Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus

Patent metadata

Field	Value
Publication number	US-10458036-B2
Application number	US-201715808466-A
Country	US
Kind code	B2
Filing date	Nov 9, 2017
Priority date	Nov 14, 2016
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.

First claim

What is claimed is:

1. An electroplating method comprising:
setting a substrate, to be plated, on a substrate holder in a substrate attachment and detachment section;
performing a leak checking method comprising:
holding the substrate with the substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed;
pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder;
covering the surface of the substrate, exposed through the opening, the sealing projection with a sealing cap;
forming a hermetic space between the sealing cap and the substrate holder;
introducing a pressurized gas into the hermetic space;
detecting a pressure of the pressurized gas in the hermetic space;
determining whether there is a gas leakage within the hermetic space; and immersing the substrate, held by the substrate holder, in a plating solution; and plating the substrate if no gas leakage is found.

2. The leak checking method according to claim 1 , further comprising:
selecting a pressure command value from a preset pressure range;
sending the selected pressure command value to a pressure regulator; and
regulating the pressure of the pressurized gas in the hermetic space with the pressure regulator based on the pressure command value.

3. The leak checking method according to claim 2 , wherein the pressure range includes a pressure of a plating solution which is expected to be applied to the sealing projection when the substrate, held by the substrate holder, is immersed in the plating solution.

4. The leak checking method according to claim 3 , wherein a lower limit of the pressure range is a value of a pressure of the plating solution which is expected to be applied to an uppermost portion of the sealing projection when the substrate, held by the substrate holder in a vertical position, is immersed in the plating solution.

5. The leak checking method according to claim 3 , wherein an upper limit of the pressure range is a value obtained by multiplying a factor by a value of a pressure of the plating solution which is expected to be applied to a lowermost portion of the sealing projection when the substrate, held by the substrate holder in a vertical position, is immersed in the plating solution.

6. The leak checking method according to claim 1 , wherein forming the hermetic space between the sealing cap and the substrate holder comprises pressing the sealing cap against the substrate holder to form a hermetic space between the sealing cap and the substrate holder.

7. The leak checking method according to claim 1 , further comprising:
pressing a partition seal of the sealing cap against the substrate holder to divide the hermetic space into a first hermetic space and a second hermetic space,
wherein introducing the pressurized gas into the hermetic space comprises supplying the pressurized gas into either the first hermetic space or the second hermetic space,
wherein the sealing projection comprises a first sealing projection, and the second holding member further includes a second sealing projection which contacts the first holding member, and
wherein the first sealing projection and the second sealing projection face the first hermetic space and the second hermetic space, respectively.

8. The electroplating method according to claim 1 , wherein the leak checking method is performed in the substrate attachment and detachment section.

9. An electroplating method comprising:
setting a substrate, to be plated, on a substrate holder in a substrate attachment and detachment section;
performing a leak checking method comprising:
holding the substrate with the substrate holder, the substrate holder including a first holding member and a second holding member, the first holding member having a first opening and a back-side sealing projection, the second holding member having a second opening and a front-side sealing projection;
pressing the front-side sealing projection and the back-side sealing projection against a front surface and a back surface, respectively, of the substrate when holding the substrate with the substrate holder;
covering the front surface of the substrate, exposed through the second opening, and the front-side sealing projection with a front-side sealing cap;
forming a front-side hermetic space between the front-side sealing cap and the substrate holder;
covering the back surface of the substrate, exposed through the first opening, and the back-side sealing projection with a back-side sealing cap;
forming a back-side hermetic space between the back-side sealing cap and the substrate holder;
introducing a pressurized gas into at least one of the front-side hermetic space and the back-side hermetic space; and
detecting a pressure of the pressurized gas in the at least one of the front-side hermetic space and the back-side hermetic space; and
determining whether there is a gas leakage within the at least one of the front-side hermetic space and the back-side hermetic space;
immersing the substrate, held by the substrate holder, in a plating solution; and

plating the substrate if no gas leakage is found.

10. The leak checking method according to claim 9 , further comprising:
selecting a pressure command value from a preset pressure range;
sending the selected pressure command value to a pressure regulator;
and regulating the pressure of the pressurized gas in the front-side hermetic space and/or the back-side hermetic space with the pressure regulator based on the pressure command value.

11. The leak checking method according to claim 10 , wherein the pressure range includes a pressure of a plating solution which is expected to be applied to the front-side sealing projection and the back-side sealing projection when the substrate, held by the substrate holder, is immersed in the plating solution.

12. The leak checking method according to claim 11 , wherein a lower limit of the pressure range is a value of a pressure of the plating solution which is expected to be applied to an uppermost portion of the front-side sealing projection or an uppermost portion of the backside sealing projection when the substrate, held by the substrate holder in a vertical position, is immersed in the plating solution.

13. The leak checking method according to claim 11 , wherein an upper limit of the pressure range is a value obtained by multiplying a factor by a value of a pressure of the plating solution which is expected to be applied to a lowermost portion of the front-side sealing projection or a lowermost portion of the back-side sealing projection when the substrate, held by the substrate holder in a vertical position, is immersed in the plating solution.

Assignees

• Ebara Corp

Inventors

• OGATA Shoichiro
• Kimura Masaaki
• Yahagi Mitsutoshi

Classifications

• H10P72/7606

  characterised by edge clamping, e.g. clamping ring · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/06 Primary

  Suspending or supporting devices for articles to be coated · CPC title