Ta, Nb, V, Zr, Hf, Pb, Sn, La, Ti, or a combination thereof, 0≤m≤2, and n≥1. 12. The dielectric composite of claim 11 , wherein X comprises the cationic compound, and the cationic compound comprises a tetramethylammonium compound, a tetraethylammonium compound, a tetrapropylammonium compound, a tetrabutylammonium compound, a methylamine compound, an ethylamine compound, a propylamine compound, a butylamine compound, a polyethylenimine compound, or a combination thereof. 13. The dielectric composite of claim 11 , wherein the two-dimensional layered material represented by Chemical Formula 1 is electrically neutral. 14. The dielectric composite of claim 1 , wherein the crystal grains comprise barium titanate, strontium titanate, lead titanate, lead zirconate, lead titanate zirconate, or a combination thereof. 15. The dielectric composite of claim 1 , wherein the crystal grains have an average particle diameter in a range of about 50 nanometers to about 2 micrometers. 16. The dielectric composite of claim 1 , wherein the dielectric composite has a relative permittivity of greater than or equal to about 1,000 and less than or equal to about 20,000. 17. A multi-layered capacitor comprising: laminated alternate layers comprising an internal electrode, and a dielectric layer, wherein the dielectric layer comprises the dielectric composite of claim 1 . 18. The multi-layered capacitor of claim 17 , wherein the internal electrode and the dielectric layer comprise three or more laminated layers. 19. The multi-layered capacitor of claim 17 , wherein the dielectric layer has a thickness of less than about 500 nanometers. 20. The multi-layered capacitor of claim 17 , wherein the dielectric layer has a relative permittivity of greater than or equal to about 4,000 and less than or equal to about 40,000. 21. An electronic device comprising the dielectric composite of claim 1 . 22. The electronic device of claim 21 , wherein the electronic device is a varistor, a thermistor, or a capacitor for storing energy. 23. The dielectric composite of claim 1 , where the grain boundary insulation layer surrounds one or more of the crystal grains. 24. A dielectric composite, comprising: a plurality of crystal grains comprising a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer comprises a material represented by Chemical Formula 1: X m (A (n-1) B′ n O (3n+1) ) Chemical Formula 1 wherein, in Chemical Formula 1, X comprises H, an alkali metal, a cationic compound, or a combination thereof, A comprises Ca, Na, Ta, Bi, Ba, Sr, or a combination thereof, B comprises W, Mo, Cr, Ta, Nb, V, Zr, Hf, Pb, Sn, La, Ti, or a combination thereof, 0≤m≤2, and n≥1, and wherein the grain boundary insulation layer has a thickness in a range of about 5 nanometers to about 99 nanometers.
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