Wiring board manufacturing method and wiring board manufacturing device

Patent metadata

Field	Value
Publication number	US-10462909-B2
Application number	US-201415524128-A
Country	US
Kind code	B2
Filing date	Nov 14, 2014
Priority date	Nov 14, 2014
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

First claim

The invention claimed is:

1. A wiring board manufacturing method comprising:
a resin layer forming step of forming a resin layer by applying a UV-curable resin ink and applying UV light to the applied resin ink;
a wiring layer forming step of forming a wiring layer by applying a conductive ink on the resin layer and applying a laser light or a pulse light including a continuous spectrum to the applied conductive ink;
wherein
the wiring board is manufactured by layer building the resin layer and forming the wiring layer by performing the resin layer forming step and the wiring layer forming step in a predetermined order, and
in a case in which the wiring layer forming step is performed directly after performing the resin layer forming step, during the prior resin layer forming step, the UV light is applied such that an integral light amount is a first integral light amount, and
in a case in which another resin layer forming step is performed consecutively directly after performing the resin layer forming step, during at least a portion of the prior resin layer forming step, the UV light is applied such that the integral light amount is a second integral light amount that is smaller than the first integral light amount.

2. The wiring board manufacturing method according to claim 1 , wherein the UV light is applied for a first application time as the first integral light amount, and the UV light is applied for a second application time that is shorter than the first application time as the second integral light amount.

3. The wiring board manufacturing method according to claim 1 , wherein the UV light is applied with a first UV strength as the first integral light amount, and the UV light is applied for a second UV strength that is weaker than the first UV strength as the second integral light amount.

4. A wiring board manufacturing device for manufacturing a wiring board by performing layer building of a resin layer and forming of a wiring layer, the device comprising:
a first applying means configured to apply a UV-curable resin ink;
a UV light emitting means configured to emit UV light;
a second applying means configured to apply a conductive ink;
a light emitting means configured to emit a laser light or a pulse light including a continuous spectrum; and
a control means configured to perform, in a predetermined order, resin layer forming control for forming the resin layer by applying the resin ink using the first applying means, and applying UV light to the applied resin ink using the UV light emitting means, and wiring layer forming control for forming the wiring layer by applying the conductive ink on the resin layer using the second applying means, and applying laser light or pulse light including a continuous spectrum to the applied conductive ink using the light emitting means.

Assignees

• Fuji Corp

Inventors

• Tsukada Kenji
• Fujita Masatoshi
• Hashimoto Yoshitaka
• Kawajiri Akihiro
• Suzuki Masato

Classifications

• B33Y80/00

  Products made by additive manufacturing · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B29C64/393

  for controlling or regulating additive manufacturing processes · CPC title

• H05K2203/0126

  Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes · CPC title

• B29C64/124

  using layers of liquid which are selectively solidified · CPC title