System for manufacturing assembly board and method for installing undersupporting device of the system

Patent metadata

Field	Value
Publication number	US-10462945-B2
Application number	US-201615373909-A
Country	US
Kind code	B2
Filing date	Dec 9, 2016
Priority date	Feb 18, 2016
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

A system for manufacturing an assembly board includes an undersupporting device, a transporter configured to transport a board and the undersupporting device, an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device, a board processor configured to perform a predetermined processing to an upper surface of the board, a carry-in side delivering unit having first and second receiving positions different from each other, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The transporter transports, to the carry-in side delivering unit, the undersupporting device detached from the undersupporting-device installer. The carry-in side delivering unit positions, at the second receiving position, the undersupporting device delivered from the transporter to allow the undersupporting device to be carried out from the second receiving position.

First claim

What is claimed is:

1. A system for manufacturing an assembly board, the system comprising:
an undersupporting device comprising a hollow box with a top board having an upper surface with at least one suction hole therein;
a carrier configured to hold the undersupporting device; a transporter having a pair of conveyors, the transporter configured to transport a board and the undersupporting device;
an undersupporting-device installer provided below the transporter, the undersupporting-device installer having an upper surface with at least one vacuum suction opening that is attachable to and detachable from a bottom surface of the undersupporting device;
a board processor configured to perform a predetermined processing to an upper surface of the board;
a first receiving position and a second receiving position different from the first receiving position, wherein the board is supplied to the first receiving position, and wherein the undersupporting device is supplied to and carried out from the second receiving position;
a working position at which the board processor performs the predetermined processing to the upper surface of the board,
wherein the transporter is configured to deliver the board and the undersupporting device to the working position, wherein the undersupporting device is delivered to the working position by transporting the carrier while the carrier holds the undersupporting device on a lower surface of the carrier
wherein when the board and the undersupporting device are positioned at the working position, the upper surface of the undersupporting device supports a lower surface of the board
the board processor performs the predetermined processing to the upper surface of the board, and the undersupporting device is fixed to the undersupporting-device installer.

2. The system of claim 1 , further comprising:
an elevator mechanism coupled to the undersupporting-device installer to raise and lower the undersupporting-device installer.

3. The system of claim 2 , wherein the elevator mechanism:
raises the undersupporting-device installer to attach the undersupporting device to the carrier; and
lowers the undersupporting-device installer to detach the undersupporting device from the carrier.

4. The system of claim 1 , further comprising:
a vacuum suction mechanism configured to vacuum-suction the undersupporting device toward the undersupporting-device installer.

5. The system of claim 4 ,
wherein the vacuum suction mechanism releases a vacuum-suctioning of the lower surface of the undersupporting device while the undersupporting-device is held by the carrier, and
wherein an elevator mechanism detaches the undersupporting device from the undersupporting-device installer by lowering the undersupporting-device installer while the vacuum suction mechanism releases the vacuum-suctioning of the lower surface of the undersupporting device.

6. The system of claim 1 , wherein the undersupporting device is held on the lower surface of the carrier by a magnetic force.

7. The system of claim 1 , wherein the undersupporting device is secured to the lower surface of the board by suction force when positioned at the working position.

8. The system of claim 1 ,
wherein one of the undersupporting device and the undersupporting-device installer has a projection,
wherein another of the undersupporting device and the undersupporting-device installer has a recess provided therein, and
wherein the undersupporting device is installed to the undersupporting-device installer while the projection is fitted to the recess.

9. The system of claim 1 , wherein the undersupporting device is detached from the undersupporting-device installer when positioned at the second receiving position.

10. A method of installing an undersupporting device to a system for manufacturing an assembly board, comprising:
providing a system for manufacturing an assembly board, the system including
an undersupporting device comprising a hollow box with a top board,
a carrier configured to hold the undersupporting device; a transporter configured to transport a board and the undersupporting device,
an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device,
a base having a first receiving position and a second receiving position different from the first receiving position, and
a board processor configured to perform a predetermined processing to an upper surface of the board while the undersupporting device is fixed to the undersupporting-device installer and the undersupporting device supports a lower surface of the board;

supplying the board to the first receiving position;
supplying the undersupporting device to the second receiving position;
transporting, to a working position, the undersupporting device supplied to the second receiving position by transporting the carrier while the carrier holds the undersupporting device on a lower surface of the carrier;
delivering the undersupporting device detached from the undersupporting-device installer to the second receiving position; and
carrying out, from the second receiving position of the base, the undersupporting device.

11. A system for manufacturing an assembly board, the system comprising:
a base comprising a first receiving position, a second receiving position, a working position, and a carry-out position;
a board supplied to the base at the first receiving position;
an undersupporting device comprising a hollow box with a top board having an upper surface with at least one suction hole for supporting the board, the undersupporting device supplied to the base at the second receiving position, the first receiving position being different from the second receiving position; and a carrier configured to hold the undersupporting device;
wherein the system is configured such that: the board is transported between the first receiving position, the working position, and the carry-out position,
wherein the undersupporting device is transported between the second receiving position and the working position by transporting the carrier while the carrier holds the undersupporting device on a lower surface of the carrier.

12. The system of claim 11 , wherein the undersupporting device has at least one piping connection hole at a lower surface of the undersupporting device.

13. The system of claim 12 , further comprising an undersupporting-device installer positioned at the working position, the undersupporting-device installer having suction piping therein, wherein when the undersupporting device is positioned at the working position, an upper surface of the undersupporting-device installer is coupled to a lower surface of the undersupporting device such that the suction piping is in fluid communication with the at least one piping connection hole.

14. The system of claim 11 , wherein the undersupporting device can be carried out from the base from the second receiving position.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Mantani Masayuki
• Sakaue Takaaki

Classifications

• H05K13/0465

  by soldering (H05K13/0469 takes precedence) · CPC title

• B41F15/26

  for articles with flat surfaces · CPC title

• H05K2203/0165

  Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing · CPC title

• H05K3/1216

  by screen printing or stencil printing · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title