Silver-bismuth powder, conductive paste and conductive film

Patent metadata

Field	Value
Publication number	US-10458004-B2
Application number	US-201514918948-A
Country	US
Kind code	B2
Filing date	Oct 21, 2015
Priority date	Apr 25, 2013
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.

First claim

What is claimed is:

1. A silver-bismuth powder comprising metals, wherein the metals consist of silver and bismuth,
wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60,
wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.5 μm to 4 μm, and
wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less,
wherein the silver-bismuth powder is configured to form a conductive film when burned at 500° C. or higher.

2. A silver-bismuth powder comprising metals, wherein the metals consist of silver and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 70:30,
wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and
wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less,
wherein the silver-bismuth powder is configured to form a conductive film when burned at 500° C. or higher.

3. The silver-bismuth powder according to claim 1 , wherein the silver-bismuth powder is produced by a water atomization process.

4. A conductive paste, comprising:
a silver-bismuth powder;
a resin;
a glass frit; and
a solvent,
wherein the silver-bismuth powder comprising metals, wherein the metals consists of silver and bismuth,
wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60,
wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and
wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less,
wherein the conductive paste is configured to form a conductive film when burned at 500° C. or higher.

5. The conductive paste according to claim 4 , wherein a softening point of the glass frit is 400° C. to 600° C.

6. The silver-bismuth powder according to claim 2 , wherein the silver-bismuth powder is produced by a water atomization process.

Assignees

• Dowa Electronics Materials Co Ltd

Inventors

• Ogi Kozo
• Inoue Kenichi
• Ebara Atsushi
• Asano Akihiro
• Fujimoto Hideyuki
• Yamada Takahiro

Classifications

• B22F1/052

  characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

• B22F9/08

  by casting, e.g. through sieves or in water, by atomising or spraying (using electric discharge B22F9/14) · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• H05K2203/1126

  Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents · CPC title