Rack enclosure with perforations for cooling

US10455741B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10455741-B2
Application numberUS-201515564826-A
CountryUS
Kind codeB2
Filing dateApr 17, 2015
Priority dateApr 17, 2015
Publication dateOct 22, 2019
Grant dateOct 22, 2019

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present examples include a rack enclosure with perforations formed within vertical rack columns. Front vertical rack columns may include front perforations formed therein. The front perforations may draw air into the rack enclosure and further into a chassis. Side plenums along the side surface of the chassis may consume less space with the use of the front perforations. The space not consumed by the side plenums may be available to accommodate a chassis of a substantial volume. The chassis may expand a substantial width of the rack enclosure to house an enlarged or a maximum number of computing components within the rack enclosure.

First claim

Opening claim text (preview).

What is claimed is: 1. A rack enclosure, comprising: a rack comprising vertical rack columns, including a front vertical rack column, and rack panels; perforations formed in the front vertical rack column, a chassis mounted in the rack, the chassis housing heat-producing components, the chassis having a side surface with openings therein; a vertical barrier extending between the side surface of the chassis and one of the rack panels; a side plenum bounded by the side surface of the chassis, one of the rack panels, the vertical barrier, and the front vertical rack column such that, when air flows: from outside the rack enclosure into the front vertical rack column via the perforations; from the front vertical rack column into the side plenum; and from the side plenum into the chassis via the openings in the chassis. 2. The rack enclosure of claim 1 , wherein the side plenums comprise a space between the side surface of the chassis and one of the rack panels, wherein the width of the space is 0.1 inches to 0.2 inches. 3. The rack enclosure of claim 1 , wherein the vertical barrier prevents a mixing of the air in the side plenums with heated air exhausted from the chassis. 4. The rack enclosure of claim 1 , wherein the vertical barrier blocks heated air exhausted from the chassis from flowing into the plurality of openings. 5. A method of cooling heat-producing components, comprising: causing air to flow from outside a rack enclosure into a front vertical rack column of a rack of the rack enclosure via perforations formed in the front vertical rack column, causing the air to flow from the front vertical rack column into a side plenum of the rack enclosure the side plenum being bounded by a side surface of a chassis mounted in the rack, a side panel of the rack, a vertical barrier extending between the side surface of the chassis and the side panel of the rack, and the front vertical rack column: causing the air to flow from the side plenum into the chassis via openings in the side surface of the chassis: and causing the air to be exhausted from a rear of the chassis after being heated in the chassis. 6. The method of claim 5 , wherein the perforations are on a front-face and a side-face of the front vertical rack column. 7. The method of claim 5 , wherein a width of the plenum space between the side rack panel and the chassis is 0.1 inches to 0.2 inches. 8. A method comprising: providing a rack comprising rack panels including a side rack panel and vertical rack columns including a front vertical rack column comprising perforations; mounting a chassis inside the rack such that there is a plenum space between the side rack panel and a side surface of the chassis, wherein the side surface of the chassis comprises openings to allow for air flow into the chassis; and sealing a vertical barrier between the side rack panel and the side surface of the chassis such that air is directed to flow: from outside the rack into the front vertical rack column via the perforations; from the front vertical rack column into the plenum space; and from the plenum space into the chassis via the openings in the side chassis; wherein the vertical barrier inhibits communication of air between the plenum space and a rear side of the rack enclosure.

Assignees

Inventors

Classifications

  • within cabinets for removing heat from server blades · CPC title

  • Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

  • within cabinets for removing heat from sub-racks, e.g. plenum · CPC title

  • Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures · CPC title

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Frequently asked questions

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What does patent US10455741B2 cover?
The present examples include a rack enclosure with perforations formed within vertical rack columns. Front vertical rack columns may include front perforations formed therein. The front perforations may draw air into the rack enclosure and further into a chassis. Side plenums along the side surface of the chassis may consume less space with the use of the front perforations. The space not consu…
Who is the assignee on this patent?
Hewlett Packard Entpr Dev Lp
What technology area does this patent fall under?
Primary CPC classification H05K7/20736. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).