Method for manufacturing conductive pattern and conductive pattern formed substrate

Patent metadata

Field	Value
Publication number	US-10470301-B2
Application number	US-201414786812-A
Country	US
Kind code	B2
Filing date	Apr 17, 2014
Priority date	Apr 26, 2013
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

Provided are a conductive pattern manufacturing method and a conductive pattern formed substrate, capable of easily achieving a narrow pitch. A metal nanowire layer 12 is formed on the entirety of a part of at least one of the main faces of a substrate 10, pulsed light is irradiated thereto through a mask 14 provided with a light transmission portion 14a formed in a predetermined pattern, and the metal nanowires in the metal nanowire layer 12 at the region having the above predetermined pattern were sintered, to thereby obtain conductivity at the predetermined patterned region. Accordingly, a substrate provided with a conductive pattern having any selected pattern can be produced by simple steps.

First claim

The invention claimed is:

1. A method for manufacturing a transparent conductive pattern, the method comprising,
a step for forming a metal nanowire layer by coating a metal nanowire ink on the entirety or a part of at least one of the main surfaces of a substrate, the metal nanowire ink containing metal nanowires dispersed in a dispersion medium in which a binder resin is dissolved, and
a step for irradiating light to the metal nanowire layer in a predetermined pattern to sinter the metal nanowires in the metal nanowire layer in a region of the predetermined pattern for applying conductivity, and to form a sintered conductive region and an unsintered non-conductive region;
wherein, the metal nanowires in the conductive region and non-conductive region have an average aspect ratio of 10 or more, an average diameter size of 5 nm or more and 100 nm or less, and an average major length of 1 μm or more and 60 μm or less.

2. The method for manufacturing a transparent conductive pattern according to claim 1 , wherein the light is a pulsed light irradiated through a mask in which a light transmission portion having a shape of said pattern is formed.

3. The method for manufacturing a transparent conductive pattern according to claim 1 , wherein the metal nanowires are silver nanowires.

4. The method for manufacturing a transparent conductive pattern according to claim 1 , wherein an undercoat layer is formed by undercoating the substrate, and thereafter, the metal nanowire layer is formed on the undercoat layer.

5. The method for manufacturing a transparent conductive pattern according to claim 1 , wherein the amount of metal nanowires in the metal nanowire layer is from 5.9 mass % to 99.5 mass %.

6. The method for manufacturing a transparent conductive pattern according to claim 5 , wherein the amount of metal nanowires in the metal nanowire layer is from 10 to 60 mass %.

7. The transparent conductive pattern formed substrate according to claim 1 , wherein the metal nanowires have an average major axis length of 5 μm or more and 40 μm or less, and an average diameter of not more than 35 nm.

8. The method for manufacturing a transparent conductive pattern according to claim 1 , wherein the binder resin is a thermoplastic resin.

9. The method for manufacturing a transparent conductive pattern according to claim 8 , wherein the thermoplastic resin is a poly-N-vinyl compound or a polyalkylene glycol compound.

10. A method for manufacturing a transparent conductive pattern, the method comprising,
a step for forming a metal nanowire layer containing metal nanowires, on the entirety or a part of at least one of the main faces of a substrate,
a step for irradiating light to the metal nanowire layer in a predetermined pattern to sinter the metal nanowires in the metal nanowire layer in a region of the predetermined pattern for applying conductivity, and to form a sintered conductive region and an unsintered non-conductive region,
wherein the metal nanowire layer is formed by coating a metal nanowire ink which contains metal nanowires dispersed in a solvent capable of dissolving or swelling the material of the substrate, on the entirety or a part of at least one of the main faces of the substrate; and
by applying metal nanowire ink on the entirety or a part of at least one of the main faces of the substrate, the substrate surface is dissolved or swollen, and the metal nanowire is buried in the substrate, and
wherein the metal nanowires in the conductive region and non-conductive region have an average diameter size of 5 nm or more and 100 nm or less and an average major length of 1 μm or more and 60 μm or less.

11. The method for manufacturing a transparent conductive pattern according to claim 10 , wherein the metal nanowire layer comprises a binder.

12. The method for manufacturing a transparent conductive pattern according to claim 10 , wherein the light is a pulsed light irradiated through a mask in which a light transmission portion having a shape of said pattern is formed.

13. The method for manufacturing a transparent conductive pattern according to claim 10 , wherein the metal nanowires are silver nanowires.

14. The method for manufacturing a transparent conductive pattern according to claim 10 , wherein an undercoat layer is formed by undercoating the substrate, and thereafter, the metal nanowire layer is formed on the undercoat layer.

15. The method for manufacturing a transparent conductive pattern according to claim 10 , wherein the metal nanowire layer is formed by coating a metal nanowire ink containing metal nanowires, a binder resin, and a dispersion medium, on the entirety or a part of at least one of the main faces of the substrate.

16. The method for manufacturing a transparent conductive pattern according to claim 10 , wherein the amount of metal nanowires in the metal nanowire layer is from 5.9 mass % to 99.5 mass %.

17. The method for manufacturing a transparent conductive pattern according to claim 16 , wherein the amount of metal nanowires in the metal nanowire layer is from 10 to 60 mass %.

18. The transparent conductive pattern formed substrate according to claim 10 , wherein the metal nanowires have an average major axis length of 5 μm or more and 40 μm or less, and an average diameter of not more than 35 nm.

19. A transparent conductive pattern formed substrate comprising a substrate and a metal nanowire layer containing metal nanowires and a binder resin, the metal nanowire layer being provided on the entirety or a part of at least one of the main faces of the substrate, wherein,
the metal nanowire layer comprises:
a conductive region in which the metal nanowires are sintered in a predetermined pattern, and
a non-conductive region which is a region other than the conductive region in the metal nanowire layer, and in which the metal nanowires are not sintered;
wherein the metal nanowires have an average aspect ratio of 10 or more, and
the metal nanowires in the conductive region and non-conductive region have an average diameter size of 5 nm or more and 100 nm or less and an average major length of 1 μm or more and 60 μm or less.

20. The transparent conductive pattern formed substrate according to claim 19 , wherein the conductive region has a surface resistance of 200Ω/□ or less, and the non-conductive region has a surface resistance of 10 3 Ω/□ or more.

21. The transparent conductive pattern formed substrate according to claim 20 , wherein the non-conductive region has a surface resistance of 10 8 Ω/□ or more.

22. The transparent conductive pattern formed substrate according to claim 19 , wherein the metal nanowires have an average major axis length of 5 μm or more and 40 μm or less, and an average diameter of not more than 35 nm.

23. The transparent conductive pattern formed substrate according to claim 19 , wherein the binder resin is a thermoplastic resin.

24. The transparent conductive pattern formed substrate according to claim 23 , wherein the thermoplastic resin is a poly-N-vinyl compound or a polyalkylene glycol compound.

25. The transparent conductive pattern formed substrate according to claim 20 , wherein the binder resin is a thermoplastic resin.

26. The transparent conductive pattern formed substrate according to claim 25 , wherein the thermoplastic resin is a poly-N-vinyl compound or a polyalkylene glycol compound.

27. The transparent conductive p

Assignees

• Showa Denko Kk

Inventors

• Uchida Hiroshi
• Shinozaki Kenji
• OKAZAKI Eri
• Ohata Hideki
• MIYAMURA Yasunao

Classifications

• H05K3/1283

  After-treatment of the printed patterns, e.g. sintering or curing methods · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H05K1/0274 Primary

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K3/1216

  by screen printing or stencil printing · CPC title

• H05K3/105

  by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam · CPC title