Light emitting device manufacturing method and apparatus thereof

Patent metadata

Field	Value
Publication number	US-10461139-B2
Application number	US-201816122186-A
Country	US
Kind code	B2
Filing date	Sep 5, 2018
Priority date	Nov 10, 2016
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

A method of manufacturing a light emitting device includes providing a substrate, forming a plurality of photosensitive bumps over the substrate, forming a photosensitive layer over the plurality of photosensitive bumps, forming a buffer layer between the photosensitive layer and the plurality of photosensitive bumps, patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface, disposing an organic emissive layer on the surface, forming a metal containing layer over the organic emissive layer, and removing the patterned photosensitive layer.

First claim

The invention claimed is:

1. A method of manufacturing a light emitting device, comprising:
providing a substrate;
forming a plurality of photosensitive bumps over the substrate;
forming a photosensitive layer over the plurality of photosensitive bumps;
forming a buffer layer between the photosensitive layer and the plurality of photosensitive bumps;
patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface;
disposing an organic emissive layer on the surface,
forming a metal containing layer over the organic emissive layer, and
removing the patterned photosensitive layer.

2. The method of manufacturing a light emitting device in claim 1 , further comprising forming a carrier transportation layer over the metal containing layer.

3. The method of manufacturing a light emitting device in claim 1 , further comprising forming a carrier transportation layer between the metal containing layer and the organic emissive layer.

4. The method of manufacturing a light emitting device in claim 1 , wherein the buffer layer is organic and includes fluorine.

5. The method of manufacturing a light emitting device in claim 1 , further comprising removing a portion of the buffer layer to partially expose the plurality of photosensitive bumps.

6. The method of manufacturing a light emitting device in claim 1 , further comprising forming a first electrode between the substrate and the plurality of photosensitive bumps.

7. The method of manufacturing a light emitting device in claim 6 , wherein the first electrode is partially covered by the plurality of photosensitive bumps.

8. The method of manufacturing a light emitting device in claim 7 further comprising forming a carrier injection layer between the first electrode and the photosensitive layer.

9. A method of manufacturing a light emitting device, comprising:
providing a substrate;
forming a first type carrier transportation layer over the substrate;
forming an organic light emissive layer over the first type carrier transportation layer;
forming a second type carrier transportation layer over the organic light emissive layer;
forming a metallic layer over the organic light emissive layer, and
treating a surface of the metallic layer.

10. The method of manufacturing a light emitting device in claim 9 , wherein forming the metallic layer over the organic light emissive layer is prior to forming the second type carrier transportation layer over the organic light emissive layer.

11. The method of manufacturing a light emitting device in claim 9 , wherein treating a surface of the metallic layer further includes driving a metallic element from the metallic layer into the light emissive layer.

12. The method of manufacturing a light emitting device in claim 9 , wherein treating a surface of the metallic layer further includes driving a metallic element from the metallic layer into the second type carrier transportation layer.

13. The method of manufacturing a light emitting device in claim 9 , further comprising forming a photosensitive layer over the substrate prior to forming the first type carrier transportation layer over the substrate.

14. The method of manufacturing a light emitting device in claim 13 , further comprising forming a recess in the photosensitive layer.

15. A light emitting device, comprising:
a substrate;
a plurality of bumps over the substrate;
a plurality of light emitting units between the plurality of bumps and over the substrate, wherein each light emitting unit includes a first electrode and an organic emissive layer over the first electrode; and
a carrier transportation layer over the plurality of bumps over the substrate and the first electrode and an organic emissive layer,
wherein the carrier transportation layer includes transition metal.

16. The light emitting device in claim 15 , further comprising a first type carrier transportation layer between the substrate and the organic emissive layer.

17. The light emitting device in claim 15 , wherein the light emitting units are classified into three different groups and each group emits a light color different from the others, and only two of the three different groups share a common first type carrier transportation layer.

18. The light emitting device in claim 15 , wherein the light emitting units are classified into three different groups and each group emits a light color different from the others, and only two of the three different groups share a common second type carrier transportation layer.

19. The light emitting device in claim 15 , wherein the light emitting units are classified into three different groups and each group emits a light color different from the others, and only two of the three different groups share a common carrier injection layer.

20. The light emitting device in claim 15 , further comprising a second type carrier transportation layer over the organic emissive layer, wherein the second type carrier is opposite to the first type carrier.

Assignees

• Int Tech Co Ltd

Inventors

• Chen Cheng-Hsin
• Chen Huei-Siou
• Wei Li-Chen

Classifications

• H01L27/3246 Primary

  Electricity · mapped topic

• H01L51/5072

  Electricity · mapped topic

• H01L2251/5338

  Electricity · mapped topic

• H01L51/5056

  Electricity · mapped topic

• H01L51/5088

  Electricity · mapped topic