Method of profile heatsealing

US10456291B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10456291-B2
Application numberUS-201715493702-A
CountryUS
Kind codeB2
Filing dateApr 21, 2017
Priority dateDec 20, 2013
Publication dateOct 29, 2019
Grant dateOct 29, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This application relates to a method of covering a pessary device for relief of female incontinence with an overwrap. More particularly, the present invention relates to methods of conforming the overwrap to the pessary device using a sealing mechanism.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of conforming an overwrap to a pessary device, the method comprising: a. providing a pessary device comprising a longitudinal axis, a transverse axis, and an outer surface; b. providing an overwrap material; c. prior to contacting the overwrap material with a profile sealing tool, placing a portion of the overwrap material under tension; d. placing the pessary device in contact with the overwrap material along a first side of the pessary device, and placing the pessary device in contact with the overwrap material along a second side of the pessary device opposing the first side, wherein the overwrap material covers at least a portion of the pessary device outer surface area; e. contacting the overwrap material with the sealing tool, joining the overwrap material to itself and forming part of the final overwrap; and f. removing the sealing tool. 2. The method of claim 1 , wherein the sealing tool creates a heat seal. 3. The method of claim 1 , wherein the sealing tool creates a seal comprising one or more bonds. 4. The method of claim 3 , wherein the one or more bonds is created by heat, the use of adhesives, the use of friction, the use of mechanical means, and/or combinations thereof. 5. The method of claim 1 , wherein the sealing tool forms a profile seal comprising bonds that have a point diameter between 0.5 mm to 2 mm. 6. The method of claim 1 , wherein joining the overwrap to itself occurs with heat sealing at a temperature between 135° C. to 200° C. 7. The method of claim 1 , wherein a bond is created by heat, the use of adhesives, the use of friction, the use of mechanical means, and/or combinations thereof. 8. The method of claim 1 , wherein the profile sealing tool comprises an additional component that maintains a temperature below the melt temperature of the overwrap. 9. A method of conforming an overwrap to a pessary device, the method comprising: a. providing a pessary device comprising a longitudinal axis, a transverse axis, and an outer surface; b. providing an overwrap material; c. placing the pessary device in contact with the overwrap, wherein the overwrap material covers at least a portion of the pessary device outer surface area; and d. manipulating the overwrap material to conform to the pessary device using a profile seal; wherein manipulating the overwrap material to conform to the pessary device using a profile seal further comprises: a. placing a portion of the overwrap material under tension; b. contacting the overwrap material with a sealing mechanism, joining the overwrap material to itself on opposing sides of the device and forming part of a final overwrap; and c. removing the sealing mechanism. 10. The method of claim 9 , wherein the profile seal comprises bonds that have a point diameter between 0.5 mm to 2 mm. 11. The method of claim 9 , wherein the overwrap material is elastic. 12. The method of claim 9 , wherein joining the overwrap material to itself occurs with heat sealing at a temperature between 135° C. to 200° C. 13. The method of claim 9 , wherein the sealing mechanism consists of a profile sealing mold. 14. The method of claim 9 , wherein the sealing mechanism creates a seal comprising one or more bonds. 15. The method of claim 14 , wherein the one or more bonds is created by heat, the use of adhesives, the use of friction, the use of mechanical means, and/or combinations thereof.

Assignees

Inventors

Classifications

  • Medical equipment, e.g. bandage, prostheses or catheter · CPC title

  • by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith · CPC title

  • A61F6/08Primary

    Pessaries, i.e. devices worn in the vagina to support the uterus, remedy a malposition or prevent conception {, e.g. combined with devices protecting against contagion} · CPC title

  • Figure-8-shaped, e.g. hourglass-shaped · CPC title

  • Designing or manufacturing processes · CPC title

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Frequently asked questions

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What does patent US10456291B2 cover?
This application relates to a method of covering a pessary device for relief of female incontinence with an overwrap. More particularly, the present invention relates to methods of conforming the overwrap to the pessary device using a sealing mechanism.
Who is the assignee on this patent?
Procter & Gamble
What technology area does this patent fall under?
Primary CPC classification A61F6/08. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Oct 29 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).