Nanochannel device with three dimensional gradient by single step etching for molecular detection

Patent metadata

Field	Value
Publication number	US-10464061-B2
Application number	US-201615096933-A
Country	US
Kind code	B2
Filing date	Apr 12, 2016
Priority date	Mar 6, 2014
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

A technique includes forming a gradient channel with width and depth gradients. A mask is disposed on top of a substrate. The mask is patterned with at least one elongated channel pattern having different elongated channel pattern widths. A channel is etched in the substrate in a single etching step, the channel having a width gradient and a corresponding depth gradient both simultaneously etched in the single etching step according to the different elongated channel pattern widths in the mask.

First claim

What is claimed is:

1. A method of forming a gradient channel with width and depth gradients, the method comprising:
disposing a mask on top of a substrate, wherein the mask is patterned with at least one elongated channel pattern having different elongated channel pattern widths; and
etching a channel in the substrate in a single etching step, the channel having a width gradient and a depth gradient both simultaneously etched in material of the substrate in the single etching step according to the different elongated channel pattern widths in the mask;
wherein the depth gradient of the channel includes a nanochannel region having a nanochannel depth ranging from less than 10 nanometers to a few hundred nanometers caused by etching the channel in the material of the substrate during the single etching step;
wherein the nanochannel region having the nanochannel depth comprises a triangular shaped bottom while a microchannel region having a microchannel depth comprises a flat bottom;
wherein the nanochannel depth is determined by lateral dimensions of the channel in the nanochannel region and is fixed during over etching;
wherein, during the single etching step, over etching is prolonging a wet etching time beyond requirements to etch the nanochannel depth all while the nanochannel depth does not increase beyond a predetermined maximum nanochannel depth set by a nanochannel width.

2. The method of claim 1 , wherein the width gradient has a first width through a last width that corresponds on a one-to-one basis to a first depth through a last depth of the depth gradient.

3. The method of claim 2 , wherein the first width is a smallest width and the last width is a widest width; and
wherein the first depth is a shallowest depth and the last depth is a deepest depth.

4. The method of claim 1 , further comprising limiting depths of the depth gradient according to respective widths of the width gradient during the single etching step such that the depths of the depth gradient maintain a preset relationship to the respective widths of the channel.

5. The method of claim 2 , wherein the depth gradient etched in the single etching step has channel depths changing in different regions of the channel according to a respective width in the different regions.

6. The method of claim 2 , wherein the depth gradient from the first depth through the last depth changes from less than 10 nanometers to several micrometers.

7. The method of claim 1 , wherein the single etching step is anisotropic etching of the substrate through openings of the at least one elongated channel pattern having the different elongated channel pattern widths in the mask;
wherein the depth gradient of the channel reduces an entropic barrier of biopolymers traversing through the channel;
wherein multiple channels with different widths and corresponding different depths are simultaneously etched during the single etching step.

8. The method of claim 1 ,
wherein over etching during the single etching step does not increase the nanochannel depth.

9. The method of claim 8 , wherein the depth gradient of the channel includes a microchannel region having a microchannel depth that is controlled by the wet etching time during the single etching step.

10. The method of claim 9 , wherein, when over etching with the wet etching time beyond requirements to etch the microchannel depth during the single etching step, the microchannel depth does not increase beyond a predetermined maximum microchannel depth set by a microchannel width.

11. The method of claim 10 , wherein the microchannel width of the microchannel region is wider than the nanochannel width of the nanochannel region.

12. The method of claim 1 , further comprising shrinking a width and the nanochannel depth of the channel by oxidation of the substrate such that a smallest width and a shallowest depth of the channel is less than 5 nanometers.

13. The method of claim 1 , wherein material of the substrate includes at least one of Si, Ge, GaAs, and sapphire.

14. The method of claim 1 , wherein wet etching during the single etching step is configured to process tens or hundreds of wafers in a single batch, which is different from dry etching which processes one wafer at a time.

15. The method of claim 1 , wherein the single etching step is a single continuous wet etching event of removing material of the substrate at different depths according to each different elongated channel pattern width in the mask for the different elongated channel pattern widths;
wherein the single etching step forms the channel with the different depths based on different widths of the channel without requiring a separate etching step to etch the different depths; and
wherein the mask is removed from the substrate.

16. A method of forming a gradient channel with width and depth gradients, the method comprising:
applying a mask on top of a substrate, wherein the mask is patterned with at least one elongated channel pattern having different elongated channel pattern widths; and
etching a channel in the substrate in a single etching step, the channel having a width gradient and a depth gradient both simultaneously etched in material of the substrate in the single etching step according to the different elongated channel pattern widths in the mask;
wherein the depth gradient of the channel includes a nanochannel region having a nanochannel depth caused by etching the channel in the material of the substrate during the single etching step;
wherein the nanochannel depth is determined by lateral dimensions of the channel in the nanochannel region and is fixed during over etching;
wherein the nanochannel region having the nanochannel depth comprises a triangular shaped bottom while a microchannel region having a microchannel depth comprises a flat bottom;
wherein, during the single etching step, over etching is prolonging a wet etching time beyond requirements to etch the nanochannel depth all while the nanochannel depth does not increase beyond a predetermined maximum nanochannel depth set by a nanochannel width.

17. The method of claim 16 , wherein over etching during the single etching step does not increase the nanochannel depth.

18. A method of forming gradient channels with width and depth gradients, the method comprising:
disposing a mask on top of a substrate, wherein the mask is patterned with an array of elongated channel patterns having different elongated channel pattern widths; and
etching an array of channels in the substrate in a single etching step, the array of channels each having a width gradient and a depth gradient both simultaneously etched in material of the substrate in the single etching step according to the different elongated channel pattern widths in the mask;
wherein the depth gradient of the array of channels includes a nanochannel region having a nanochannel depth caused by etching the channel in the material of the substrate during the single etching step;
wherein the nanochannel depth is determined by lateral dimensions of respective channels in the nanochannel region and is fixed during over etching;
wherein the nanochannel region having the nanochannel depth comprises a triangular shaped bottom while a microchannel region having a microchannel depth comprises a flat bottom;
wherein, during the single etching step, over etching is prolonging a wet etching time beyond requirements to etch the nanochannel depth all while the nanochannel depth does not increase beyond a predetermined maximum nanochannel depth set by a nanochannel width.

Assignees

• IBM
• Int Business Machines Corportaion

Inventors

• Bai Jingwei
• Lin Qinghuang
• Stolovitzky Gustavo A
• Wang Chao
• Wang Deqiang

Classifications

• B01L3/502707 Primary

  characterised by the manufacture of the container or its components · CPC title

• B01L2300/12

  Specific details about materials · CPC title

• B81B2203/0392

  profiles not provided for in B81B2203/0376 - B81B2203/0384 · CPC title

• C12Q1/6874

  involving nucleic acid arrays, e.g. sequencing by hybridisation · CPC title

• B01L2300/0896

  Nanoscaled · CPC title