Convey device, molded article manufacturing apparatus, and method of manufacturing molded article

US10464242B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10464242-B2
Application numberUS-201816208504-A
CountryUS
Kind codeB2
Filing dateDec 3, 2018
Priority dateDec 19, 2012
Publication dateNov 5, 2019
Grant dateNov 5, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A convey device, which conveys an insert member into a die, includes a holding device configured to hold the insert member in an attitude in which a major surface of the insert member is in a substantially gravitational direction; a convey mechanism configured to convey the insert member to the die, while the insert member is being held in the attitude by the holding device; and a heating device configured to heat the insert member. The insert member can be heated by the heating device before the insert member is disposed in the die.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a molded article, comprising: conveying, by a convey device, a thermoplastic prepreg to a heating device in an attitude in which a major surface of the thermoplastic prepreg is in a substantially gravitational direction, the convey device comprising: a holding device configured to hold the thermoplastic prepreg in the attitude, the holding device comprising a chuck and a cooling device configured to cool the chuck, and a convey mechanism configured to convey the thermoplastic prepreg while the thermoplastic prepreg is being held in the attitude by the holding device; heating, by the heating device, the thermoplastic prepreg which has been conveyed in the attitude; conveying, after the heating, the thermoplastic prepreg to a molding device to which a die is attached; molding the thermoplastic prepreg by the molding device; and controlling, by a controller, the cooling device to cool the chuck after the thermoplastic prepreg is conveyed to the molding device and before a second thermoplastic prepreg is conveyed to the heating device. 2. The method of manufacturing a molded article of claim 1 , wherein the thermoplastic prepreg is heated and made to stand by, before the thermoplastic prepreg is conveyed into the molding device. 3. The method of manufacturing a molded article of claim 1 , wherein the thermoplastic prepreg is heated immediately before the thermoplastic prepreg is conveyed into the molding device.

Assignees

Inventors

Classifications

  • Details, accessories or equipment specially adapted for furnaces of these types · CPC title

  • Inserting articles into the mould (B29C45/14827 takes precedence) · CPC title

  • preheating or precooling the insert for non-deforming purposes · CPC title

  • Thermoplastic materials · CPC title

  • fabric · CPC title

Patent family

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Frequently asked questions

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What does patent US10464242B2 cover?
A convey device, which conveys an insert member into a die, includes a holding device configured to hold the insert member in an attitude in which a major surface of the insert member is in a substantially gravitational direction; a convey mechanism configured to convey the insert member to the die, while the insert member is being held in the attitude by the holding device; and a heating devic…
Who is the assignee on this patent?
Toshiba Machine Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/14008. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).