Acoustic floor underlay system

US10460715B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10460715-B2
Application numberUS-201615542945-A
CountryUS
Kind codeB2
Filing dateJan 12, 2016
Priority dateJan 12, 2015
Publication dateOct 29, 2019
Grant dateOct 29, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A flooring assembly comprising at least one first lofted lapped or airlaid bulk absorber layer 14 for acoustic absorption and compression resistance; at least one impedance layer 16 for one or more of acoustic impedance, compression resistance, and stiffness; at least one second lofted lapped airlaid bulk absorber layer 18 for acoustic absorption and compression resistance; and one or more optional densified fibrous air-flow resistive layers 12, 20.

First claim

Opening claim text (preview).

What is claimed is: 1. A flooring assembly comprising: a) at least one first lofted, lapped, or airlaid bulk absorber layer for acoustic absorption and compression resistance; b) at least one impedance layer for one or more of acoustic impedance, compression resistance, and stiffness; c) at least one second lofted, lapped, or airlaid bulk absorber layer for acoustic absorption and compression resistance; and d) one or more fibrous air-flow resistive layers. 2. The flooring assembly of claim 1 , including 2 or more fibrous air-flow resistive layers. 3. The flooring assembly of claim 1 , including two or more impedance layers for one or more of acoustic impedance, compression resistance, and stiffness. 4. The flooring assembly of claim 1 , wherein at least one of the fibrous air-flow resistive layers is an impedance layer for one or more of acoustic impedance, compression resistance, and stiffness. 5. The flooring assembly of claim 1 including a third lofted, lapped, or airlaid bulk absorber layer for acoustic absorption and compression resistance. 6. The flooring assembly of claim 1 , including an impedance layer located in between and in direct planar contact with the at least one first bulk absorber layer and the at least one second bulk absorber layer. 7. The flooring assembly of claim 1 , including at least two lofted, lapped, or airlaid bulk absorber layers. 8. The flooring assembly of claim 1 , including at least two impedance layers. 9. The flooring assembly of claim 1 , including at least three lofted, lapped, or airlaid bulk absorber layers. 10. The flooring assembly of claim 1 , including at least three impedance layers. 11. A method for forming the flooring assembly of claim 1 comprising: i. locating the first lofted, lapped, or airlaid bulk absorber layer into direct planar contact with a first impedance layer to form a first composite; ii. locating the second lofted, lapped, or airlaid bulk absorber layer into direct planar contact with a second impedance layer to form a second composite; iii. molding the first composite and second composite together to form a final composite. 12. The method of claim 11 , including a step of laminating the first lofted, lapped, or airlaid bulk absorber layer into direct planar contact with the first impedance layer. 13. The method of claim 11 , including a step of laminating the second lofted, lapped, or airlaid bulk absorber layer into direct planar contact with the second impedance layer. 14. The method of claim 11 , including a step of laminating the first composite with the second composite. 15. The method of claim 11 , wherein the method is free of any laminating steps. 16. The method of claim 11 , including locating a third lofted, lapped, or airlaid bulk absorber layer into direct planar contact with a third impedance layer to form a third composite. 17. The method of claim 11 , including molding the first composite, second composite, and a third composite together to form a final composite. 18. The flooring assembly of claim 1 installed as flooring in a transportation vehicle. 19. The flooring assembly of claim 1 , including at least two lofted, lapped, or airlaid bulk absorber layers, at least two impedance layers, and at least one fibrous air-flow resistive layer. 20. The method of claim 11 , including installing the flooring assembly into a transportation vehicle.

Assignees

Inventors

Classifications

  • G10K11/168Primary

    Plural layers of different materials, e.g. sandwiches · CPC title

  • B60R13/083Primary

    for fire walls or floors · CPC title

  • characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)} · CPC title

  • Vehicles · CPC title

  • having particular acoustical properties · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10460715B2 cover?
A flooring assembly comprising at least one first lofted lapped or airlaid bulk absorber layer 14 for acoustic absorption and compression resistance; at least one impedance layer 16 for one or more of acoustic impedance, compression resistance, and stiffness; at least one second lofted lapped airlaid bulk absorber layer 18 for acoustic absorption and compression resistance; and one or more opti…
Who is the assignee on this patent?
Zephyros Inc
What technology area does this patent fall under?
Primary CPC classification G10K11/168. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 29 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).