Solder ball module for contact assembly of an electrical connector

Patent metadata

Field	Value
Publication number	US-10470313-B1
Application number	US-201816025530-A
Country	US
Kind code	B1
Filing date	Jul 2, 2018
Priority date	Jul 2, 2018
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

A contact assembly includes a contact array having contacts with transition portions between mating and terminating portions with contact tails extending to tips. The contact assembly has a dielectric contact holder holding the transition portions. The contact assembly has a solder ball module defining a board interface to a host circuit board. The solder ball module has a gathering housing with contact channels extending between a top and a bottom receiving contact tails of corresponding contacts. The gathering housing has solder balls arranged at the bottom at each contact channel being electrically connected to the tips of the contact tails and being configured to be reflow soldered to circuits of the host circuit board to electrically connect the contacts to the host circuit board.

First claim

What is claimed is:

1. A contact assembly comprising:
a contact array having contacts each having a transition portion extending between a mating portion and a terminating portion, the mating portion having a separable mating interface configured to be mated to a mating contact, the terminating portion having a contact tail extending to a tip, the contacts include signal contacts arranged in an upper row of contacts and a lower row of contacts, the contact array further comprising a ground shield between the upper row of contacts and the lower row of contacts, the ground shield having a plate and ground tails extending from the plate to tips;
a contact holder holding the transition portions of the contacts of the contact array, the contact holder being dielectric; and
a solder ball module defining a board interface of the contact assembly to a host circuit board, the solder ball module having a gathering housing extending between a top and a bottom, the gathering housing having contact channels extending between the top and the bottom receiving contact tails of corresponding contacts, the ground tails being received in corresponding contact channels in the gathering housing, the gathering housing having solder balls arranged at the bottom at each of the contact channels, the solder balls being electrically connected to the tips of the contact tails of corresponding signal contacts and the solder balls being terminated to corresponding tips of the ground tails, the solder balls being configured to be reflow soldered to circuits of the host circuit board to electrically connect the contacts to the host circuit board.

2. The contact assembly of claim 1 , wherein the solder balls are coplanar at the board interface of the solder ball module along the bottom of the gathering housing.

3. The contact assembly of claim 1 , wherein the contact tails extend perpendicular to the host circuit board from the solder balls between the bottom and the top of the gathering housing.

4. The contact assembly of claim 1 , wherein the tips are located above the bottom of the gathering housing electrically connected to the solder balls.

5. The contact assembly of claim 1 , wherein the tips are narrower than the contact tails.

6. The contact assembly of claim 1 , wherein the gathering housing includes impedance control cavities between the top and the bottom positioned adjacent the contact channels to control the impedance of signals transmitted by the contacts.

7. The contact assembly of claim 1 , wherein the contacts include signal contacts and ground contacts, the signal contacts being arranged in pairs carrying differential signals, the ground contacts being arranged between pairs of signal contacts.

8. The contact assembly of claim 1 , wherein the contacts are arranged in at least one set, each set being a leadframe and overmolded by a dielectric frame forming the contact holder.

9. The contact assembly of claim 1 , wherein the mating portions extend forward of the contact holder as spring beams in an upper row and a lower row forming a card slot therebetween configured to receive a circuit card having the mating contacts in an upper row of mating contacts and a lower row of mating contacts.

10. The contact assembly of claim 1 , wherein the mating portions are oriented perpendicular to the terminating portions.

11. The contact assembly of claim 1 , wherein the contacts include ground contacts and signal contacts, the plate of the ground shield directly engaging the ground contacts to electrically common the ground contacts.

12. The contact assembly of claim 1 , wherein the contact channels position the contact tails along an elevation axis, a lateral axis and a transverse axis relative to each other for connection to the solder balls at the board interface, the elevation axis, the lateral axis and the transverse axis being mutually perpendicular axes.

13. The contact assembly of claim 1 , wherein the gathering housing includes solder ball pockets associated with the contact channels at the bottom holding corresponding solder balls.

14. The contact assembly of claim 13 , wherein the tips of the contacts extend to the solder ball pockets for interfacing with the solder balls.

15. The contact assembly of claim 13 , wherein the gathering housing includes solder ball relief pockets between the contact channels and the solder ball pockets receiving solder of the solder balls when the solder balls are reflowed to locate the solder of the solder balls around the contact tails at the tips of the contacts.

16. An electrical connector comprising:
a housing having a mating end and a mounting end, the housing having a shroud at the mating end defining a card slot configured to receive a circuit card, the mounting end configured to be mounted to a host circuit board, the housing having a contact chamber; and
a contact assembly received in the contact chamber of the housing, the contact assembly includes a contact array having contacts each having a transition portion extending between a mating portion and a terminating portion, the mating portion having a separable mating interface arranged in the shroud at the card slot for mating with the circuit card, the terminating portion having a contact tail extending to a tip arranged at the mounting end, the contact assembly having a solder ball module defining a board interface of the contact assembly configured to be terminated to the host circuit board, the solder ball module having a gathering housing coupled to the housing at the mounting end, the gathering housing having contact channels extending between a top and a bottom receiving the contact tails of corresponding contacts, the gathering housing having solder balls arranged at the bottom at each of the contact channels, the solder balls being electrically connected to the tips of the contact tails of corresponding contacts and the solder balls being configured to be reflow soldered to circuits of the host circuit board to electrically connect the contacts to the host circuit board, the gathering housing includes impedance control cavities positioned adjacent all the contact channels to control the impedance of signals transmitted by the contacts.

17. The electrical connector of claim 16 , wherein the shroud is a first shroud and the contact assembly is a first contact assembly, the housing having a second shroud at the mating end defining a second card slot configured to receive a second circuit card, the second shroud being stacked above the first shroud, the electrical connector further comprising a second contact assembly located rearward of and above the first contact assembly, the second contact assembly being received in the contact chamber of the housing, the second contact assembly includes a second contact array having second contacts each having a transition portion extending between a mating portion and a terminating portion, the mating portion having a separable mating interface arranged in the second shroud at the second card slot for mating with the second circuit card, the terminating portion having a contact tail extending to a tip arranged at the mounting end, the second contact assembly having a second solder ball module defining a board interface of the second contact assembly configured to be terminated to the host circuit board, the second solder ball module having a second gathering housing coupled to the housing at the mounting end, the second gathering housing having contact channels extending between a top and a bottom receiving the contact tails of corresponding second contacts, the second gathering

Assignees

• Te Connectivity Corp

Inventors

• Phillips Michael John
• Henry Randall Robert
• Tryson Michael Joseph

Classifications

• H01R13/6585

  Shielding material individually surrounding or interposed between mutually spaced contacts · CPC title

• H01R13/6471

  by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal] · CPC title

• H01R13/2485 Primary

  for contacting a ball · CPC title

• H05K2201/10189

  Non-printed connector · CPC title

• H01R12/55

  characterised by the terminals · CPC title