Component with component reinforcement and feedthrough

Patent metadata

Field	Value
Publication number	US-10454079-B2
Application number	US-201514938410-A
Country	US
Kind code	B2
Filing date	Nov 11, 2015
Priority date	Nov 11, 2014
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A component has a component thickness and at least one feedthrough opening, wherein a conductor, such as a substantially pin-shaped conductor, is inserted through the feedthrough opening in a glass or glass ceramic material having a glass material outside dimension and a glazed length, wherein the component has a reinforcement in the region of the feedthrough opening with a component feedthrough opening thickness, wherein the component feedthrough opening thickness is greater than the component thickness and wherein the reinforcement has a reinforcement material outside dimension.

First claim

What is claimed is:

1. A device, comprising:
a component having a component thickness and at least one feedthrough opening and defining a region of said feedthrough opening, said component having a reinforcement in said region that has a component feedthrough opening thickness that is greater than said component thickness and a single reinforcement material outside dimension; and
a conductor inserted through said feedthrough opening in one of a glass material and a glass ceramic material having a glass material outside dimension and a glazed length and wherein said one of said glass material and said glass ceramic material contacts said component at said at least one feedthrough opening, wherein said single reinforcement material outside dimension is in a range of 1.2 to 2.2 times said glass material outside dimension.

2. The device according to claim 1 , wherein said conductor is a substantially pin-shaped conductor.

3. The device according to claim 1 , wherein said component feedthrough opening thickness of said reinforcement is consistent with said glazed length.

4. The device according to claim 1 , wherein said component comprises a base body having said component thickness and a separate reinforcement component having a reinforcement component thickness, said reinforcement component thickness and said component thickness adding up to equal said component feedthrough opening thickness.

5. The device according to claim 1 , wherein said component comprises a base body having said component thickness and a reinforcement component forming a single component with said base body, wherein said component feedthrough opening thickness is provided in said region of said component feedthrough opening.

6. The device according to claim 1 , wherein said glazing length is greater than 1.5 mm.

7. The device according to claim 1 , wherein said glazing length is in a range of 1.5 mm to 8 mm.

8. The device according to claim 1 , wherein said component thickness is at least as large as said glazing length.

9. The device according to claim 8 , wherein said component thickness is equal to said glazing length plus 2 mm.

10. The device according to claim 9 , wherein said component thickness is in a range of 3.5 mm to 10 mm.

11. The device according to claim 1 , wherein said component includes at least partially a light metal having at least one of a specific weight of <5 kg/dm 3 , a melting point in a range of 350° C. to 800° C., an electric conductivity in a range of 5·10 6 S/m to 50·10 6 S/m, and a coefficient of expansion α (20° C. to 300° C.) in a range of 18·10 −6 / K to 30·10 −6 / K.

12. The device according to claim 11 , wherein said light metal is one of aluminum, an aluminum alloy, magnesium, a magnesium alloy, titanium or a titanium alloy.

13. The device according to claim 1 , wherein said device is a housing.

14. The device according to claim 13 , wherein said housing is a part of at least one of an electric storage device, a battery, and a capacitor.

15. The device according to claim 1 , wherein said component forms a housing cover.

Assignees

• Schott Ag

Inventors

• Hartl Helmut

Classifications

• H01G2/10

  Housing; Encapsulation · CPC title

• H01G2/103

  Sealings, e.g. for lead-in wires; Covers · CPC title

• H01G9/10 Primary

  Sealing, e.g. of lead-in wires · CPC title

• H01G11/78

  Cases; Housings; Encapsulations; Mountings · CPC title

• H01G11/80

  Gaskets; Sealings · CPC title