Resin board structure and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-10455701-B2
Application number	US-201815907366-A
Country	US
Kind code	B2
Filing date	Feb 28, 2018
Priority date	Oct 2, 2015
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A resin board structure includes a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, and a second member including a second metal film. The first and second metal films are bonded together, and at least a portion the first metal film and at least a portion of the second metal film overlap each other. The first and second metal films are metallurgically bonded at an interface between the first metal film and the second metal film. The first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other, and the first junction resin covering portion includes an uneven surface to reduce or prevent slippage due to ultrasonic vibration.

First claim

What is claimed is:

1. A resin board structure comprising:
a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers; and
a second member including a second metal film; wherein
the first metal film and the second metal film are bonded together, at least a portion of the first metal film and at least a portion of the second metal film overlap each other, the first metal film and the second metal film being metallurgically bonded at an interface between the first metal film and the second metal film;
the first member includes a first junction resin covering portion including a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other;
the first junction resin covering portion includes an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration;
the second member includes a second junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other; and
the second junction resin covering portion includes an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration.

2. The resin board structure according to claim 1 , wherein the first junction resin covering portion is thinner than any other portions of the first member.

3. The resin board structure according to claim 1 , wherein
the second member includes one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers; and
the first member and the second member are welded together at a contact portion between thermoplastic resin layers.

4. The resin board structure according to claim 1 , wherein the second member is a motherboard.

5. The resin board structure according to claim 1 , further comprising a first protective film provided over a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration.

6. The resin board structure according to claim 1 , further comprising:
a first protective film provided over a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration; and
a second protective film provided over a surface of the second junction resin covering portion, the second protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration.

7. A resin board structure comprising:
a first member including a first metal film and including one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers; and
a second member including a second metal film; wherein
the first metal film and the second metal film are bonded together, at least a portion of the first metal film and at least a portion of the second metal film overlap each other, the first metal film and the second metal film being metallurgically bonded at an interface between the first metal film and the second metal film;
the first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other;
a first protective film is provided over a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration;
the second member includes a second junction resin covering portion including a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other; and
the second junction resin covering portion includes an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration.

8. The resin board structure according to claim 7 , wherein the second member is a motherboard.

9. The resin board structure according to claim 7 , wherein
a second protective film is provided over a surface of the second junction resin covering portion, the second protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration.

10. The resin board structure according to claim 2 , wherein the first junction resin covering portion is thinner than any other portions of the first member.

11. A method for fabricating a resin board structure, the method comprising:
preparing a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, the first member including a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping the first metal film, the first junction resin covering portion including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration;
preparing a second member including a second metal film;
disposing the first member and the second member such that at least a portion of the first metal film and at least a portion of the second metal film are in contact with each other and overlap each other; and
bonding the first metal film and the second metal film together by application of relative ultrasonic vibration between the first metal film and the second metal film.

12. The method according to claim 11 , wherein the first junction resin covering portion is thinner than any other portions of the first member.

13. The method according to claim 11 , wherein
the second member includes one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers; and
bonding the first metal film and the second metal film together bonds the first member and the second member together by welding at a contact portion between thermoplastic resin layers.

14. The method according to claim 11 , wherein the second member is a motherboard.

15. A method for fabricating a resin board structure, the method comprising:
preparing a first member including a first metal film and including one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, the first member including a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping the first metal film;
preparing a second member having a second metal film;
disposing the first member and the second member such that at least a portion of the first metal film and at least a portion of the second metal film are in contact with each other and overlap each other; and
bonding the first metal film and the second metal film together by application of relative ultrasonic vibration between the first metal film and the second metal film; wherein
the first member includes a first protective film covering a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration.

16. The method according to claim 15 , wherein the first junction resin covering portion is thinner than any other portions of the first member.

17. The method according to claim 15 , wherein the second member is prepared to further include one thermoplastic re

Assignees

• Murata Manufacturing Co

Inventors

• Otsubo Yoshihito
• Minami Masaaki

Classifications

• B32B5/145

  Variation across the thickness of the layer · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2250/44

  Number of layers variable across the laminate · CPC title

• B32B3/06

  for securing layers together; for attaching the product to another member, e.g. to a support {, or to another product, e.g. groove/tongue, interlocking} · CPC title

• B32B27/06

  as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title