Production management method of substrate in component mounting system

US10466685B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10466685-B2
Application numberUS-201514845618-A
CountryUS
Kind codeB2
Filing dateSep 4, 2015
Priority dateOct 23, 2014
Publication dateNov 5, 2019
Grant dateNov 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a production management method of a substrate in a component mounting system having plural component mounting lines configured to include plural component mounting apparatuses, reading production data of an interrupt type substrate; collecting equipment data of each of the component mounting lines; and determining at least one component mounting line to produce the interrupt type substrate based on the read production data of the interrupt type substrate and the collected equipment data of each of the component mounting lines are performed.

First claim

Opening claim text (preview).

What is claimed is: 1. A production management method for a component mounting system, the component mounting system comprising: a plurality of component mounting lines and a controller in communication with each of the plurality of component mounting lines, each component mounting line including a plurality of component mounting apparatuses, the production management method comprising: the controller managing the plurality of component mounting lines scheduled to mount components on at least one component mounting substrate, wherein the managing the plurality of component mounting lines comprises: comparing production data for the scheduled component mounting substrate with equipment data of the component mounting line; and when an interrupt type substrate is desired for production, the interrupt type substrate being a different type than the at least one scheduled component mounting substrate, the controller: reading production data of the interrupt type substrate wherein the production data has been input into the controller; collecting the equipment data of each of the plurality of component mounting lines; and determining at least one of the plurality of component mounting lines for production using the interrupt type substrate based on the read production data of the interrupt type substrate and the collected equipment data of each of the component mounting lines; and creating new production data for the interrupt type substrate based on the determined component mounting line; and wherein the determined component mounting line mounts at least one component on the interrupt type substrate. 2. The production management method for the component mounting system according to claim 1 , wherein the at least one component mounting line is further determined according to a predetermined priority. 3. The production management method for the component mounting system according to claim 2 , wherein the predetermined priority includes selecting a component mounting line furnished with the most types of components needed for the interrupt type substrate. 4. The production management method for the component mounting system according to claim 2 , wherein the predetermined priority includes selecting a component mounting line furnished with a greater number of components needed for the interrupt type substrate. 5. The production management method for the component mounting system according to claim 2 , wherein the predetermined priority includes selecting a component mounting line furnished with space for attaching a component supply unit. 6. The production management method for the component mounting system according to claim 2 , wherein the predetermined priority includes selecting a component mounting line already furnished with a pickup part capable of picking up a component to be mounted on the interrupt type substrate. 7. The production management method for the component mounting system according to claim 2 , wherein the predetermined priority includes selecting a component mounting line capable of efficiently mounting components in a case where mounting order of components to be mounted on the interrupt type substrate is set. 8. The production management method for the component mounting system according to claim 2 , wherein the predetermined priority includes selecting adjacent component mounting when plural component mounting lines are needed. 9. The production management method for the component mounting system according to claim 2 , wherein the predetermined priority includes selecting a component mounting line which has mounted components on the interrupt type substrate in the past. 10. The production management method for the component mounting system according to claim 1 , wherein the production data that has been input into the controller includes: size data of the component mounting substrate; coordinate data of a component mounting position on the component mounting substrate; data of a type and a direction of a component to be mounted on each of the component mounting positions; data of a type of the suction nozzle for picking up a component from a part feeder; and/or data of a mounting program indicating mounting order of components. 11. The production management method for the component mounting system according to claim 2 , determining the component mounting line includes determination of use order of the component mounting lines when multiple component mounting lines are needed for the interrupt type substrate. 12. The production management method for the component mounting system according to claim 1 , wherein determining the at least one of the component mounting lines for the interrupt type substrate includes determining a use order in which the component mounting lines mount components on the interrupt type substrate when multiple component mounting lines are needed for the interrupt type substrate. 13. The production management method for the component mounting system according to claim 1 , wherein, the interrupt type substrate can be a trial substrate or a maintenance substrate. 14. The production management method for the component mounting system of claim 1 , wherein at least one of the plurality of component mounting apparatuses includes at least one mounting head and at least one suction nozzle. 15. The production management method for the component mounting system of claim 1 , wherein the equipment data includes: arrangement data for the plurality of component mounting apparatuses; identification data for one or more part feeders furnished with the plurality of component mounting apparatuses; a type and number of components supplied by the one or more part feeders; availability of attachment places of the one or more part feeders; a type and number of suction nozzles attached to a mounting head of at least one of the component mounting apparatuses; and/or a type and number of suction nozzles placed on a nozzle stocker of at least one of the component mounting apparatuses.

Assignees

Inventors

Classifications

  • Mount and solder parts on board · CPC title

  • Normal, special order lines share some common machines, part of production line · CPC title

  • Rearrange production line · CPC title

  • characterised by job scheduling, process planning, material flow · CPC title

  • Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] · CPC title

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Frequently asked questions

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What does patent US10466685B2 cover?
In a production management method of a substrate in a component mounting system having plural component mounting lines configured to include plural component mounting apparatuses, reading production data of an interrupt type substrate; collecting equipment data of each of the component mounting lines; and determining at least one component mounting line to produce the interrupt type substrate b…
Who is the assignee on this patent?
Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification G05B19/41865. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).