Assembly having thermal conduction members

Patent metadata

Field	Value
Publication number	US-10468839-B2
Application number	US-201816019850-A
Country	US
Kind code	B2
Filing date	Jun 27, 2018
Priority date	Jun 29, 2017
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

An assembly includes: a socket connector, having an insulating seat, multiple mating terminals and a metal shell provided outside the insulating seat; at least one first thermal conduction member located outside the metal shell; and a plug connector, including: a circuit board; at least one chip provided on the circuit board; a mating joint electrically connected to one end of the circuit board and having an insulating body, multiple conductive terminals, and a shielding shell provided outside the insulating body; and at least one second thermal conduction member having a conducting portion thermally conductive with the chip and a protruding portion located outside the shielding shell. When the mating joint is mated with the socket connector, the mating terminals are in contact with the conductive terminals to form an electrical connection, and the protruding portion is in contact with the first thermal conduction member to perform thermal conduction.

First claim

What is claimed is:

1. An assembly, comprising:
a socket connector, having an insulating seat, a plurality of mating terminals provided on the insulating seat, and a metal shell provided outside the insulating seat;
at least one first thermal conduction member, located outside the metal shell; and
a plug connector, comprising:
a circuit board;
at least one chip, provided on the circuit board;
a mating joint, electrically connected to one end of the circuit board, wherein the mating joint has an insulating body, a plurality of conductive terminals provided on the insulating body, and a shielding shell provided outside the insulating body; and
at least one second thermal conduction member, having at least one conducting portion and at least one protruding portion, wherein the conducting portion is thermally conductive with the chip, the protruding portion is located outside the shielding shell, and when the mating joint is mated with the socket connector, the mating terminals are in contact with the conductive terminals to form an electrical connection, and the protruding portion is in contact with the first thermal conduction member to perform thermal conduction.

2. The assembly of claim 1 , wherein at least one of the first thermal conduction member and the second thermal conduction member is a thermal transistor or a capillary.

3. The assembly of claim 1 , further comprising a fixed seat, wherein the socket connector and the first thermal conduction member are respectively provided on the fixed seat.

4. The assembly of claim 1 , further comprising a casing and a heat dissipating device provided in the casing, wherein the casing has an opening communicating with an outside, the socket connector and the first thermal conduction member are respectively exposed to the opening, and the heat dissipating device is configured to perform heat dissipation on the first thermal conduction member.

5. The assembly of claim 1 , further comprising a heat dissipating device, wherein the first thermal conduction member is connected with the heat dissipating device.

6. The assembly of claim 1 , wherein the first thermal conduction member has an accommodating slot configured for insertion of the protruding portion.

7. The assembly of claim 1 , wherein the plug connector further comprises a shielding cover provided at a rear end of the mating joint, wherein the circuit board is accommodated in the shielding cover, the shielding cover has at least one abutting portion in contact with the chip, and the conducting portion is in contact with the shielding cover.

8. The assembly of claim 1 , wherein a front end of the insulating body has a mating slot, each of the conductive terminals has a contact portion protruding into the mating slot, the contact portions of the conductive terminals are provided in two rows on an upper side and a lower side of the mating slot, two second thermal conduction members are provided at a left side and a right side of the mating joint, the two protruding portions of the two second thermal conduction members are symmetrical about a center of the mating slot at 180 degrees, and the plug connector is mated with the socket connector forwardly or reversely.

9. The assembly of claim 1 , wherein the plug connector further comprises an insulating shell provided on a rear end of the shielding shell, wherein the conducting portion is accommodated in the insulating shell, the insulating shell has a front end surface, and the shielding shell and the protruding portion respectively protrude forward from the front end surface.

10. The assembly of claim 9 , wherein a length of the protruding portion protruding forward relative to the front end surface is greater than a length of the mating joint protruding forward relative to the front end surface.

11. The assembly of claim 9 , wherein the insulating shell is injection-molded to the rear end of the shielding shell, and the second thermal conduction member is insert-molded in the insulating shell.

12. The assembly of claim 1 , wherein the plug connector further comprises a shielding cover provided on a rear end of the mating joint, the circuit board is accommodated in the shielding cover, and the conducting portion penetrates through the shielding cover to be in contact with the chip.

13. The assembly of claim 12 , wherein the conducting portion is in contact with at least one of the shielding cover and the shielding shell.

14. The assembly of claim 1 , wherein the first thermal conduction member is a casing made of a metal material, one side of the casing is provided with an opening, and the socket connector is exposed to the opening and mated with the plug connector.

15. The assembly of claim 14 , wherein a main board and a heat dissipating device are provided in the casing, the socket connector is mounted on the main board, and when the mating joint is mated with the socket connector, the protruding portion at least partially protrudes into the casing, and the heat dissipating device accelerates air flow around the protruding portion to perform heat dissipation on the second thermal conduction member.

16. The assembly of claim 15 , wherein the casing is provided with an insertion hole on at least one side of the opening for the protruding portion to pass therethrough, and the insertion hole is isolated from the opening.

17. The assembly of claim 15 , wherein the heat dissipating device has an air outlet, the air outlet and one of the at least one protruding portion are located on a same side of the socket connector as one of the protruding portion, and the air outlet is provided to be away from the socket connector relative to the one of the at least one protruding portion.

18. A plug connector, comprising:
a circuit board;
at least one chip, provided on the circuit board;
a mating joint, electrically connected to one end of the circuit board, wherein the mating joint has an insulating body, a plurality of conductive terminals provided on the insulating body, and a shielding shell provided outside the insulating body, the insulating body has a mating slot, each of the conductive terminals has a contact portion protruding into the mating slot, the contact portions of the conductive terminals are provided in two rows on two opposite sides of the mating slot, and the two rows of the contact portions are symmetrical about a center of the mating slot at 180 degrees; and
two thermal conduction members, provided at a left side and a right side of the mating joint, each of the two thermal conduction members having at least one conducting portion and at least one protruding portion, wherein the conducting portion of each of the two thermal conduction members is thermally conductive with the chip, the protruding portion of each of the two thermal conduction members is located outside the shielding shell, and the two protruding portions of the two thermal conduction members are symmetrical about the center of the mating slot at 180 degrees.

19. An assembly, comprising:
a casing, provided with an opening at one side thereof;
a main board, provided in the casing;
a heat dissipating device, provided in the casing;
a socket connector, mounted on the main board and exposed at the opening; and
a plug connector, comprising:
a circuit board;
at least one chip, provided on the circuit board;
a mating joint, electrically connected to one end of the circuit board; and
at least one thermal conduction member, having at least one conducting portion and at least one protruding portion, wherein the conducting

Assignees

• Lotes Co Ltd

Inventors

• Ju Ted
• Lin Chin Chi

Classifications

• H01R13/516

  Means for holding or embracing insulating body, e.g. casing {, hoods} · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title

• H01R24/60

  Contacts spaced along planar side wall transverse to longitudinal axis of engagement · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H01R13/6658 Primary

  on printed circuit board (H01R13/6666 - H01R13/6691 take precedence) · CPC title