Method and apparatus for scoring thin glass and scored thin glass
US-2016185647-A1 · Jun 30, 2016 · US
US10456939B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10456939-B2 |
| Application number | US-201815869966-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 12, 2018 |
| Priority date | Jul 23, 2012 |
| Publication date | Oct 29, 2019 |
| Grant date | Oct 29, 2019 |
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A cell cutting device that cuts a mother substrate for display devices includes a fixing unit configured to move in a state where the mother substrate for display devices is fixed on the fixing unit, a cutter configured to perform a cutting process on the mother substrate for display devices and the cutter faces a surface of the mother substrate during the cutting process, a cutter driving unit driving the cutter in a state where the cutter is fixed thereon, and a buffer member arranged on another surface of the mother substrate to correspond to the cutter. The other surface is opposite the surface facing the cutter.
Opening claim text (preview).
What is claimed is: 1. A cell cutting device for cutting a mother substrate for display devices that includes a plurality of cells, the cell cutting device comprising: a fixing unit configured to have the mother substrate fixed thereto during a cutting process, and configured to move the mother substrate in a first direction during the cutting process; a cutter configured to cut the mother substrate in a second direction that is a cutting direction of the mother substrate, the cutter facing a first surface of the mother substrate during the cutting process; a cutter driving unit fixed to the cutter, the cutter driving unit being configured to drive the cutter during the cutting process; a buffer member arranged facing a second surface of the mother substrate, opposite the first surface, the buffer member being positioned to correspond to the cutter during the cutting process; and a support member arranged on an opposite side of the buffer member from the second surface of the mother substrate such that the buffer member is interposed between the second surface of the mother substrate and the support member during the cutting process, wherein: a portion of the support member that faces the buffer member has a width in the first direction that is smaller than a width of the mother substrate in the first direction, and the buffer member has a width in the cutting direction that is equal to or greater than a width of the cutter in the cutting direction. 2. The cell cutting device of claim 1 , wherein the fixing unit includes: a plurality of fixing members that fix the mother substrate, and a plurality of elongated connecting members connected to the fixing members, respectively. 3. The cell cutting device of claim 1 , wherein the cutter is attached to a lower surface of the cutter driving unit, the cutter driving unit being configured to move the cutter linearly in a thickness direction of the mother substrate. 4. The cell cutting device of claim 1 , wherein the fixing unit is on a stage, the stage being linearly movable along the driving axis. 5. The cell cutting device of claim 1 , wherein the fixing unit is on a stage, the stage being rotatably controlled by the rotary driving unit. 6. The cell cutting device of claim 1 , further comprising alignment cameras adjacent to the cutter to identify an alignment state of the cutter and the mother substrate. 7. The cell cutting device of claim 6 , wherein the alignment cameras are adjacent to opposite sides of the mother substrate. 8. The cell cutting device of claim 6 , wherein the mother substrate includes an alignment mark thereon, and the alignment cameras identify the alignment state of the cutter and the mother substrate with the alignment mark. 9. The cell cutting device of claim 6 , wherein the alignment cameras include a first camera and a second camera, the second camera being closer to the cutter than the first camera, the first camera firstly identifying the alignment state of the cutter and the mother substrate, and the second camera secondly identifying the alignment state of the mother substrate. 10. The cell cutting device of claim 9 , wherein an alignment identifying accuracy of the second camera is higher than an alignment identifying accuracy of the first camera. 11. The cell cutting device of claim 1 , further comprising alignment members facing sides of the mother substrate. 12. The cell cutting device of claim 11 , wherein the alignment members include a servo motor to compress at least one of the sides of the mother substrate so as to control movement of the mother substrate. 13. The cell cutting device of claim 11 , wherein the alignment members face opposite sides of the mother substrate. 14. The cell cutting device of claim 1 , wherein the buffer member is supplied roll-to-roll by using a supply roll and a recovery roll. 15. The cell cutting device of claim 14 , further comprising a tension-maintaining member between the supply roll and the recovery roll that maintains a tension of the buffer member. 16. The cell cutting device of claim 1 , wherein the cutter has a length that is at least equal to or greater than a width of the mother substrate in the cutting direction. 17. The cell cutting device of claim 1 , wherein the plurality of cells on the mother substrate correspond to a plurality of flexible display devices. 18. The cell cutting device of claim 1 , wherein the plurality of cells on the mother substrate correspond to a plurality of organic light-emitting display devices.
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