Component mounting apparatus and method of setting a setting value of operational parameter

Patent metadata

Field	Value
Publication number	US-10466683-B2
Application number	US-201615075104-A
Country	US
Kind code	B2
Filing date	Mar 19, 2016
Priority date	Apr 9, 2015
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

A setting value of a component parameter that includes at least one of component information relating to an electronic component and tape information relating to a carrier tape that is supplied by a tape feeder is input, a rule table in which a component parameter and a setting value of an operational parameter relating to an operation by at least one of component mounting apparatuses are associated with each other is stored, and the setting value of the operational parameter that corresponds to a setting value of the component parameter which is input is set based on a rule table.

First claim

What is claimed is:

1. A component mounting apparatus configured to unload an electronic component from a component supply unit including a tape feeder supplying a carrier tape holding the electronic component, and to transfer by a mounting head the electronic component to a substrate for mounting the electronic component to the substrate, the component mounting apparatus comprising:
an input unit into which a setting value of a component parameter that includes at least one of price information relating to the electronic component and tape information relating to the carrier tape is input;
a storage configured to store a rule table linking each of one or more setting values of the component parameter to respective one of one or more setting values of an operational parameter relating to at least one operation of the component supply unit or the mounting head; and
a setting unit that sets, based on the rule table, a setting value of the operational parameter which is linked to the setting value of the component parameter input;
wherein the electronic component is mounted onto the substrate by the component supply unit and the mounting head based on the setting value of the operational parameter linked to the setting value of the component parameter input.

2. The component mounting apparatus of claim 1 , further comprising
a mounting head including a suction nozzle configure to unload the electronic component from the carrier tape,
wherein the carrier tape includes a joint portion that joins the carrier tape to another carrier tape, and
wherein the operational parameter includes a value of at least one of a number of times that a component suction operation by the suction nozzle or a recognition operation of the electronic component is re-performed, an operation setting for re-performing the component suction operation by the suction nozzle or the recognition operation, and a feeding operation setting related to an operation when the joint portion is fed.

3. The component mounting apparatus of claim 1 , further comprising
a mounting head including a suction nozzle configure to unload the electronic component from the carrier tape,
wherein the tape information includes at least one of a tape width of the carrier tape, a feeding interval of the carrier tape, and color or material information of the carrier tape,
wherein the carrier tape includes a pocket accommodating the electronic component therein and a cover tape that covers the pocket, and
wherein the operational parameter further includes a value of at least one of an automatic teaching use setting that stipulates presence or absence of performing of automatic teaching that automatically sets a position of suction of the electronic component by the suction nozzle, using image recognition, a timing setting that sets a timing at which the automatic teaching is performed, a feeding speed setting that sets a feeding speed of the carrier tape, and a carrier tape in-advance feeding setting that, in advance, feeds, to a component unloading position, the pocket from which the electronic component is exposed after the cover tape is removed from the carrier tape.

4. A component mounting apparatus configured to unload an electronic component from a component supply unit and to transfer by a mounting head the electronic component to a substrate for mounting the electronic component to the substrate, the component mounting apparatus comprising:
an input unit into which a setting value of a component parameter that includes at least one of component information relating to the electronic component;
a storage configured to store a rule table linking each of one or more setting values of the component parameter to respective one of one or more setting values of an operational parameter relating to at least one operation of the component supply unit or the mounting head; and
a setting unit that sets, based on the rule table, a setting value of the operational parameter which is linked to the setting value of the component parameter input;
wherein the electronic component is mounted onto the substrate by the component supply unit and the mounting head based on the setting value of the operational parameter,
wherein the setting unit sets, based on the rule table, a setting value of the component parameter out of the one or more setting values of the component parameter which is set most frequently and a setting value of the operational parameter out of the one or more setting values of the operational parameter which is linked to the setting value of the component parameter which is set most frequently as an initial value of the component parameter and an initial value of the operational parameter, respectively.

5. A method of mounting an electronic component onto a substrate by setting a setting value of an operational parameter related to at least one operation of a component mounting apparatus for use in the component mounting apparatus that unloads an electronic component from a component supply unit including a tape feeder supplying a carrier tape holding the electronic component and transfers the electronic component to a substrate by a mounting head for mounting the electronic component to the substrate, the method comprising:
acquiring a plurality of setting values of a component parameter that includes at least one of price information relating to the electronic component and tape information relating to the carrier tape;
reading a rule table linking each of the plurality of setting values of the component parameter to respective one of one or more setting values of an operational parameter relating to at least one operation of the component supply unit or the mounting head;
setting, based on the rule table, a setting value of the operational parameter which is linked to the acquired setting value of the component parameter; and
mounting the electronic component onto the substrate by the component supply unit and the mounting head based on the setting value of the operational parameter linked to the acquired setting value of the component parameter.

6. The method of claim 5 ,
wherein the component mounting apparatus further includes a mounting head including a suction nozzle configure to unload the electronic component from the carrier tape,
wherein the carrier tape includes a joint portion that joins the carrier tape to another carrier tape, and
wherein the operational parameter includes a value of at least one of the number of times that a component suction operation by the suction nozzle or a recognition operation of the electronic component is re-performed, an operation setting for re-performing the component suction operation performed by the suction nozzle or the recognition operation, and a feeding operation setting which relates to an operation when the joint portion is fed.

7. The method of claim 5 ,
wherein the tape information includes at least one of a tape width of the carrier tape, a feeding interval of the carrier tape, and color or material information of the carrier tape,
wherein the component mounting apparatus includes a mounting head including a suction nozzle configure to unload the electronic component from the carrier tape,
wherein the carrier tape includes a pocket accommodating the electronic component therein and a cover tape that covers the pocket, and
wherein the operational parameter includes a value of at least one of an automatic teaching setting that stipulates presence or absence of performing of automatic teaching that automatically sets a position of suction of the electronic component by the suction nozzle, using image recognition, an automatic teaching performing timing setting that sets a timing at which the automatic teaching is performed, a feeding speed setting that sets

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Ishimoto Kenichiro

Classifications

• G05B2219/45031

  Manufacturing semiconductor wafers · CPC title

• G05B2219/35012

  Cad cam · CPC title

• H05K13/0408 Primary

  Incorporating a pick-up tool · CPC title

• G05B19/418 Primary

  Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] · CPC title

• H05K13/04 Primary

  Mounting of components {, e.g. of leadless components} · CPC title