Flexible electronics apparatus and associated methods

Patent metadata

Field	Value
Publication number	US-10470304-B2
Application number	US-201515126012-A
Country	US
Kind code	B2
Filing date	Mar 3, 2015
Priority date	Mar 21, 2014
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

An apparatus including a flexible substrate; and an overhanging electronic component island, the electronic component island configured to be less flexible than the flexible substrate and including one or more electronic components, wherein the electronic component island includes a substrate-face with a connection portion and an overhang portion, the connection portion being mechanically coupled to a surface of the flexible substrate via a single connection-support pad and the overhang portion configured to overhang and be substantially free of the underlying flexible substrate such that the underlying flexible substrate can be strained independently from the overhang portion under operational strains of the flexible substrate.

First claim

The invention claimed is:

1. An apparatus comprising: a flexible substrate; a single connection-support pad connected to the flexible substrate, wherein the single connection-support pad includes one or more parts that form a single unit; and an overhanging electronic component island, the electronic component island configured to be less flexible than the flexible substrate and comprising one or more electronic components, wherein the electronic component island is directly coupled to the single connection-support pad, wherein the electronic component island comprises a substrate-face with a connection portion and an overhang portion that extends beyond the single connection-support pad, the connection portion being mechanically coupled to a surface of the flexible substrate via the single connection-support pad and the overhang portion configured to overhang and be substantially free of the flexible substrate such that the flexible substrate can be strained independently from the overhang portion under operational strains of the flexible substrate, wherein the electronic component island is positioned at a different height above the flexible substrate surface than a neighboring electronic component island to permit overlap between the electronic component island and the neighboring electronic component island, and wherein an electrical connection of the single connection-support pad is stretchable.

2. The apparatus of claim 1 , wherein the single connection-support pad is configured to provide support to the electronic component island to keep the electronic component island away from the flexible substrate in an overhanging position.

3. The apparatus of claim 2 , wherein adhesion of the single connection-support pad to the electronic component island and the flexible substrate is configured to provide support for the electronic component island.

4. The apparatus of claim 1 , wherein, in an unstrained configuration, the electronic component island is configured to extend beyond an area enclosed by the single connection-support pad of the electronic component island so as to overlap one or more other neighboring electronic component islands.

5. The apparatus of claim 1 , wherein the single connection-support pad and the electronic component island are configured to electrically connect the one or more electronic components to the flexible substrate.

6. The apparatus of claim 1 , wherein the single connection-support pad is positioned at an edge of the electronic component island, substantially in a cantilever configuration.

7. The apparatus of claim 1 , wherein a length of the connection portion is less than 50% of an overall length of the electronic component island along at least one axis.

8. The apparatus of claim 1 , wherein a length of the connection portion is less than one of 45%, 40%, 35%, 30%, 25%, 20%, 15%, 10%, 5% of an overall length of the electronic component island along at least one axis.

9. The apparatus of claim 1 , wherein a length of the connection portion is in the range of one of 45%-40%, 40%-35%, 35%-30%, 30%-25%, 25%-20%, 20%-15%, 15%-10%, 10%-5%, 5%-3% of an overall length of the electronic component island along at least one axis.

10. The apparatus of claim 1 wherein the operational strains of the flexible substrate are of an order of at least one of between 5 and 10%; between 5 and 20%; between 5 and 30%; and between 5 and 40%.

11. The apparatus of claim 1 , wherein the apparatus comprises multiple layers, each layer comprising a flexible substrate and coupled electronic component islands.

12. The apparatus of claim 11 , wherein the electronic component islands are spaced apart during operational straining by spacers, the spacers being rigid relative to the flexible substrate.

13. The apparatus of claim 1 , wherein the apparatus comprises part of packaging, a wearable device, a wearable sensor, a biosensor, or a portable electronic device.

14. A method of manufacturing an apparatus comprising:
providing a flexible substrate;
providing a single connection-support pad connected to the flexible substrate, wherein the single connection-support pad includes one or more parts that form a single unit; and
providing an overhanging electronic component island, the electronic component island configured to be less flexible than the flexible substrate and comprising one or more electronic components, wherein the electronic component island is directly coupled to the single connection-support pad,
wherein the electronic component island comprises a substrate-face with a connection portion and an overhang portion that extends beyond the single connection-support pad, the connection portion being mechanically coupled to a surface of the flexible substrate via the single connection-support pad and the overhang portion configured to overhang and be substantially free of the flexible substrate such that the flexible substrate can be strained independently from the overhang portion under operational strains of the flexible substrate;
wherein the electronic component island is provided at a different height above the flexible substrate surface than a neighboring electronic component island to permit overlap between the electronic component island and the neighboring electronic component island; and
wherein an electrical connection of the single connection-support pad is stretchable.

15. The method of claim 14 , wherein at least one of the flexible substrate and the overhanging electronic component island is provided using roll-to-roll lamination techniques.

16. The method of claim 14 , wherein at least one of the flexible substrate and the overhanging electronic component island is provided using roll-to-roll printing techniques.

17. The method of claim 14 , wherein the method comprising providing multiple layers, each layer comprising a flexible substrate and coupled electronic component islands.

18. The method of claim 14 , wherein a sacrificial material is used to support parts of the apparatus as they are being formed, and wherein the sacrificial material is removed after the supported parts have been formed to decouple the parts from the underlying structure.

19. An apparatus comprising:
a flexible substrate;
at least one connection-support pad connected to the flexible substrate, wherein each of the at least one connection-support pad includes one or more parts that form a single unit; and
an overhanging electronic component island, the electronic component island configured to be less flexible than the flexible substrate and comprising one or more electronic components, wherein the electronic component island is directly coupled to the at least one connection-support pad,
wherein the electronic component island comprises a substrate-face with a connection portion and an overhang portion that extends beyond the at least one connection-support pad, the connection portion being mechanically coupled to a surface of the flexible substrate via the at least one connection-support pad and the overhang portion configured to overhang and be substantially free of the flexible substrate such that the flexible substrate can be strained independently from the overhang portion under operational strains of the flexible substrate,
wherein the electronic component island is configured to extend beyond an area enclosed by the at least one connection-support pad so as to overlap one or more other neighboring electronic component islands,
wherein the electronic component island is positioned at a different height above the flexible substrate surf

Assignees

• Nokia Technologies Oy

Inventors

• Cotton Darryl
• Allen Mark
• Andrew Piers
• Robinson Adam

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/611 Primary

  for connecting multiple chips together · CPC title

• H02S40/36

  characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection · CPC title