Electronic component transportation device and method for manufacturing electronic component array
US-9919880-B2 · Mar 20, 2018 · US
US10472187B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10472187-B2 |
| Application number | US-201815885854-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 1, 2018 |
| Priority date | Sep 10, 2015 |
| Publication date | Nov 12, 2019 |
| Grant date | Nov 12, 2019 |
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An electronic component transportation device includes a rotation path and a first magnetic force generator. The rotation path extends along a transportation direction of an electronic component with a rectangular or substantially rectangular parallelepiped shape. The rotation path is inclined with respect to a horizontal direction. The rotation path includes a first surface and a second surface intersecting with each other. The first magnetic force generator is arranged at a lateral side of the rotation path.
Opening claim text (preview).
What is claimed is: 1. An electronic component transportation device comprising: a first magnetic force generator that is arranged at one lateral side of a first surface of a rotation path; wherein the first magnetic force generator is arranged such that a center line passing through an N pole and an S pole thereof is inclined with respect to a horizontal direction. 2. The electronic component transportation device according to claim 1 , wherein the first magnetic force generator is arranged such that the center line passing through the S pole and the N pole thereof and the first surface of the rotation path are perpendicular or substantially perpendicular to each other. 3. The electronic component transportation device according to claim 1 , wherein one surface of the S pole and the N pole thereof is parallel or substantially parallel to the first surface of the rotation path. 4. The electronic component transportation device according to claim 1 , wherein the rotation path includes the first surface and a second surface that intersect with each other, extend along a transportation direction of an electronic component having a rectangular or substantially rectangular parallelepiped shape, and are inclined with respect to the horizontal direction. 5. The electronic component transportation device according to claim 4 , wherein an angle defined by the first surface and the second surface is neither 90° nor about 90°. 6. The electronic component transportation device according to claim 4 , wherein an angle defined by the first surface and the second surface is larger than about 90°. 7. The electronic component transportation device according to claim 4 , wherein an angle defined by the first surface and the second surface is 90°. 8. The electronic component transportation device according to claim 4 , wherein an inclination angle of the first surface with respect to the horizontal direction is larger than an inclination angle of the second surface with respect to the horizontal direction. 9. The electronic component transportation device according to claim 4 , wherein the center line passing through the N pole and the S pole of the first magnetic force generator passes through the first surface; and L 1 >D/2 is satisfied when a minimal distance between an intersection of the center line and the first surface and an intersection of the first and second surfaces is L 1 and a larger dimension of a width and a height of the electronic component is D. 10. The electronic component transportation device according to claim 4 , further comprising a second magnetic force generator at a lateral side of the second surface in the rotation path and at a downstream side relative to the first magnetic force generator. 11. The electronic component transportation device according to claim 1 , further comprising a cover covering the rotation path. 12. A method for manufacturing an electronic component array comprising aligning lamination directions of a plurality of electronic components using the electronic component transportation device according to claim 1 . 13. The method for manufacturing the electronic component array according to claim 12 , further comprising accommodating in a tape the plurality of electronic components in which the lamination directions thereof have been aligned.
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