Photocurable compositions

US10471633B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10471633-B2
Application numberUS-201515524557-A
CountryUS
Kind codeB2
Filing dateNov 3, 2015
Priority dateNov 4, 2014
Publication dateNov 12, 2019
Grant dateNov 12, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a method for the preparation of dies for moulds for the production of tiles with three dimensional texture.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for preparing tiles with a 3D texture, comprising: forming the tiles employing a mould equipped with a die prepared by a process comprising the steps of: I) providing a photocurable composition containing: a) from 70 to 99% by weight (% wt) of at least one ethylenically unsaturated compound; and b) from 1 to 12% wt of at least one photoinitiator; II) applying the photocurable composition onto the surface of a base-die to form a film with a three dimensional pattern; and III) photocuring the photocurable composition by exposing the surface of the base-die to light having a wavelength of from 200 to 600 nm to provide the 3D texture on the die for tile forming; with the proviso that the film, obtained by photocuring 200 g/m 2 of the photocurable composition on a steel plate, has an elastic hardness of from about 50 to about 300 sec determined according to the standard method ISO 1522:2006. 2. The method of claim 1 , wherein the photocurable composition produces a film having an elastic hardness of from about 80 to about 250 sec. 3. The method of claim 1 , wherein the photocurable compositions comprises: from 75 to 95% wt of at least one ethylenically unsaturated compound; and from 3 to 10% wt of at least one photoinitiator. 4. The method of claim 1 , wherein the 70 to 99% by weight (% wt) of at least one ethylenically unsaturated compound, based on the total weight of the component, consist of: from 0 to 40% wt of ethylenically unsaturated compounds having one ethylenically unsaturated group, from 0 to 60% by weight of ethylenically unsaturated compounds having two ethylenically unsaturated groups, from 0 to 70% wt of ethylenically unsaturated compounds having three ethylenically unsaturated groups, and from 0 to 70% wt of ethylenically unsaturated compounds having four or more ethylenically unsaturated groups; and a sum of percentages of the ethylenically unsaturated compounds having one, two, three or four or more ethylenically unsaturated group or groups is 100%. 5. The method of claim 4 , wherein the 70 to 99% by weight (% wt) of at least one ethylenically unsaturated compound, based on its total weight, consists of: from 0 to 20% wt of ethylenically unsaturated compounds having one ethylenically unsaturated group, from 0 to 55% by weight of ethylenically unsaturated compounds having two ethylenically unsaturated groups, from 0 to 60% wt of ethylenically unsaturated compounds having three ethylenically unsaturated groups, and from 0 to 60% wt of ethylenically unsaturated compounds having four or more ethylenically unsaturated groups; and a sum of percentages of the ethylenically unsaturated compounds having one, two, three or four or more ethylenically unsaturated group or groups is 100%. 6. The method of claim 5 , wherein the 70 to 99% by weight (% wt) of at least one ethylenically unsaturated compound, based on its total weight, consists of: from 10 to 50 by weight of ethylenically unsaturated compounds having two ethylenically unsaturated groups, from 10 to 60% wt of ethylenically unsaturated compounds having three ethylenically unsaturated groups, and from 0 to 60% wt of ethylenically unsaturated compounds having four or more ethylenically unsaturated groups. 7. The method of claim 1 , wherein the at least one ethylenically unsaturated compound is chosen from the group consisting of (meth)acrylates compounds having one or more ethylenically unsaturated groups per molecule, and combinations thereof. 8. The method of claim 1 , wherein the at least one photoinitiator is chosen from the group consisting of: acylphosphine oxides, 3-acyl coumarin derivatives, aromatic onium salt compounds, organic peroxides, thioxanthones, hexaaryl bisimidazoles, O-acyloxime esters, borate compounds, azinium compounds, metallocene compounds, benzophenones, α-diketones, ketosulfones, α-aminoketones, benzoin and benzoin ethers, benzil ketals, α-hydroxyketones, bi-functional photoinitiators, and mixtures thereof. 9. The method of claim 8 , wherein the at least one photoinitiator is chosen from the group consisting of: acylphosphine oxides, α-hydroxyketones, α-aminoketones, ketosulfones, benzophenones, bi-functional photoinitiators, and mixtures thereof. 10. The method of claim 1 , wherein the photocurable composition further comprises from about 0.2 to about 12% by weight of at least one co-initiator. 11. The method of claim 10 wherein the co-initiator is an alcohol, thiol, amine or ether. 12. The method of claim 11 wherein the co-initiator is an amine selected from the group consisting of aliphatic, cycloaliphatic, aromatic, aryl-aliphatic, heterocyclic, oligomeric, and polymeric amines. 13. The method of claim 12 wherein the co-initiator is selected from the group consisting of (bis-N,N-[4-dimethylaminobenzoyl) oxyethylen-1-yl]-methylamine); ethyl-4-dimethylamino benzoate; N-phenyl glycine and combinations thereof. 14. The method of claim 1 wherein the photocurable composition further comprises a member selected from the group consisting of thermal stabilizers, photo-oxidation stabilizers, anti-oxidants, solvents, dispersants, adhesion promoters, and combinations thereof. 15. A tile prepared by the method of claim 1 . 16. The tile of claim 15 wherein the tile is prepared employing a continuous production process. 17. The tile of claim 15 wherein the tile is prepared employing a discontinuous production process. 18. The method of claim 1 wherein the tiles are formed continuously.

Assignees

Inventors

Classifications

  • Manufacturing moulds, e.g. shaping the mould surface by machining · CPC title

  • by ultraviolet or visible light · CPC title

  • Processes of additive manufacturing · CPC title

  • of plastic material or rubber · CPC title

  • the energy source being concentrated, e.g. scanning lasers or focused light sources · CPC title

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What does patent US10471633B2 cover?
The present invention relates to a method for the preparation of dies for moulds for the production of tiles with three dimensional texture.
Who is the assignee on this patent?
Lamberti Spa, Lamerti SPA
What technology area does this patent fall under?
Primary CPC classification B29C33/3842. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).