Polyamide resin composition for damping material

US10465063B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10465063-B2
Application numberUS-201515521031-A
CountryUS
Kind codeB2
Filing dateOct 20, 2015
Priority dateOct 31, 2014
Publication dateNov 5, 2019
Grant dateNov 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

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A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polyamide resin composition for a vibration-damping material, comprising a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, a fibrous filler, comprising one or more members selected from the group consisting of glass fibers, metal fibers, and cellulose fibers, in an amount of 1 part by mass to 7 parts by mass, and one or more members selected from the group consisting of plate-like fillers selected from the group consisting of glass flake, non-swellable mica, swellable mica, graphite, metal foil, talc, clay, mica, sericite, zeolite, bentonite, organic modified bentonite, montmorillonite, organic modified montmorillonite, dolomite, smectite, hydrotalcite, plate-like iron oxide, plate-like calcium carbonate, plate-like magnesium hydroxide, and plate-like barium sulfate, and acicular fillers selected from the group consisting of potassium titanate whiskers, aluminum borate whiskers, magnesium-based whiskers, silicon-based whiskers, wollastonite, sepiolite, asbestos, zonolite, phosphate fibers, ellestadite, slag fibers, gypsum fibers, silica fibers, silica alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, and boron fibers, in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin, wherein said plasticizer contains one or more members selected from the group consisting of: (1) a carboxylic acid amide-based plasticizer which contains amides of one or more acids selected from the group consisting of benzoic acid, phthalic acid, trimellitic acid, pyromellitic acid and anhydrides thereof, and a dialkylamine of which alkyl group has from 2 to 8 carbon atoms, (2) a sulfonamide-based plasticizer, (3) an ester-based plasticizer, and (4) an amide ester-based plasticizer. 2. The polyamide resin composition according to claim 1 , wherein the polyamide resin comprises one or more members selected from the following (1) to (3): (1) a copolymer of a polycondensate of a diamine and a dicarboxylic acid; (2) a polymer of a polycondensate of a lactam or an aminocarboxylic acid; and (3) a polymer comprising two or more members selected from the group consisting of (1) and (2). 3. The polyamide resin composition according to claim 1 , wherein the content of the polyamide resin is 30% by mass or more and 80% by mass or less in the polyamide resin composition. 4. The polyamide resin composition according to claim 1 , wherein the plasticizer comprises one or more members selected from the group consisting of the carboxylic acid amide-based plasticizer, the ester-based plasticizer, and the amide ester-based plasticizer. 5. The polyamide resin composition according to claim 4 , wherein the ester-based plasticizer comprises one or more members selected from the group consisting of monoester-based plasticizers, diester-based plasticizers, triester-based plasticizers, and polyester-based plasticizers. 6. The polyamide resin composition according to claim 1 , wherein the content of the plasticizer is 10 parts by mass or more and 25 parts by mass or less, based on 100 parts by mass of the polyamide resin. 7. The polyamide resin composition according to claim 1 , further comprising an organic crystal nucleating agent. 8. The polyamide resin composition according to claim 1 , wherein the content of the one or more members selected from the group consisting of plate-like fillers selected from the group consisting of glass flake, non-swellable mica, swellable mica, graphite, metal foil, talc, clay, mica, sericite, zeolite, bentonite, organic modified bentonite, montmorillonite, organic modified montmorillonite, dolomite, smectite, hydrotalcite, plate-like iron oxide, plate-like calcium carbonate, plate-like magnesium hydroxide, and plate-like barium sulfate, and acicular fillers selected from the group consisting of potassium titanate whiskers, aluminum borate whiskers, magnesium-based whiskers, silicon-based whiskers, wollastonite, sepiolite, asbestos, zonolite, phosphate fibers, ellestadite, slag fibers, gypsum fibers, silica fibers, silica alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, and boron fibers, is 15 parts by mass or more and 60 parts by mass or less, based on 100 parts by mass of the polyamide resin. 9. The polyamide resin composition according to claim 1 , wherein the content of the one or more members selected from the group consisting of plate-like fillers selected from the group consisting of glass flake, non-swellable mica, swellable mica, graphite, metal foil, talc, clay, mica, sericite, zeolite, bentonite, organic modified bentonite, montmorillonite, organic modified montmorillonite, dolomite, smectite, hydrotalcite, plate-like iron oxide, plate-like calcium carbonate, plate-like magnesium hydroxide, and plate-like barium sulfate, and acicular fillers selected from the group consisting of potassium titanate whiskers, aluminum borate whiskers, magnesium-based whiskers, silicon-based whiskers, wollastonite, sepiolite, asbestos, zonolite, phosphate fibers, ellestadite, slag fibers, gypsum fibers, silica fibers, silica alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, and boron fibers, is from 15 to 40 parts by mass, based on 100 parts by mass of the polyamide resin. 10. A vibration-damping material comprising a polyamide resin composition as defined in claim 1 . 11. A method of damping vibration in audio equipment, an electronic appliance, a transportation vehicle, a construction building, or industrial equipment, which method comprises incorporating into said audio equipment, electronic appliance, transportation vehicle, construction building, or industrial equipment a polyamide resin composition as defined in claim 1 as a vibration-damping material. 12. A manufactured article selected from audio equipment, electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof, obtained by molding a polyamide resin composition as defined in claim 1 . 13. A method for producing parts or housing, comprising the following steps: step (1): melt-kneading a polyamide resin composition comprising a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, a fibrous filler, comprising one or more members selected from the group consisting of glass fibers, metal fibers, and cellulose fibers, in an amount of 1 part by mass to 7 parts by mass, and one or more members selected from the group consisting of plate-like fillers selected from the group consisting of glass flake, non-swellable mica, swellable mica, graphite, metal foil, talc, clay, mica, sericite, zeolite, bentonite, organic modified bentonite, montmorillonite, organic modified montmorillonite, dolomite, smectite, hydrotalcite, plate-like iron oxide, plate-like calcium carbonate, plate-like magnesium hydroxide, and plate-like barium sulfate, and acicular fillers selected from the group consisting of potassium titanate whiskers, aluminum borate whiskers, magnesium-based whiskers, silicon-based whiskers, wollastonite, sepiolite, asbestos, zonolite, phosphate fibers, ellestadite, slag fibers, gypsum fibers, silica fibers, silica alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, and boron fibers, in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin, to prepare a melt-kneaded product of a polyamide resin composition; and step (2): injection-molding the melt-kneaded product of a polyamide resin composition obtained in the step (1) in a mold, wherein said plasticizer contains

Assignees

Inventors

Classifications

  • Carboxylic esters of phenolcarboxylic acids · CPC title

  • Calcium, strontium or barium carbonate · CPC title

  • Additives defined by their aspect ratio · CPC title

  • Use of ingredients characterised by shape · CPC title

  • Clay · CPC title

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What does patent US10465063B2 cover?
A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present …
Who is the assignee on this patent?
Kao Corp
What technology area does this patent fall under?
Primary CPC classification C08K5/435. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).