Film-forming apparatus to form a film on a substrate

US10458017B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10458017-B2
Application numberUS-201214440000-A
CountryUS
Kind codeB2
Filing dateNov 5, 2012
Priority dateNov 5, 2012
Publication dateOct 29, 2019
Grant dateOct 29, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A film forming apparatus includes a spray nozzle, a first chamber, a first gas supply port, a second chamber, a through hole, and a mist outlet. A solution transformed into droplets that is to be sprayed from the spray nozzle is housed in the first chamber and transformed into a mist in the first chamber by gas injected from the first gas supply port. The solution in mist form moves from the first chamber through the through hole to the second chamber and is misted onto a substrate from the mist outlet of the second chamber.

First claim

Opening claim text (preview).

The invention claimed is: 1. A film forming apparatus for forming a film on a substrate, comprising: a spray nozzle from which a solution in droplet form is to be sprayed; a first chamber to house said solution in droplet form that is to be sprayed from said spray nozzle; a first gas supply port from which gas is to be injected and caused to collide with said solution housed in said first chamber, said solution in droplet form being transformed into a mist by colliding with said gas injected from said first gas supply port in said first chamber; a second chamber provided adjacent to said first chamber; a through hole that is formed in a wall surface between said first chamber and said second chamber and through which said solution in mist form is led from said first chamber into said second chamber; a mist outlet that is formed in said second chamber to face said substrate provided outside said second chamber and from which said solution in mist form is misted onto said substrate; and a second gas supply port formed in said second chamber, from which gas is to be injected to lead said solution in mist form that is housed in said second chamber to said mist outlet, wherein a cross-sectional area of the second chamber along planes parallel to the substrate is substantially constant from the second gas supply port to the mist outlet. 2. The film forming apparatus according to claim 1 , further comprising: an exhaust port that is formed facing said substrate and adjacent to one side of said mist outlet and through which a fluid is to be exhausted. 3. The film forming apparatus according to claim 2 , further comprising: a third gas supply port that is formed facing said substrate and adjacent to another side of said mist outlet and from which gas is to be injected. 4. The film forming apparatus according to claim 1 , wherein said mist outlet is a rectangular opening. 5. The film forming apparatus according to claim 2 , wherein said exhaust port is a rectangular opening. 6. The film forming apparatus according to claim 3 , wherein said third gas supply port is a rectangular opening. 7. The film forming apparatus according to claim 1 , wherein said spray nozzle is provided through a wall surface of said first chamber, and said wall surface through which said spray nozzle is provided includes a heat regulator to adjust a temperature. 8. The film forming apparatus according to claim 1 , wherein said spray nozzle is movable, and said spray nozzle includes a cleaning liquid supply port from which a cleaning liquid is supplied to a fluid path of said spray nozzle. 9. The film forming apparatus according to claim 1 , further comprising: a substrate placement device on which said substrate is to be placed and that moves in a horizontal direction relative to said mist outlet. 10. The film forming apparatus according to claim 9 , wherein said substrate placement device is configured to heat the substrate. 11. The film forming apparatus according to claim 3 , wherein said solution that reacts with oxygen is sprayed from said spray nozzle, an inert gas is injected from said first gas supply port, an inert gas is injected from said second gas supply port, and an oxidizing agent is injected from said third gas supply port. 12. The film forming apparatus according to claim 1 , wherein said solution that reacts with oxygen is sprayed from said spray nozzle, an inert gas is injected from said first gas supply port, and an oxidizing agent is injected from said second gas supply port.

Assignees

Inventors

Classifications

  • by producing an aerosol and subsequent evaporation of the droplets or particles · CPC title

  • Arrangements for collecting, re-using or eliminating excess spraying material (arrangements integral with nozzles B05B1/28) · CPC title

  • to form intersecting jets · CPC title

  • Slits, e.g. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains (B05B1/046 takes precedence) · CPC title

  • using cleaning fluids · CPC title

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What does patent US10458017B2 cover?
A film forming apparatus includes a spray nozzle, a first chamber, a first gas supply port, a second chamber, a through hole, and a mist outlet. A solution transformed into droplets that is to be sprayed from the spray nozzle is housed in the first chamber and transformed into a mist in the first chamber by gas injected from the first gas supply port. The solution in mist form moves from the fi…
Who is the assignee on this patent?
Toshiba Mitsubishi Elec Ind
What technology area does this patent fall under?
Primary CPC classification C23C16/455. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 29 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).