Tire Buffing Apparatus With Belt Detection System
US-2016318270-A1 · Nov 3, 2016 · US
Method for retreading a tire casing
US10471670B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10471670-B2 |
| Application number | US-201415107278-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 18, 2014 |
| Priority date | Dec 23, 2013 |
| Publication date | Nov 12, 2019 |
| Grant date | Nov 12, 2019 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A method for retreading a tire casing is disclosed herein. The method includes a tread is disposed on a casing carcass with a bonding layer being interposed in between, and a strip is tensioned through several circuits on the tread. Also disclosed herein is a tire employing the a method of retreading disclosed herein.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for retreading a tire casing, comprising: disposing a tread on a casing carcass with a bonding layer being interposed in between, winding a strip around the tread multiple times circumferentially while tensioning it on the tread, and inflating the carcass before winding the strip around the tread while tensioning it. 2. The method according to claim 1 , wherein the strip is initially placed on the tread in a first circuit without the strip being tensioned. 3. The method according to claim 1 , wherein the circuits or at least two of the circuits are contiguous. 4. The method according to claim 3 , wherein winding the circuits includes winding a plurality of first layer circuits into a first layer, wherein the first layer circuits are disposed in an edge to edge relationship with adjacent first layer circuits. 5. The method according to claim 4 , wherein winding the circuits includes winding a plurality of second circuits into a second layer, wherein the second layer circuits are disposed in an edge to edge relationship with adjacent second layer circuits. 6. The method according to claim 5 , wherein the edges of the plurality of first layer circuits are axially offset from the edges of the plurality of second layer circuits. 7. The method according to claim 1 , wherein the strip is wrapped in at least two superposed layers. 8. The method according to claim 7 , wherein each layer comprises several circuits and the circuits are offset from one layer to another. 9. The method according to claim 1 , wherein the bonding layer is heated. 10. The method according to claim 1 , wherein the strip is removed. 11. The method according claim 1 , wherein the strip is inextensible along its length. 12. The method according to claim 1 , wherein the strip comprises a heat-shrinkable material. 13. The method according to claim 1 , wherein the strip comprises cables. 14. The method according to claim 1 , wherein the strip is wrapped in at least three superposed layers. 15. The method according to claim 1 , wherein the bonding layer comprises hot-melt material. 16. The method according to claim 1 , wherein the carcass is inflated to at least 2 Bar.
Assignees
Inventors
Classifications
- B29D30/54Primary
Retreading · CPC title
Applying an intermediate adhesive layer, e.g. cement or cushioning element between carcass and tread · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10471670B2 cover?
- A method for retreading a tire casing is disclosed herein. The method includes a tread is disposed on a casing carcass with a bonding layer being interposed in between, and a strip is tensioned through several circuits on the tread. Also disclosed herein is a tire employing the a method of retreading disclosed herein.
- Who is the assignee on this patent?
- Astier Cedric, Marcet Gregory, Michelin & Cie, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B29D30/54. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).