Systems, devices and methods for wirelessly delivering haptic effects

Patent metadata

Field	Value
Publication number	US-10475302-B2
Application number	US-201816172352-A
Country	US
Kind code	B2
Filing date	Oct 26, 2018
Priority date	Dec 7, 2017
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

Systems, devices, and methods for wirelessly delivering haptic effects are provided. The devices may include haptic actuators secured to various substrates, including the body and clothing of a user. The haptic actuators may be secured via adhesive and/or may be applied as a curable liquid. The haptic actuators may include an actuator element and a power element. The power element may include an antenna for receiving wireless power and control signals that may be transferred to the haptic actuator to cause a haptic effect.

First claim

What is claimed is:

1. A haptic enabled device for providing a haptic effect, comprising:
an actuator element including an electrode layer, a smart material layer, and a grounding electrode layer, wherein the grounding electrode layer is configured for contact with a substrate; and
a power element configured to receive a haptic control signal, the power element comprising a first contact and a second contact,
wherein
the electrode layer is configured for location between the smart material layer and the power element,
the first contact is configured for electrical communication with the electrode layer,
the second contact is configured for electrical communication with the grounding electrode layer,
the power element is configured to induce a voltage differential between the electrode layer and the grounding electrode layer in response to the haptic control signal, and
the smart material layer is configured for actuation in response to the voltage differential for providing the haptic effect to the substrate,

wherein at least one of the electrode layer, the smart material layer, and the grounding electrode layer is applied as a liquid.

2. The device of claim 1 , wherein the smart material layer is applied to the grounding electrode layer as a liquid, and the electrode layer is applied to the smart material layer as a liquid after curing of the smart material layer.

3. The device of claim 1 , wherein the smart material layer overlays only a portion of the grounding electrode layer leaving a first exposed portion of the grounding electrode layer and the electrode layer overlays only a portion of the smart material layer leaving a second exposed portion of the smart material layer.

4. The device of claim 3 , wherein the second contact of the power element is configured to be in contact with the first exposed portion of the grounding electrode layer.

5. The device of claim 1 , wherein the smart material layer overlays the grounding electrode layer to cover substantially all of the grounding electrode layer and the electrode layer overlays the smart material layer to cover substantially all of the smart material layer.

6. The device of claim 5 , wherein the second contact of the power element is configured to penetrate the electrode layer and the smart material layer to contact the grounding electrode layer.

7. The device of claim 1 , further including at least one additional actuator element overlaying the actuator element.

8. The device of claim 1 , wherein the power element further includes an antenna in electrical communication with the first contact and the second contact, the antenna being configured to receive a wireless signal.

9. A method for providing a haptic effect, comprising:
securing an actuator element to a substrate, the actuator element having an electrode layer, a smart material layer, and a grounding electrode layer;
securing a power element to the actuator element to form a haptic device, wherein the power element includes a first contact and a second contact and is configured to receive a haptic control signal;
receiving, at the power element, the haptic control signal;
transferring the haptic control signal to the electrode layer and the grounding electrode layer via the first contact and the second contact to cause a voltage differential between the electrode layer and the grounding electrode layer; and
actuating the smart material layer by the voltage differential to provide the haptic effect.

10. The method of claim 9 , wherein securing the actuator element to the substrate includes forming the actuator element in situ by,
applying a conductive liquid to the substrate to cure as the grounding electrode layer;
applying a liquid polymer to the grounding electrode layer to cure as the smart material layer overlaying at least a portion of the grounding electrode layer; and
applying a conductive liquid to the smart material layer to cure as the electrode layer overlaying at least a portion of the smart material layer.

11. The method of claim 9 , wherein securing the power element to the actuator element to form the haptic device includes adhering the power element to the electrode layer of the actuator element.

12. The method of claim 9 , wherein securing the actuator element to the substrate includes forming the actuator element by overlaying the smart material layer on the grounding electrode layer to leave an exposed portion of the grounding electrode layer and overlaying the electrode layer on the smart material layer to leave an exposed portion of the smart material layer.

13. The method of claim 12 , wherein securing the power element to the actuator element to form the haptic device includes disposing the second contact of the power element to contact the exposed portion of the grounding electrode layer.

14. The method of claim 9 , wherein securing the actuator element to the substrate includes forming the actuator element by overlaying the smart material layer on the grounding electrode layer to cover substantially all of the grounding electrode layer and overlaying the electrode layer on the smart material layer to cover substantially all of the smart material layer.

15. The method of claim 14 , wherein securing the power element to the actuator element to form the haptic device includes penetrating the electrode layer and the smart material layer with the second contact to contact the grounding electrode layer.

16. The method of claim 9 , wherein the power element further includes an antenna in electrical communication with the first contact and the second contact, the method further comprising
receiving a wireless signal at the antenna.

17. A haptic enabled device for providing a haptic effect, comprising:
an actuator element including an electrode layer, a smart material layer, and a grounding electrode layer, wherein the grounding electrode layer is configured for contact with a substrate; and
a power element configured to receive a haptic control signal, the power element comprising a first contact and a second contact, wherein
the electrode layer is configured for location between the smart material layer and the power element,
the first contact is configured for electrical communication with the electrode layer,
the second contact is configured for electrical communication with the grounding electrode layer,
the power element is configured to induce a voltage differential between the electrode layer and the grounding electrode layer in response to the haptic control signal, and
the smart material layer is configured for actuation in response to the voltage differential for providing the haptic effect to the substrate.

18. The device of claim 17 , wherein the power element further includes an antenna in electrical communication with the first contact and the second contact, the antenna being configured to receive a wireless signal.

19. The device of claim 17 , wherein the smart material layer overlays only a portion of the grounding electrode layer leaving a first exposed portion of the grounding electrode layer and the electrode layer overlays only a portion of the smart material layer leaving a second exposed portion of the smart material layer.

20. The device of claim 19 , wherein the second contact of the power element is configured to be in contact with the first exposed portion of the grounding electrode layer.

Assignees

• Immersion Corp

Inventors

• Mandeville Alexia
• Cruz-Hernandez Juan Manuel
• Khoshkava Vahid

Classifications

• H01Q9/0407

  Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title

• H01Q1/225

  used in level-measurement devices, e.g. for level gauge measurement · CPC title

• G06F3/016 Primary

  Input arrangements with force or tactile feedback as computer generated output to the user · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• G06F3/014

  Hand-worn input/output arrangements, e.g. data gloves · CPC title