Electrically conducting assemblies

US10455696B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10455696-B2
Application numberUS-201414917172-A
CountryUS
Kind codeB2
Filing dateSep 5, 2014
Priority dateSep 6, 2013
Publication dateOct 22, 2019
Grant dateOct 22, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process and to uses of said multilayer assembly in various applications.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process for the manufacture of a multilayer assembly, said process comprising: applying a patterned layer (LMP) of at least one patterned substrate directly onto a non-patterned layer (LMT) of at least one non-patterned substrate, thereby providing a multilayer assembly, wherein: (1) the at least one patterned substrate is obtained by a process comprising: printing a liquid composition (L1) comprising at least one first metal compound (M1) onto at least one surface of an optically transparent substrate layer (LT-1) having an outer surface and an inner surface to form a patterned layer (LMP), thus providing a patterned substrate, optionally, contacting the patterned layer (LMP) with a liquid composition (L2) comprising at least one second metal compound (M2), said compound (M2) being equal to or different from the compound (M1), and drying the patterned substrate, optionally contacted with composition (L2), at a temperature of at least 50° C.; and wherein (2) the at least one non-patterned substrate is obtained by a process comprising: optionally, treating by a radio-frequency glow discharge process in the presence of an etching gas, at least one surface of an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, said layer (LT-2) being equal to or different from layer (LT-1), contacting optionally treated layer (LT-2) with a liquid composition (L3) comprising at least one optically transparent metal compound (M ot ), to form an optically transparent non-patterned layer (LMT), thus providing a non-patterned substrate, and drying the non-patterned substrate at a temperature of at least 50° C. 2. The process according to claim 1 , wherein compound (M ot ) is a metal oxide selected from the group consisting of: impurity-doped ZnO, In 2 O 3 , SnO 2 and CdO, ternary metal oxide compounds, and multi-component metal oxides consisting of combinations of ZnO, In 2 O 3 and SnO 2 . 3. The process according to claim 2 , wherein compound (M ot ) is a metal oxide selected from the group consisting of Sn-doped ZnO, Sn-doped In 2 O 3 , Sn-doped CdO, Zn 2 SnO 4 , ZnSnO 3 , Zn 2 In 2 O 5 , Zn 3 In 2 O 6 , In 2 SnO 4 , and CdSnO 3. 4. The process according to claim 1 , wherein layer (LT-2) is contacted with composition (L3) by electroless plating techniques. 5. The process according to claim 1 , wherein compound (M1) is selected from the group consisting of Rh, Ir, Ru, Ti, Re, Os, Cd, Tl, Pb, Bi, In, Sb, Al, Ti, Cu, Ni, Pd, V, Fe, Cr, Mn, Co, Zn, Mo, W, Ag, Au, Pt, Ir, Ru, Pd, Sn, Ge, Ga, alloys thereof and derivatives thereof. 6. The process according to claim 1 , wherein composition (L1) is printed by screen, gravure, flexo or ink-jet printing techniques. 7. The process according to claim 1 , wherein compound (M2) is selected from the group consisting of Rh, Ir, Ru, Ti, Re, Os, Cd, Tl, Pb, Bi, In, Sb, Al, Ti, Cu, Ni, Pd, V, Fe, Cr, Mn, Co, Zn, Mo, W, Ag, Au, Pt, Ir, Ru, Pd, Sn, Ge, Ga, alloys thereof and derivatives thereof. 8. The process according to claim 1 , wherein layer (LMP) is contacted with composition (L2) by electroplating or electroless plating techniques. 9. A process for the manufacture of a multilayer assembly, said process comprising: printing a liquid composition (L1) comprising at least one first metal compound (M1) onto an optically transparent substrate layer (LT-1) having an outer surface and an inner surface, wherein layer (LT-1) is a non-patterned substrate comprising: an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, and an optically transparent non-patterned layer (LMT) made of at least one optically transparent metal compound (M ot ) directly adhered onto at least one surface of layer (LT-2), and wherein said at least one surface of layer (LT-2) is optionally treated by a radio-frequency glow discharge process in the presence of an etching gas, wherein the liquid composition (L1) is printed directly on the surface of layer (LMT) that is opposite to layer (LT-2), to form a patterned layer (LMP), optionally, contacting patterned layer (LMP) with a liquid composition (L2) comprising at least one second metal compound (M2), said compound (M2) being equal to or different from the compound (M1), and drying the patterned substrate, optionally contacted with composition (L2), at a temperature of at least 50° C. 10. The process according to claim 9 , wherein the non-patterned substrate is obtained by a process comprising: optionally, treating by a radio-frequency glow discharge process in the presence of an etching gas, at least one surface of an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, contacting optionally treated layer (LT-2) with a liquid composition (L3) comprising at least one optically transparent metal compound (M ot ), to form an optically transparent non-patterned layer (LMT), thus providing a non-patterned substrate, and drying the non-patterned substrate at a temperature of at least 50° C.

Assignees

Inventors

Classifications

  • Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title

  • C08J7/06Primary

    with compositions not containing macromolecular substances · CPC title

  • at least one coating being a coating of an organic material · CPC title

  • by plasma etching · CPC title

  • Screens or stencils; Holders therefor · CPC title

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What does patent US10455696B2 cover?
The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process and to uses of said multilayer assembly in various applications.
Who is the assignee on this patent?
Solvay Specialty Polymers It
What technology area does this patent fall under?
Primary CPC classification C08J7/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).